Group 1 - Semiconductor stocks are rising in line with the market, with notable increases in shares of Huahong Semiconductor (up 6.07%), ASMPT (up 4.56%), Horizon Robotics (up 4.39%), and others [1][1][1] - Samsung Electronics and SK Hynix plan to increase server DRAM prices by 60% to 70% in Q1 2026 compared to Q4 2025, with similar price hikes proposed for PC and smartphone DRAM customers [1][1][1] - The National Integrated Circuit Fund's stake in SMIC's H-shares increased from 4.79% to 9.25% as of December 29, 2025, indicating growing confidence in the semiconductor sector [1][1][1] Group 2 - Guotai Junan states that with the global semiconductor cycle bottoming out and domestic policy and funding support, leading manufacturers like SMIC are expected to experience a recovery in both performance and valuation [1][1][1] - Dongxing Securities highlights the exponential growth in computing power demand driven by generative AI, suggesting a focus on semiconductor storage, testing equipment, and magnetic components as key investment areas [1][1][1]

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 | 截至月份: | 2025年12月31日 | | | | 狀態: 新提交 | | --- | --- | --- | --- | --- | --- | | 致：香港交易及結算所有限公司 | | | | | | | 公司名稱: | ASMPT Limited | | | | | | 呈交日期: | 2026年1月2日 | | | | | | I. 法定/註冊股本變動 | | | | | | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 (註1) | 是 | | 證券代號 (如上市) | 00522 | 說明 | | | | | | 法定/註冊股份數目 | | 面值 | | 法定/註冊股本 | | | --- | --- | --- | --- | --- | --- | --- | | 上月底結存 | | 500,000,000 HKD | | 0.1 | HKD | 50,000,000 | | 增加 / 減少 (-) | | | | | HKD | | | 本月底結存 | | 500,000 ...

本文源自：金融界AI电报 港股半导体概念股集体走强，华虹半导体涨近10%，芯智控股涨近5%，中芯国际涨超4%，中电华大科 技、ASMPT涨超3%。 ...

本文源自：金融界AI电报 据香港交易所披露，贝莱德（BlackRock）对ASMPT Ltd.的多头持仓比例于2025年12月26日从4.99%增 至5.05%。 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 JTC (Cayman) Limited P.O. Box 30745 60 Nexus Way 6th Floor, Camana Bay Grand Cayman KY1-1203 Cayman Islands 承董事會命 ASMPT Limited 公司秘書 江俊 香港，二零二五年十二月二十三日 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行董事：黃梓达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） ASMPT LIMITED （於開曼群島註冊成立之有限公司） （股份代號：0522） 更改於開曼群島的註冊辦事處地址 ASMPT Limited（ ...

每经AI快讯，ASMPT(00522.HK)早盘涨超4%，截至发稿，涨4.03%，报77.35港元，成交额3157.47万港 元。 （文章来源：每日经济新闻） ...

Core Viewpoint - ASMPT's stock rose over 4% following SK Hynix's order for new thermal compression bonding machines to support HBM4 production, indicating strong demand for advanced semiconductor manufacturing equipment [1] Group 1: Company Developments - SK Hynix has placed an order with ASMPT for a batch of new thermal compression bonding machines (TCB) to enhance HBM4 production [1] - Last month, SK Hynix ordered 7 sets of TCB systems from ASMPT, each equipped with two bonding heads, with a unit price of approximately 4 billion KRW, leading to a total contract value of around 30 billion KRW (approximately 150 million RMB) [1] Group 2: Industry Context - The decision by SK Hynix to order from ASMPT is influenced by ongoing patent disputes between local suppliers Hanmi Semiconductor and Hanwha Semiconductor, which have caused internal conflicts [1] - SK Hynix plans to order an additional 100 sets of TCB machines for HBM4 by March 2026 to support the expansion of its Cheongju M15X wafer fab, indicating a significant future demand for bonding equipment [1] - The competition for orders among ASMPT, Hanmi, and Hanwha is expected to intensify, especially if the Korean suppliers do not resolve their patent issues promptly, potentially allowing ASMPT to increase its market share or even dominate HBM4 equipment supply [1]

Core Viewpoint - ASMPT's stock rose over 4% following a significant order from SK Hynix for new thermal compression bonding machines to support HBM4 production, indicating strong demand for advanced semiconductor manufacturing equipment [1] Group 1: Company Developments - SK Hynix has placed an order for a batch of new thermal compression bonding machines (TCB) from ASMPT to enhance HBM4 production [1] - Last month, SK Hynix ordered seven TCB systems from ASMPT, each equipped with two bonding heads, with a unit price of approximately 4 billion KRW, leading to a total contract value of around 30 billion KRW (approximately 150 million RMB) [1] - SK Hynix plans to order an additional 100 TCB machines for HBM4 by March 2026 to support the expansion of its Cheongju M15X wafer fab [1] Group 2: Industry Context - The decision by SK Hynix to source equipment from ASMPT is influenced by ongoing patent disputes between local suppliers Hanmi Semiconductor and Hanwha Semiconductor, which have led to internal conflicts [1] - If the Korean manufacturers do not resolve their patent issues promptly, ASMPT may further increase its market share and potentially dominate the supply of HBM4 equipment [1]

Group 1 - Chip stocks showed strength in early trading, with notable increases: SMIC (00981) up 4.23% to HKD 67.75, InnoCare (02577) up 3.31% to HKD 73.45, Hua Hong Semiconductor (01347) up 3.25% to HKD 69.95, and ASMPT (00522) up 2.82% to HKD 76.45 [1] - Recent changes in the ownership structure of Anji Liwei have attracted attention, with the original shareholder, Anji Electronics, officially exiting, while new shareholders including the National Integrated Circuit Industry Investment Fund (Phase III) and local investment groups have joined [1] - The entry of the National Fund Phase III is seen as a recognition of the company's technological capabilities in the field of packaging substrates, which are critical for connecting chips to PCBs, characterized by high technical barriers and low domestic production rates [1] Group 2 - The National Fund Phase III, established as a national capital platform for the semiconductor industry, focuses on advanced manufacturing, high-end chip design, critical materials/equipment, and third-generation semiconductors, emphasizing "strengthening the chain and supplementing the chain" and "industry chain collaboration" [1] - The investment from the National Fund and local state-owned assets in Anji Liwei is expected to accelerate the company's high-end substrate production capacity and technological iteration, addressing domestic gaps in the market [1]

Group 1 - Chip stocks showed strength in early trading, with notable gains from companies such as SMIC (up 4.23% to HKD 67.75), Innoscience (up 3.31% to HKD 73.45), Hua Hong Semiconductor (up 3.25% to HKD 69.95), and ASMPT (up 2.82% to HKD 76.45) [1] - The recent industrial change at Anji Li Meiwai has attracted attention, as the original shareholder, Anji Electronics Industry Co., Ltd., has officially exited, while new shareholders including the National Integrated Circuit Industry Investment Fund (Phase III) and Guangzhou Industrial Investment Holding Group have joined [1] - The entry of the National Fund Phase III is seen as a recognition of the company's technological strength in the field of packaging substrates, which are critical carriers connecting chips to PCBs, characterized by high technical barriers and low domestic production rates [1] Group 2 - The National Fund Phase III is a national capital platform established for the semiconductor industry, following the first and second phases in 2014 and 2019, respectively, focusing on advanced manufacturing, high-end chip design, critical materials/equipment, and third-generation semiconductors [1] - The collaboration between the National Fund Phase III and local state-owned assets in investing in Anji Li Meiwai is expected to accelerate the construction of high-end substrate production capacity and technological iteration, filling domestic gaps in this area [1]