致：香港交易及結算所有限公司 公司名稱: 建滔積層板控股有限公司 股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2026年1月31日 狀態: 新提交 呈交日期: 2026年2月3日 I. 法定/註冊股本變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 01888 | 說明 | | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 20,000,000,000 | HKD | | 0.1 | HKD | | 2,000,000,000 | | 增加 / 減少 (-) | | | | | | | HKD | | | | 本月底結存 | | | 20,000,000,000 | HKD | | 0.1 | HKD | | 2,000,000,000 | 本月底 ...

历史复盘：周期1（16Q1-18Q2），上游强涨价+需求复苏推动，铜、电子布、树脂分别最大上涨69%、100%+、 64%，FR4覆铜板涨价68%，龙头厂商建滔积层板毛利率提升13ppts至30%；周期2（19Q1-21Q4），上游强涨价+需 求强增长推动，叠加疫情下的抢货潮，铜、电子布、树脂分别最大上涨130%、157%、70%，FR4覆铜板涨价 129%，龙头厂商建滔积层板毛利率提升10ppts至34%。 本轮周期（23Q1至今）：上游涨价+AI需求爆发拉动：1）上游，铜价已创新高（+65%至1.3万元/吨，此前最高至1 万元/吨），2）下游，需求侧AI相关增长显著，高端覆铜板缺货挤占传统产能，26年行业稼动率有望提升至8成， 龙头则有望持续满产，3）格局，行业24年行业CR10已自22年的74%提升至77%，持续集中。 我们判断本轮周期覆铜板毛利率有望接近/超越此前周期，当前覆铜板涨价滞后铜涨价，毛利率潜力尚未释放，看 好后续行业价格及毛利率提升的弹性。 投资观点：1）涨价视角：看好26H1覆铜板持续涨价，有望上涨20%+至170-190元/张。 【中信电子】CCL行业深度跟踪：覆铜板有望持续涨价，看好 ...

智通财经APP获悉，花旗发布研报称，因应近期铜价大幅上升对企业盈利造成的分化影响，首次给予建 滔积层板(01888)"增持"评级，同时给予德昌电机控股(00179)"中性"评级。 相反，德昌电机则面临严峻的成本挑战。铜占其销售成本超过25%，尽管公司已改为"成本加成"定价模 式，但花旗指出，在占其销售额84%的汽车领域，面对强大的全球客户，其实际议价能力有限，难以完 全转嫁成本升幅。该行估算，若铜价上涨10%，并假设德昌电机需承担一半成本压力，其盈利可能受冲 击达11%。因此，预计公司2026财年下半年核心盈利将转为同比下跌7.1%，远逊于上半年的增长2.8%。 该行指出，2025年第四季度铜价同比飙升22%，按季上升约14%。在此背景下，两家行业龙头企业的盈 利前景出现显著背离：建滔积层板作为全球最大覆铜面板制造商，市占率约16%，有望将成本上涨转嫁 予下游，从而带动盈利加速增长; 而德昌电机作为全球最大汽车微电机制造商，市占率超20%，议价能 力相对较弱，盈利将受压。 花旗预期，建滔积层板的核心盈利增长将在铜价上行周期中显著提速。其增长率将从2025年上半年的同 比10%，跃升至下半年的约58%，并在20 ...

花旗预期，建滔积层板的核心盈利增长将在铜价上行周期中显著提速。其增长率将从2025年上半年的同 比10%，跃升至下半年的约58%，并在2026年进一步实现57%的增长。此预测尚未计入公司AI玻璃纤维 业务可能的贡献。报告认为，由于覆铜面板行业集中度高，龙头企业凭借技术及成本优势，有能力将原 材料涨价压力传导至下游印刷电路板客户。 相反，德昌电机则面临严峻的成本挑战。铜占其销售成本超过25%，尽管公司已改为"成本加成"定价模 式，但花旗指出，在占其销售额84%的汽车领域，面对强大的全球客户，其实际议价能力有限，难以完 全转嫁成本升幅。该行估算，若铜价上涨10%，并假设德昌电机需承担一半成本压力，其盈利可能受冲 击达11%。因此，预计公司2026财年下半年核心盈利将转为同比下跌7.1%，远逊于上半年的增长2.8%。 花旗发布研报称，因应近期铜价大幅上升对企业盈利造成的分化影响，首次给予建滔积层板(01888)"增 持"评级，同时给予德昌电机控股(00179)"中性"评级。 该行指出，2025年第四季度铜价同比飙升22%，按季上升约14%。在此背景下，两家行业龙头企业的盈 利前景出现显著背离：建滔积层板作为全球最大 ...

建滔积层板(01888)涨超3%，截至发稿，涨3.29%，报15.4港元，成交额2.27亿港元。 花旗发布研报称，因应近期铜价大幅上升对企业盈利造成的分化影响，首次给予建滔积层板"增持"评 级。2025年第四季度铜价按年飙升22%，按季上升约14%。在此背景下，建滔积层板作为全球最大覆铜 面板制造商，市占率约16%，有望将成本上涨转嫁予下游，从而带动盈利加速增长。 花旗预期，建滔积层板的核心盈利增长将在铜价上行周期中显着提速。其增长率将从2025年上半年的按 年10%，跃升至下半年的约58%，并在2026年进一步实现57%的增长。此预测尚未计入公司AI玻璃纤维 业务可能的贡献。该行认为，由于覆铜面板行业集中度高，龙头企业凭借技术及成本优势，有能力将原 材料涨价压力传导至下游印刷电路板客户。 ...

花旗发布研报称，因应近期铜价大幅上升对企业盈利造成的分化影响，首次给予建滔积层板"增持"评 级。2025年第四季度铜价按年飙升22%，按季上升约14%。在此背景下，建滔积层板作为全球最大覆铜 面板制造商，市占率约16%，有望将成本上涨转嫁予下游，从而带动盈利加速增长。 智通财经APP获悉，建滔积层板(01888)涨超3%，截至发稿，涨3.29%，报15.4港元，成交额2.27亿港 元。 花旗预期，建滔积层板的核心盈利增长将在铜价上行周期中显着提速。其增长率将从2025年上半年的按 年10%，跃升至下半年的约58%，并在2026年进一步实现57%的增长。此预测尚未计入公司AI玻璃纤维 业务可能的贡献。该行认为，由于覆铜面板行业集中度高，龙头企业凭借技术及成本优势，有能力将原 材料涨价压力传导至下游印刷电路板客户。 ...

花旗发表研报指，因应近期铜价大幅上升对企业盈利造成的分化影响，首次给予建滔积层板"增持"评 级，同时给予德昌电机控股"中性"评级。该行指出，2025年第四季度铜价按年飙升22%，按季上升约 14%。在此背景下，两家行业龙头企业的盈利前景出现显著背离：建滔积层板作为全球最大覆铜面板制 造商，市占率约16%，有望将成本上涨转嫁予下游，从而带动盈利加速增长；而德昌电机作为全球最大 汽车微电机制造商，市占率超20%，议价能力相对较弱，盈利将受压。 ...

Core Viewpoint - The PCB sector is experiencing significant performance growth driven by AI demand, with several key investment themes identified for 2023 [1][2]. Investment Themes - **PCB Upgrade Trend**: The commercialization of CoWoP technology is accelerating, leading to a new round of upgrades in AI PCB products. mSAP capacity, equipment, and technical capabilities will become higher competitive thresholds for PCB manufacturers, presenting investment opportunities across the mSAP supply chain [1][2]. - **CCL Upgrade from M8 to M9**: The transition from M8 to M9 CCL is a definitive trend, with an increasing number of GPUs, ASIC servers, and 1.6T switches adopting M9 CCL. The usage of Q fabric, HVLP 3-4, and hydrocarbon resins will continue to rise rapidly [1][2]. - **Upstream Material Price Increases**: The price of upstream materials is still in an upward cycle, which is expected to further improve profitability [1][3]. - **Rising Demand for Substrates**: Demand for BT substrates is increasing, with continuous price hikes, while ABF substrate demand is beginning to overflow to domestic manufacturers [1][4]. Market Performance - The PCB sector's performance has exceeded market expectations, particularly in the upstream materials and equipment segments, driven by global AI PCB capacity expansion. Companies like Jin'an Guoji and Huazheng New Materials in the CCL segment, and Dazhu CNC and Chipbase in the equipment segment, have shown significant excess returns [2]. Price Trends - The CCL industry average price has increased by 20%-30% in 2025, with expectations for further price hikes in 2026 potentially exceeding those of 2025 due to supply-demand dynamics and raw material price trends [3]. Demand Dynamics - The global AI data center's storage demand is robust, with TSMC's capital expenditure for 2026 projected at $52-56 billion, significantly above market expectations. This indicates a strong upward trend in storage chip demand, leading to continuous price increases for BT substrates and the overflow of ABF substrate demand to domestic suppliers [4].

Investment Rating - The report maintains a positive outlook on the price increase trends for copper-clad laminates and storage chips, indicating strong sustainability in performance [2][5]. Core Insights - The report highlights the significant growth in the performance of companies within the copper-clad laminate and storage chip sectors, with expectations of continued price increases driven by strong demand, particularly in AI applications [2][5]. - Companies like Jin'an Guoji are projected to see substantial profit increases, with forecasts suggesting a net profit of 280-360 million yuan in 2025, representing a year-on-year growth of 655-871% [2]. - The storage chip market is expected to experience a price surge in Q1 2026, with DRAM contract prices anticipated to increase by 55-60% and NAND Flash by 33-38% [2]. - The overall semiconductor industry is projected to reach $551.6 billion in 2026, a 134% year-on-year increase, with further growth expected in 2027 [2]. Summary by Sections Consumer Electronics - The report emphasizes the ongoing expansion of AI applications in consumer electronics, particularly within the Apple supply chain and smart glasses, which are expected to drive demand for related components [6]. PCB - The report notes a sustained high demand for copper-clad laminates, with price increases expected due to rising demand from automotive and industrial control sectors, alongside AI applications [7]. Components - The report identifies growth opportunities in passive components, particularly in MLCCs and inductors, driven by increased usage in AI mobile devices and laptops [22]. IC Design - The report expresses optimism regarding the storage sector, forecasting a significant price increase for DRAM due to rising demand from cloud service providers and consumer electronics [24][25]. Semiconductor Equipment and Materials - The report discusses the ongoing trend of de-globalization in the semiconductor industry, with a focus on domestic production capabilities and the need for self-sufficiency in semiconductor equipment and materials [26][28]. Key Companies - Companies such as Shenghong Technology and Northern Huachuang are highlighted for their strong market positions and growth potential in the semiconductor and PCB sectors [30][31][36].

Investment Rating - The industry investment rating is "Positive" (maintained) [1] Core Insights - The report highlights a significant price increase trend in the CCL (Copper Clad Laminate) industry, driven by rising raw material costs and strong demand from sectors such as AI and electric vehicles [5][6] - Major companies in the CCL sector have implemented multiple price hikes throughout 2025, with notable increases from leading firms like 建滔积层板 and Resonac [5][6] - The profitability of CCL manufacturers has improved significantly due to these price increases, with companies like 生益科技 reporting a substantial rise in gross margins [7] Summary by Sections Price Increase Overview - The CCL industry has experienced a global price increase trend, with key players raising prices multiple times in 2025, including a 10% increase in December [5] - Resonac announced a price hike of over 30% for its products starting in March 2026, reinforcing global price increase expectations in the CCL sector [5] Drivers of Price Increase - The primary drivers for the current price increases in the CCL industry include rising costs of core raw materials such as copper, electronic cloth, and epoxy resin [6] - Copper prices saw a cumulative increase of nearly 40% in 2025, with LME copper prices reaching $12,960 per ton [6] - The demand for high-performance epoxy resin has surged, particularly for AI servers and advanced packaging boards, contributing to the rising costs in the CCL segment [6] Profitability and Investment Recommendations - The profitability of CCL manufacturers has shown significant recovery, with 生益科技 achieving a gross margin of 26.85% in Q2 2025, reflecting a year-on-year increase [7] - The report suggests focusing on the CCL price increase cycle and AI penetration rates, recommending stocks such as 生益科技, 金安国纪, and 建滔积层板 as beneficiaries of this trend [8]