证券代码：688082 证券简称：盛美上海 公告编号：2024-056 盛美半导体设备（上海）股份有限公司 关于召开 2024 年半年度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会议召开时间：2024 年 9 月 19 日（星期四）下午 15:00-16:00 会 议 召 开 地 点 ： 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网址： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心视频录播和网络互动 投资者可于 2024 年 9 月 10 日（星期二）至 9 月 18 日（星期三）16:00 前 登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 （ir@acmrcsh.com）进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 本次业绩说明会以视频录播结合网络互动形式召开，公司将针对2024年半年 度经营成果及财务状况的具体情况与投资者进行互动交流和沟通，在信息披露允 许的范围内就投资者普遍关注的问题进行 ...

北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2024 年第二次临时股东大会之法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东大会规则（2022年修订）》 （以下简称《股东大会规则》）等中华人民共和国境内（以下简称中国境内，为 本法律意见书之目的，不包括中国香港特别行政区、中国澳门特别行政区和中国 台湾地区）现行有效的法律、行政法规、规章和规范性文件和现行有效的公司章 程有关规定，指派律师出席了公司于 2024 年 9 月 5 日召开的 2024 年第二次临时 股东大会（以下简称本次股东大会），并就本次股东大会相关事项出具本法律意 见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 1. 经公司 2023 年年度股东大会审议通过的《盛美半导体设备（上海）股份 有限公司章程》（以下简称《公司章程 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-057 盛美半导体设备（上海）股份有限公司 2024 年第二次临时股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 79 | | --- | --- | | 普通股股东人数 | 79 | | 2、出席会议的股东所持有的表决权数量 | 365,134,430 | | 普通股股东所持有表决权数量 | 365,134,430 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 83.7169 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 83.7169 | （四） 表决方式是否符合《公司法》及公司章程的规定，大会主持情况等。 本次会议由董事会召集，董事长 HUI WANG 主持，会议采取现场投票和网络 投票相结合的表决方式。会议的召集、召开与 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-055 盛美半导体设备（上海）股份有限公司 关于以集中竞价交易方式回购股份的回购报告书 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 回购股份金额：不低于人民币5,000万元（含本数），不超过人民币10,000 万元（含本数），具体回购资金总额以实际使用的资金总额为准。 ● 回购股份资金来源：公司首次公开发行人民币普通股取得的部分超募资金 及公司自有资金。 ● 回购股份用途：本次回购的股份拟用于股权激励或员工持股计划。若公司 未能在股份回购实施结果暨股份变动公告日后3年内使用完毕已回购股份，尚未使 用的已回购股份将予以注销。如国家对相关政策作调整，则本次回购股份方案按调 整后的政策实行。 ● 回购股份价格：不超过人民币90元/股（含本数）。该价格不高于公司董事 会通过回购决议前30个交易日公司股票交易均价的150%。 ● 回购股份方式：通过上海证券交易所交易系统以集中竞价方式回购。 ● 回购股份期限：自公司董事会审议通过本次回购股份方案之 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-054 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第7 号——回购股份》等相关规定，公司在回购期间，应当在每个月的前3个交易日 内公告截至上月末的回购进展情况。现将公司回购股份进展情况公告如下： 截至2024年8月31日，公司尚未实施股份回购。 盛美半导体设备（上海）股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/8/8 | | --- | --- | | 回购方案实施期限 | 董事会审议通过后 12 个月 | | 预计回购金额 | 5,000 万元~10,000 万元 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 0 万股 | | 累计已回购股数占总股本比 | 0% | | 例 | | | 累计已回购金 ...

盛美半导体设备（上海）股份有限公司（以下简称"公司"）董事会近日收 到非独立董事李江先生的书面辞职报告。李江先生由于工作原因，申请辞去公司 第二届董事会非独立董事职务。辞职后，李江先生将不再担任公司任何职务。截 至本公告披露日，李江先生未直接或间接持有公司股份。 李江先生确认：其任职期间，与公司、董事会及监事会无意见分歧，不存在 任何与辞职有关的其它应提请公司董事会、监事会、各位股东注意之事宜。 李江先生的辞职未导致公司董事会成员人数低于法定人数，不影响公司董事 会的正常运行，不会对公司的日常运营产生不利影响。李江先生的辞职报告自送 达公司董事会之日起生效。 证券代码：688082 证券简称：盛美上海 公告编号：2024-052 盛美半导体设备（上海）股份有限公司 关于董事辞职的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 公司董事会对李江先生在担任前述职务期间为公司及董事会工作所做出的 贡献表示衷心感谢。 特此公告。 盛美半导体设备（上海）股份有限公司 董事会 2024年8月27日 ...

Group 1: Company Overview and Market Position - The company, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., is focused on semiconductor equipment, with a significant market presence in China [2]. - The company aims to increase its market share in mainland China from approximately 30% to 55%-60% for cleaning equipment [4][10]. - The company has established a research and development center in South Korea to enhance collaboration with major clients [3]. Group 2: Financial Performance and Projections - The company raised its annual revenue forecast from a lower limit of 50 billion to 53 billion yuan, reflecting improved production capacity and client demand [5][6]. - The second quarter revenue exceeded expectations, driven primarily by a 90%-95% coverage rate in cleaning equipment processes [4]. - The company expects to maintain stable growth in the cleaning equipment sector, with a target of 55%-60% market share in mainland China [4]. Group 3: Product Development and Innovations - The company has developed differentiated new products, including high-temperature SPM cleaning equipment, which has been validated by multiple clients [4]. - The PECVD and Track equipment are expected to achieve significant revenue contributions starting in 2025, with ongoing validations with local clients [5][12]. - The company launched a new panel-level electroplating device, Ultra ECP ap-p, aimed at next-generation fan-out panel-level packaging [9]. Group 4: Market Trends and Client Demand - The demand for cleaning and electroplating equipment in the semiconductor sector is expected to remain strong, with a 90%+ process coverage rate in storage and logic sectors [8]. - The company anticipates a healthy growth trajectory in the Chinese semiconductor equipment market over the next 3-5 years [7]. - The company is actively engaging with local suppliers to mitigate potential bottlenecks in key components for production [7]. Group 5: Strategic Initiatives and Global Expansion - The company plans to leverage its Korean facility to serve as a bridge for its differentiated products and technologies to global markets [11]. - The company is exploring opportunities in overseas markets, particularly in the electroplating sector, which is currently experiencing high demand [10]. - The company aims to enhance its supply chain stability through diversified sourcing and local supplier engagement [7].

二、公司前十名无限售条件股东持股情况 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2024年8月6 日召开第二届董事会第十二次会议，审议通过了《关于以集中竞价交易方式回购 公司股份方案的议案》。具体内容详见公司于2024年8月8日在上海证券交易所网 站（www.sse.com.cn）披露的公司《关于以集中竞价交易方式回购公司股份方案 的公告》（公告编号：2024-044）。 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7号——回购股份》等相关规定，现将公司第二届董事会第十二次会议决议公告 的前一个交易日（即2024年8月7日）登记在册的前十名股东和前十名无限售条件 股东的名称、持股数量及持股比例情况公告如下： 序号 股东名称 持股数量 （股） 占总股本比例 （%） 1 ACM RESEARCH, INC. 357,692,308 82.01 2 招商银行股份有限公司－华夏上证科创板 5 0 成份交易型开放式指数证券投资基金 6,539,609 1.50 3 上海浦东新兴产业投资有限公司 4,615,384 1.06 4 上海集成电路产业投资基金股份有限公司 4,615,38 ...

证 2024 年 08 月 15 日 研 报 告 公 司 研 究 主营业务增长强劲，海外市场拓展进程显著 —盛美上海（688082.SH）公司事件点评报告 买入(维持) 事件 分析师：毛正 S1050521120001 maozheng@cfsc.com.cn 联系人：张璐 S1050123120019 zhanglu2@cfsc.com.cn | --- | --- | |----------------------|------------| | 基本数据 | 2024-08-14 | | 当前股价（元） | 92.31 | | 总市值（亿元） | 403 | | 总股本（百万股） | 436 | | 流通股本（百万股） | 76 | | 52 周价格范围（元） | 73-124.01 | | 日均成交额（百万元） | 154.14 | 市场表现 -40 -30 -20 -10 0 10 20 (%) 盛美上海 沪深300 资料来源：Wind，华鑫证券研究 相关研究 盛美上海发布 2024 年半年报：2024 年上半年公司实现营业 收入 24.04 亿元，同比增长 49.33%；实现归母净利润 4.43 ...

Financial Overview - In the first half of 2024, the company achieved revenue of 2.404 billion yuan, a year-on-year increase of 49.33% [1] - Gross profit reached 1.218 billion yuan, with a gross margin of 50.68% [1] - Net profit increased by 85 million yuan to 443 million yuan, while the non-GAAP net profit grew by 92 million yuan to 435 million yuan [1] - After excluding share-based payment impacts, net profit increased by 33.9% to 665 million yuan, and non-GAAP net profit rose by 42.24% to 606 million yuan [1] - As of the end of the first half of 2024, total assets amounted to 11 billion yuan, with cash and cash equivalents accounting for 21.2% of total assets [1] Product Business Progress - Revenue from single-wafer cleaning and semiconductor cleaning equipment grew by 79.91% to 1.774 billion yuan, representing 73.81% of total revenue [2] - Revenue from plating, packaging, and other front-end equipment decreased by 8.12% to 427 million yuan, accounting for 17.76% of total revenue [2] - The company launched the HOCEP new plating and circuit equipment for next-generation fan-out panel-level packaging, expected to be a disruptive product [2] Customer Situation - The company has significantly increased its market share in the Chinese market as a leading cleaning equipment provider [2] - Successful delivery of OTC metal back cleaning and edge etching equipment to new customers in the U.S. market [2] - Active discussions with several front-end and packaging equipment customers in South Korea, including potential collaborations with Hynix for high bandwidth memory (HBM) products [3] Capacity Expansion and Long-term Revenue Goals - The company is expanding capacity in China and other regions, with a new R&D and manufacturing center in Shanghai nearing completion, expected to be operational by September [3] - A new long-term revenue target of 3 billion USD has been set, with expectations of 1.5 billion USD from the mainland China market and another 1.5 billion USD from other global markets [3] - The company forecasts full-year revenue between 5.3 billion and 5.8 billion yuan, reflecting significant progress in domestic and international market expansion [3] Technological Innovation and Market Outlook - Breakthroughs in panel-level packaging technology have been achieved, with a horizontal plating solution expected to position the company as a major player in the global market [3] - Plans to launch multiple devices with independent IP to support the rapid development of panel-level packaging [3] - Unique design in PECVD products enhances global competitiveness, with plans to enter international markets after domestic validation [3] Management Comments on Operating Environment and Future Outlook - Management expressed optimism for the second half of the year, expecting stronger performance driven by robust order and shipment growth [5] - The revenue guidance for the year has been raised from 5 billion to 5.3 billion yuan, reflecting confidence in growth for the second half and next year [5] - The company noted that while there is an increase in orders, the overall expansion pace remains steady and aligned with plans [11] Other Important Information - The company is accelerating the localization of key components for equipment, with domestic suppliers identified and feasibility studies underway [11] - The company expects to maintain a healthy growth trend in the semiconductor equipment market in China, supported by the third phase of the major fund [11] Q&A Session Summary Question: What is the progress of cooperation with major customers in South Korea? - The company is engaged in comprehensive cooperation in South Korea, including cleaning and plating equipment, with ongoing development of new processes and equipment [4] Question: How does management view the revenue growth in Q2? - The revenue growth exceeded expectations, attributed to increased downstream customer demand and revenue recognition from certain products [5] Question: What are the growth points in the cleaning equipment sector? - The company has a process coverage rate of 90-95% in cleaning equipment, with wet cleaning technology, especially high-temperature cleaning, identified as a future growth point [6] Question: What are the growth opportunities in other equipment sectors? - Backplane and plating equipment are important growth areas, particularly in international market expansion [7] Question: How does the company view the upcoming share unlock? - The company does not anticipate significant changes due to the share unlock, emphasizing continued focus on domestic market development [14] Question: What is the market outlook for supercritical CO2 technology? - This technology has significant potential, especially in logic processes below 5nm nodes and future 3D GAA logic [10] Question: What is the core performance indicator for plating equipment? - The company's plating equipment covers TSV, RDL, and advanced packaging, with a domestic market share target of 55% [10] Question: How is the demand from storage customers in China? - A growth trend is observed, particularly in Q4, with increasing demand for cleaning equipment in single crystal and logic processes [12] Question: What is the market space and competitive landscape for panel-level packaging technology? - Panel-level packaging is becoming increasingly important in the semiconductor supply chain, with the company being the first to adopt a horizontal plating solution [13]