证券代码：688082 证券简称：盛美上海 公告编号：2025-081 盛美半导体设备（上海）股份有限公司 关于选举第三届董事会职工代表董事的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）第二届董事会 任期即将届满，根据《中华人民共和国公司法》（以下简称《公司法》）《上海 证券交易所科创板股票上市规则》《上海证券交易所科创板上市公司自律监管指 引第1号——规范运作》等法律、法规、规范性文件和《盛美半导体设备（上海） 股份有限公司章程》（以下简称《公司章程》）等相关规定，公司于2025年11 月13日召开了职工代表大会，会议经出席本次会议的全体职工代表投票表决，一 致同意选举杨霞云女士为公司第三届董事会职工代表董事（简历详见附件）。 根据《公司章程》的规定，杨霞云女士将与公司股东会选举产生的三名非独 立董事和三名独立董事共同组成公司第三届董事会，任期与第三届董事会任期一 致。 特此公告。 盛美半导体设备（上海）股份有限公司 董事会 2025年11月15日 附件：杨 ...

北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2025 年第四次临时股东会之法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东会规则》（以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾省）现行有效 的法律、行政法规、规章和规范性文件和现行有效的公司章程有关规定，指派律 师出席了公司于 2025 年 11 月 14 日召开的 2025 年第四次临时股东会（以下简称 本次股东会），并就本次股东会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 本所依据上述法律、行政法规、规章及规范性文件和《公司章程》的有关规 定以及本法律意见书出具日以前已经发生或者存在的事实，严格履行了法定职责， ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-082 盛美半导体设备（上海）股份有限公司 2025年第四次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 11 月 14 日 （二） 股东会召开的地点：中国（上海）自由贸易试验区丹桂路 999 弄 B2 栋会 议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 78 | | --- | --- | | 普通股股东人数 | 78 | | 2、出席会议的股东所持有的表决权数量 | 361,811,390 | | 普通股股东所持有表决权数量 | 361,811,390 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 75.4212 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 75. ...

Summary of Shengmei Shanghai Conference Call Company Overview - **Company**: Shengmei Shanghai - **Industry**: Semiconductor Equipment Manufacturing Key Financial Metrics - **Revenue**: 2025 Q1-Q3 revenue reached 5.146 billion RMB, a 29% year-over-year increase [2][8] - **Net Profit**: Net profit attributable to shareholders was 1.2 billion RMB, up 67% year-over-year [2][8] - **Q3 Performance**: Q3 revenue was 1.881 billion RMB, a 19.61% increase year-over-year; net profit was 570 million RMB, up 81.04% [3][9] - **R&D Investment**: R&D expenses for Q1-Q3 totaled 868 million RMB, a 41.89% increase, representing about 15%-16% of revenue [3][10] Industry and Product Developments - **Cleaning Equipment**: Achieved industry-leading performance in high-temperature SPM equipment, capable of cleaning 19 nm particles, with plans to reduce to 13 nm [2][4] - **Electroplating Equipment**: Anticipates delivery of panel-level electroplating equipment in Q4 2025; revenue from electroplating furnace tubes and upstream equipment grew 74.53% to 1.223 billion RMB [2][4] - **New Platforms**: Progress in developing high-capacity KRF process front-end coating and developing PECVD equipment with innovative designs [5] Capital Raising and Future Outlook - **Fundraising**: Completed a directed share issue raising 4.482 billion RMB for Mini LED production line expansion and global capacity enhancement [6] - **Revenue Forecast**: Full-year revenue expected between 6.5 billion to 7.1 billion RMB, maintaining a long-term revenue target of 4 billion USD [2][7] Market Trends and Competitive Landscape - **Domestic Substitution**: Increased domestic substitution, particularly in DRAM and mature logic sectors, with positive overseas market prospects [3][17] - **Advanced Packaging Demand**: Anticipated growth in advanced packaging driven by increased chip production, with a focus on panel packaging [19] Financial Health - **Total Assets**: As of Q3 2025, total assets were 18.213 billion RMB, with cash and cash equivalents of 6.951 billion RMB [3][11] - **Order Backlog**: As of September 29, 2025, total order backlog was 9.072 billion RMB, a 34.1% year-over-year increase [3][15] Challenges and Strategic Responses - **Gross Margin Fluctuations**: Gross margin impacted by initial costs of new equipment; expected to stabilize between 40%-48% [16] - **Competition in High-End Market**: Focus on unique equipment advantages in cleaning, inspection, and PECVD to mitigate competitive pressures [24] Conclusion - **Long-Term Confidence**: Company maintains confidence in long-term growth prospects, supported by technological advancements and a strong order backlog [7][23]

Core Insights - The thin film deposition equipment is a critical device in micro-nano manufacturing and precision processing, widely used in strategic emerging industries such as semiconductors, photovoltaics, and display panels [1][2] - China has become the largest market for semiconductor equipment globally for five consecutive years, with sales expected to reach $49.55 billion in 2024, accounting for 42% of the global total [1][6] - The global thin film deposition equipment market is projected to reach $23.186 billion in 2024, representing 22% of the wafer manufacturing equipment market [1][6] - The Chinese market for thin film deposition equipment is expected to grow to approximately 77.31 billion yuan in 2024, a year-on-year increase of 38.75% [1][7] - The industry is expected to accelerate the research and application of advanced processes such as ALD, promote collaboration across the entire supply chain, and expand applications into photovoltaics and new displays [1][7] Industry Overview - Thin film deposition equipment is essential for depositing functional films on substrate materials through physical or chemical methods, impacting surface properties and widely applied in various fields [2][5] - The main types of thin film deposition technologies include Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and Atomic Layer Deposition (ALD), each with distinct advantages [3][4] Market Dynamics - The global semiconductor equipment market is expected to reach $117.1 billion in 2024, with a 10% year-on-year growth, driven by the demand for advanced processes and packaging [5][6] - The Chinese semiconductor equipment market is projected to grow by 35% year-on-year, reaching $49.55 billion in 2024, solidifying its position as the largest market globally [5][6] Competitive Landscape - The competitive structure of the thin film deposition equipment industry in China is tiered, with international giants dominating high-end markets, while domestic leaders focus on replacing imports and niche markets [8][9] - Key domestic players include North Huachuang, Tuojing Technology, and Zhongwei Company, which are making significant strides in various segments of the market [8][9] Company Performance - Major companies in the thin film deposition equipment sector are experiencing strong revenue growth, with Tuojing Technology leading with over 54% growth, while North Huachuang maintains a stable profit margin of around 42% [9][10] - The overall domestic market still has a low localization rate of under 25%, but companies are progressively building a more robust domestic ecosystem [8][9] Future Trends - The industry is expected to focus on technological advancements, ecological improvements, and expanding application scenarios, particularly in semiconductor manufacturing and emerging high-end manufacturing fields [10][11][12] - The shift towards a comprehensive ecosystem involving equipment, materials, and components is anticipated, supported by government policies and market demands [11][12]

Core Insights - The stock of Semiconductor Manufacturing International Corporation (SMIC) in Shanghai experienced a decline of 2.96% on November 11, with a trading volume of 562 million yuan [1] - As of September 30, 2025, SMIC reported a revenue of 5.146 billion yuan, representing a year-on-year growth of 29.42%, and a net profit of 1.266 billion yuan, reflecting a 66.99% increase compared to the previous year [2] Financing and Margin Trading - On November 11, SMIC had a financing buy-in amount of 51.991 million yuan and a financing repayment of 64.986 million yuan, resulting in a net financing outflow of 12.995 million yuan [1] - The total margin trading balance for SMIC reached 647 million yuan, accounting for 0.87% of its market capitalization, which is above the 80th percentile of the past year [1] - In terms of securities lending, SMIC repaid 800 shares and sold 600 shares on November 11, with a total selling amount of 101,600 yuan [1] Shareholder and Institutional Holdings - As of September 30, 2025, the number of shareholders for SMIC increased to 21,700, a rise of 85.89%, while the average number of circulating shares per person decreased by 46.20% to 20,098 shares [2] - The top ten circulating shareholders of SMIC saw significant reductions in holdings, with Hong Kong Central Clearing Limited holding 5.0576 million shares, down by 978,700 shares [3] - New institutional investors included E Fund CSI 300 ETF, which entered the top ten shareholders with 1.0857 million shares [3]

证券代码：688082 证券简称：盛美上海 公告编号：2025-080 盛美半导体设备（上海）股份有限公司 关于 2023 年限制性股票激励计划预留授予部分第一个 归属期第一批次归属结果暨股票上市公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次股票上市类型为股权激励股份；股票认购方式为网下，上市股数为 272,275股。 本次股票上市流通总数为272,275股。 （www.sse.com.cn）披露的相关公告。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限责 任公司上海分公司有关业务规则的规定，盛美半导体设备（上海）股份有限公司 （以下简称"公司"）于2025年11月7日收到中国证券登记结算有限责任公司上海 分公司出具的《证券变更登记证明》，公司已完成2023年限制性股票激励计划（以 下简称"本激励计划"）预留授予部分第一个归属期第一批次的股份登记工作。 现将有关情况公告如下： 一、本次限制性股票归属的决策程序及相关信息披露 （一）2023年4月26日，公司召开第二届董事会第四 ...

Core Viewpoint - The company announced that the first batch of restricted stock from its 2023 incentive plan will be listed for trading on November 14, involving 272,275 shares allocated to 174 individuals, which will slightly increase the total share count without affecting control [1] Summary by Sections Stock Incentive Plan - The first vesting period of the restricted stock incentive plan will result in 272,275 shares being listed for trading [1] - The shares are allocated to 174 individuals and are sourced from the company's directed issuance of A-share common stock [1] Impact on Share Capital - Following the vesting, the total share capital will increase from 479,892,514 shares to 480,164,789 shares [1] - This increase in share capital will not impact the company's control [1] Financial Implications - The vesting will not have a significant impact on the company's recent financial condition and operating results [1] - However, the basic earnings per share will be diluted as a result of this stock allocation [1]

Core Viewpoint - The electronic sector has become a primary focus for both public and private equity institutions participating in A-share companies' private placements, reflecting optimism about the long-term prospects of China's technology industry, especially with the acceleration of AI integration across various sectors [1][4]. Group 1: Private Placement Participation - As of November 6, 2023, private equity institutions have participated in 53 A-share companies' private placements, with a total allocation exceeding 5 billion yuan, marking a year-on-year increase of 23.17% from 4.49 billion yuan [1][2]. - The overall floating profit from these private placements reached 2.61 billion yuan, with a floating profit ratio of 47.3% [1]. Group 2: Public Placement Participation - A total of 37 public equity institutions have engaged in 74 A-share companies' private placements, with total allocations amounting to approximately 30.29 billion yuan, and a floating profit of 12.25 billion yuan, resulting in a floating profit ratio of 40.45% [2][3]. Group 3: Electronic Sector Focus - The electronic industry has emerged as the most contested area for private placements, with private equity institutions participating in 10 electronic companies, totaling 2.03 billion yuan, which accounts for 36.78% of the total private placement amount [3]. - Public equity institutions have also shown strong interest in the electronic sector, participating in 13 electronic companies' private placements with a total allocation of 8.99 billion yuan and a floating profit ratio of 42.81% [3]. Group 4: Market Outlook - Analysts suggest that the electronic sector's appeal is driven by its long-term growth potential and the global competitive advantages of related industries, particularly in AI computing power and chip manufacturing [4][5]. - The next 3 to 5 years may witness a dual-driven growth pattern in technology investments, characterized by accelerated hardware iterations and explosive software ecosystem development [5].

2025 年 11 月 证券代码：688082 证券简称：盛美上海 盛美半导体设备（上海）股份有限公司 2025 年第四次临时股东会会议资料 盛美半导体设备（上海）股份有限公司 2025 年第四次临时股东会会议须知 为维护全体股东的合法权利，确保股东会的正常秩序和议事效率，保证会议 的顺利进行，根据《中华人民共和国公司法》（以下简称《公司法》）《中华人民 共和国证券法》《上市公司股东会规则》以及《盛美半导体设备（上海）股份有 限公司章程》（以下简称《公司章程》）《盛美半导体设备（上海）股份有限公司 股东会议事规则》等相关规定，盛美半导体设备（上海）股份有限公司（以下简 称"公司"）特制定 2025 年第四次临时股东会会议须知： 一、为确认出席会议的股东或其代理人或其他出席者的出席资格，会议工作 人员将对出席会议者的身份进行必要的核对工作，请被核对者予以配合。 二、为保证本次会议的严肃性和正常秩序，切实维护股东的合法权益，请出 席会议的股东或其代理人或其他出席者准时达到会场签到确认参会资格，在会议 主持人宣布现场出席会议的股东和代理人人数及所持有的表决权数量之前，会议 登记应当终止。 三、会议按照会议通知上所列 ...