来源：新浪基金∞工作室 数据显示，长安基金旗下1只基金重仓中芯国际。长安沪深300非周期指数A（740101）三季度持有股数 2407股，占基金净值比例为1.59%，位居第八大重仓股。根据测算，今日浮亏损失约9700.21元。连续3 天下跌期间浮亏损失1.57万元。 长安沪深300非周期指数A（740101）成立日期2012年6月25日，最新规模2097.02万。今年以来收益 3.89%，同类排名3546/5517；近一年收益27.52%，同类排名3115/4203；成立以来收益125.77%。 长安沪深300非周期指数A（740101）基金经理为肖洁。 截至发稿，肖洁累计任职时间3年341天，现任基金资产总规模5.17亿元，任职期间最佳基金回报 23.53%， 任职期间最差基金回报-26.3%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 1月13日，中芯国际跌3.16%，截至发稿，报123.63元/股，成交81.54亿元，换手率3.26%，总市值 9890.90亿 ...

Core Viewpoint - The Chip Leader ETF (516640) opened with a slight decline of 0.08%, indicating a mixed performance in the semiconductor sector [1] Group 1: ETF Performance - The Chip Leader ETF (516640) opened at 1.188 yuan [1] - Since its establishment on August 19, 2021, the fund has achieved a return of 19.13% [1] - The fund's return over the past month is reported at 13.34% [1] Group 2: Major Holdings Performance - Major holdings in the ETF include: - SMIC: down 0.13% [1] - Cambricon: down 1.65% [1] - Haiguang Information: unchanged [1] - Northern Huachuang: down 0.37% [1] - Lattice Semiconductor: unchanged [1] - Zhaoyi Innovation: up 1.59% [1] - Zhongwei Company: down 1.20% [1] - OmniVision: up 0.19% [1] - Chipone: up 0.23% [1] - Changdian Technology: down 0.41% [1]

来源：新浪证券-红岸工作室 1月12日，中芯国际跌0.95%，成交额72.02亿元。两融数据显示，当日中芯国际获融资买入额11.23亿 元，融资偿还12.22亿元，融资净买入-9906.69万元。截至1月12日，中芯国际融资融券余额合计129.57 亿元。 资料显示，中芯国际集成电路制造有限公司位于上海市浦东新区张江路18号,香港中环康乐广场8号交易 广场1期29楼，成立日期2000年4月3日，上市日期2020年7月16日，公司主营业务涉及提供0.35微米至14 纳米多种技术节点、不同工艺平台的集成电路晶圆代工及配套服务。主营业务收入构成为：集成电路晶 圆代工93.83%，其他6.17%。 截至9月30日，中芯国际股东户数33.62万，较上期增加33.27%；人均流通股6134股，较上期减少 25.41%。2025年1月-9月，中芯国际实现营业收入495.10亿元，同比增长18.22%；归母净利润38.18亿 元，同比增长41.09%。 机构持仓方面，截止2025年9月30日，中芯国际十大流通股东中，易方达上证科创板50ETF（588080） 位居第五大流通股东，持股5730.50万股，相比上期减少1650. ...

Group 1 - The semiconductor industry is benefiting from a global upcycle, with significant growth expected through 2026, particularly in semiconductor equipment and materials [1][2] - The Semiconductor Industry Association (SIA) reported that global semiconductor sales reached $75.3 billion in November 2025, marking a 3.5% increase from October and a 29.8% increase year-over-year [1][10] - China's semiconductor sales amounted to $20.23 billion in November 2025, reflecting a year-over-year growth of 22.9% [1][10] Group 2 - The demand for memory products, particularly DRAM and NAND Flash, is on the rise, with contract prices increasing significantly; DRAM contract prices are expected to rise by 55-60% in Q1 2026 [1][7] - Domestic storage testing and packaging factories are experiencing high order volumes, leading to increased capacity utilization and a price hike of approximately 30% [1][2] - The semiconductor materials market is projected to grow to $70 billion globally by 2025, with a 6% year-over-year increase, while China's key materials market is expected to reach 174.1 billion yuan, growing by 21.1% [2][25] Group 3 - The semiconductor equipment ETF (561980) has seen a net inflow of nearly 200 million yuan over the last three trading days, with a one-year index increase of 97.33% [1][3] - The top ten holdings in the semiconductor equipment index focus on leading companies in the sector, with a concentration of nearly 80% [3][19] - The domestic semiconductor industry is expected to accelerate the expansion of production capacity, particularly in storage wafer manufacturing, driven by strong demand from AI applications [2][24]

香港联交所最新资料显示，1月7日，国家集成电路产业投资基金股份有限公司减持中芯国际（00981） 840万股，每股作价74.93港元，总金额约为6.29亿港元。减持后最新持股数目约为7.17亿股，最新持股 比例为8.96%。 来源：新浪港股 ...

Core Viewpoint - The semiconductor merger and acquisition (M&A) landscape is experiencing increased valuation disputes, leading to a rise in failure rates of deals, despite a more accommodating regulatory environment [1][2][4]. Group 1: M&A Activity and Trends - In 2025, the number of M&A cases in the semiconductor sector increased by nearly 25% year-on-year, reaching 161 cases, with 12 failures, marking a five-year high [2][3]. - The total M&A amount in China's semiconductor industry reached approximately 279.67 billion, with 496 cases and 32 failures, a more than twofold increase compared to previous years [3]. - The overall M&A market in A-shares saw about 4,773 cases in 2025, a 5% increase year-on-year, with a slight decline in overall failure rates [2][3]. Group 2: Valuation Discrepancies - There is a significant divergence in valuations between buyers and sellers, particularly as sellers' expectations remain high due to previous market conditions, while buyers are cautious due to industry adjustments [4][5]. - The average price-to-earnings ratio for the semiconductor industry peaked at 291 times in 2021 but fell to 53 times by 2024, reflecting a substantial valuation correction [5]. - The termination of several high-profile M&A deals, such as the merger between Haiguang Information and Zhongke Shuguang, was attributed to disagreements over core terms, particularly valuation [4][5]. Group 3: Differentiated Pricing Strategies - Industry experts suggest implementing differentiated pricing strategies to address valuation discrepancies, allowing for tailored exit options for different investor types [10][11]. - Recent M&A cases have shown a trend towards differentiated arrangements in terms of valuation, payment methods, and performance commitments, which can help align interests among diverse stakeholders [10][11]. - Regulatory support for differentiated M&A practices has increased, encouraging the use of various assessment methods and flexible payment structures [11][12]. Group 4: Challenges in M&A Execution - The semiconductor industry is characterized by high cyclicality, complicating M&A negotiations as both parties seek to capitalize on market recovery while managing inherent risks [6][12]. - The presence of a "trilemma" in M&A—high seller expectations, buyer performance commitments, and high success rate targets—poses significant challenges, especially during industry downturns [12][14]. - The need for performance guarantees in M&A deals has led to complications, particularly for unprofitable semiconductor firms, as they may resist signing performance commitments [12][14].

Group 1 - The report outlines the strategic importance of computing power as a new type of infrastructure and its collaborative relationship with data and algorithms [3][4] - The global computing power market is characterized by a significant scale and growth, with North America leading and the Asia-Pacific region rapidly catching up [4][5] - The report highlights the evolution of computing power technology, with heterogeneous computing architectures becoming mainstream [4][5] Group 2 - During the "14th Five-Year Plan" period, China's computing power scale has expanded significantly, with the total computing power surpassing previous levels [5][6] - The report discusses the impact of the East Data West Computing project on the geographical restructuring of computing power in China [5][6] - The establishment of a domestic computing ecosystem is underway, with a notable increase in the annual growth rate of domestic AI chip shipments [6][7] Group 3 - The report identifies key segments of the computing power industry chain, including advancements in chiplet technology and optical interconnects that enhance computing density [4][5] - The deployment of edge computing nodes in industrial and automotive internet applications is increasing, reflecting a shift towards more decentralized computing solutions [5][6] - The demand for computing power in various applications, such as AI model training, scientific computing, and smart manufacturing, is analyzed, indicating a growing need for high-performance computing resources [6][7] Group 4 - The competitive landscape of the global computing power industry is dominated by American companies, with major players like NVIDIA, AMD, and Intel leading the high-end computing ecosystem [6][7] - In China, the report highlights the emergence of a "national team" in domestic computing power, with traditional hardware manufacturers transitioning to computing service providers [7][8] - Key competitive dimensions include hardware performance, software ecosystem compatibility, and the ability to deliver comprehensive solutions [6][7] Group 5 - The report forecasts significant growth in the computing power market from 2026 to 2032, with an expected compound annual growth rate and a shift in the market structure towards AI computing power [10][11] - The analysis indicates that the domestic market share of Chinese computing power is projected to exceed 50% under certain scenarios [10][11] - The report emphasizes the importance of establishing a sustainable and efficient computing power ecosystem, with a focus on energy efficiency and green technologies [10][11]

Core Viewpoint - The semiconductor M&A activity in A-shares is experiencing a surge in 2025, with a notable increase in the number of cases and a focus on asset integration and strategic cooperation, despite a rising failure rate in M&A transactions [1][2][3]. Group 1: M&A Activity and Trends - In 2025, the number of M&A cases in the A-share market reached approximately 4,773, reflecting a year-on-year increase of about 5%, while semiconductor-related M&A cases rose to 161, up nearly 25% year-on-year [2][3]. - The total M&A amount in China's semiconductor sector reached 279.67 billion yuan, with 496 cases reported, and 32 failures, marking a more than twofold increase in failures compared to previous years [3]. - The overall failure rate of M&A transactions in the semiconductor industry has increased, with 12 failures reported in 2025, the highest in five years [2][3]. Group 2: Valuation Discrepancies and Challenges - There is a significant divergence in valuations between buyers and sellers, complicating the consensus on core terms such as price and performance commitments, which has become a critical reason for M&A failures [1][4][5]. - The average price-to-earnings ratio in the semiconductor industry dropped from 291 times in 2021 to 53 times in 2024, reflecting a substantial valuation correction amid changing market conditions [5]. - The introduction of the "M&A Six Guidelines" in 2024 accelerated M&A activities, but the valuation discrepancies have intensified in 2025, particularly as sellers' expectations remain high due to historical peaks in valuations [4][10]. Group 3: Strategic Recommendations - Industry experts suggest adopting differentiated M&A strategies, including staged incubation through M&A funds, to mitigate risks associated with semiconductor M&A transactions [1][7][10]. - Companies are encouraged to implement differentiated pricing strategies based on various financing rounds, allowing for more flexible exit options for investors [8][10]. - Regulatory support for differentiated M&A is evident, with a shift towards more inclusive and prudent approval processes, allowing for diverse valuation methods and payment structures [11][12].

智通财经APP获悉，香港联交所最新资料显示，1月7日，国家集成电路产业投资基金股份有限公司减持 中芯国际(00981)840万股，每股作价74.93港元，总金额约为6.29亿港元。减持后最新持股数目约为7.17 亿股，最新持股比例为8.96%。 ...

智通财经APP获悉，香港联交所最新资料显示，1月7日，国家集成电路产业投资基金股份有限公司减持 中芯国际(00981)840万股，每股作价74.93港元，总金额约为6.29亿港元。减持后最新持股数目约为7.17 亿股，最新持股比例为8.96%。 ...