Core Viewpoint - The company plans to spin off its photomask business into a separate entity, Anhui Jingmei Photomask Co., Ltd., to enhance operational efficiency and market competitiveness in the semiconductor photomask production sector [2][3]. Group 1: Business Strategy - The company aims to establish a dedicated production line for photomasks focusing on semiconductor processes of 28nm and above [2]. - The spin-off is intended to better capture market opportunities, expand production scale, and enhance supply chain stability and industry synergy [3]. Group 2: Intellectual Property and Technology - Anhui Jingmei currently holds 24 patents, including 20 invention patents and 4 utility model patents, with 17 patents already certified and 7 pending [2]. - The company possesses 73 proprietary technologies, which are essential for the operation of photomask equipment and production processes, ensuring product yield [2]. Group 3: Financial Aspects - The estimated value of the transferred photomask-related technology is approximately 27.73 million yuan [2]. - The company plans to raise a total of 1.195 billion yuan through investments from various partners, with the company itself contributing 200 million yuan from its own funds [3].

中国国际金融股份有限公司 关于合肥晶合集成电路股份有限公司 拟出售及出租资产暨关联交易的核查意见 中国国际金融股份有限公司（以下简称"保荐机构"）作为合肥晶合集成电路股份 有限公司（以下简称"晶合集成"或"公司"）首次公开发行股票并在科创板上市的保荐 机构，根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》 《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》等法律法规的 有关规定，对晶合集成拟出售及出租资产暨关联交易的事项进行了审慎核查，具体核 查情况及意见如下： 一、关联交易概述 （一）本次出售资产的基本情况 1、本次交易概况 根据公司发展战略规划，晶合集成拟将光罩业务通过安徽晶镁光罩有限公司（以 下简称"安徽晶镁"）独立运营，由安徽晶镁建设光罩生产线，专注于 28nm 及以上工 艺节点半导体光罩生产制造。公司拟以非公开协议方式将自行研发的光罩相关技术转 让给安徽晶镁。公司委托北京中企华资产评估有限责任公司对拟转让技术以 2025 年 1 月 31 日为评估基准日进行价值评估，评估价格为人民币 27,732.13 万元（不含税）。经 双方协商，以前述评估结果作为本次技术 ...

Group 1 - The semiconductor market shows signs of recovery, with global market size reaching $589.8 billion in May, a month-on-month increase of 3.55% and a year-on-year increase of 20% [6][8] - Major domestic wafer foundries, including SMIC, Hua Hong, and JCET, report high capacity utilization rates, with SMIC increasing from 68.1% to 89.6% and Hua Hong exceeding 100% [9][11] - The overall performance of the semiconductor industry is improving, with significant growth in exports and production in the electronic information manufacturing sector [8][9] Group 2 - Despite positive trends in the upstream semiconductor market, the chip spot market remains sluggish, with many traders reporting decreased orders and inquiries [14][15] - The disparity in market conditions is evident, with some distributors experiencing growth while others face challenges due to supply-demand imbalances [16][17] - Different segments within the semiconductor industry are experiencing varied performance, with analog chip manufacturers like TI and ADI showing recovery, while power device and silicon carbide sectors remain under pressure [20][21] Group 3 - The tight capacity situation is attributed to factors such as tariff fluctuations, domestic demand recovery, and government subsidies, leading to increased orders for local foundries [24][25] - The overall sentiment in the semiconductor industry is mixed, with leading companies benefiting from high-end chip demand while smaller firms struggle with rising material costs and competitive pressures [22][25] - The industry is characterized by a "blind men touching an elephant" phenomenon, where different stakeholders have varying perceptions of the market situation [25]

Group 1 - The second supervisory board meeting of Hefei Jinghe Integrated Circuit Co., Ltd. was held on July 25, 2025, with all three supervisors present, ensuring compliance with relevant laws and regulations [1][2] - The supervisory board approved the proposal for external investment and related transactions, affirming that the process adhered to principles of equality and mutual benefit, and did not harm the interests of the company or its shareholders [1][2] - The supervisory board also approved the proposal for technology transfer to Anhui Jingmei, confirming that the procedures complied with legal requirements and did not harm shareholder interests [2][3] Group 2 - The supervisory board agreed to lease factory buildings and supporting facilities to Anhui Jingmei and Anhui Jingrui, with the process deemed compliant with legal standards and not detrimental to shareholder interests [2][3]

合肥晶合集成电路股份有限公司 合肥晶合集成电路股份有限公司（以下简称"公司"）第二届董事会独立董事 专门会议第六次会议于 2025 年 7 月 25 日在公司会议室以通讯方式召开。会议通 知于 2025 年 7 月 18 日以电子邮件的方式送达各位独立董事。本次会议应出席独 立董事 3 人，实际出席独立董事 3 人，本次会议由过半数独立董事推选的独立董 事安广实先生主持，会议的召集、召开和表决程序符合《中华人民共和国公司法》 等法律法规以及《合肥晶合集成电路股份有限公司章程》《合肥晶合集成电路股 份有限公司独立董事工作制度》的有关规定。本次会议审议并通过了如下议案： 表决结果：3 票同意；0 票反对；0 票弃权。 三、审议通过《关于公司拟向安徽晶镁及安徽晶瑞出租厂房及厂务配套设 施、设备暨关联交易的议案》 经审核，本次拟向安徽晶镁及安徽晶瑞出租厂房及厂务配套设施、设备暨关 联交易事项有利于支持公司业务发展，符合公司经营发展需要，遵循公开、公平、 公正的原则，不存在损害公司及中小股东利益的情形，不会对公司独立性产生影 响。因此，独立董事一致同意公司拟向安徽晶镁及安徽晶瑞出租厂房及厂务配套 设施、设备暨关联交易事 ...

Core Viewpoint - Company plans to invest in Anhui Jingmei Photomask Co., Ltd. with a total capital increase of 1.195 billion yuan, where the company will contribute 200 million yuan, resulting in a 16.67% equity stake in the target company [1][3][5] Summary by Sections Investment Overview - The investment involves collaboration with related parties, including Hefei State-owned Capital Venture Investment Co., Ltd. and Hefei Jianxiang Investment Co., Ltd., constituting a related party transaction but not a major asset restructuring as per regulations [2][5] - The investment has been approved by the company's board and supervisory board, and does not require shareholder approval [2][21] Industry Context - The semiconductor industry in China is rapidly developing, with photomasks being a critical material in semiconductor manufacturing, leading to increased demand for high-performance photomasks [3][4] - The company began constructing a photomask production line in 2022 and produced the first semiconductor photomask in Anhui Province in July 2024, filling a market gap [3][4] Strategic Rationale - The company aims to separate its photomask business for independent operation to better capture market opportunities and enhance production scale, supply chain stability, and competitiveness [3][4] - The collaboration with external investors is intended to support the establishment of a photomask production line focused on 28nm and above process nodes [3][4] Financial Details - The total capital increase for Anhui Jingmei is set at 1.195 billion yuan, with each investor contributing at a price of 1.00 yuan per registered capital [1][3] - After the investment, the company will hold a 16.67% stake in Anhui Jingmei, with the remaining shares distributed among other investors [5][11] Related Party Transactions - Hefei State-owned Capital Venture Investment Co., Ltd. and Hefei Jianxiang Investment Co., Ltd. are identified as related parties, and the transaction is structured to ensure fairness and compliance with regulations [5][6] - The company has no prior equity stake in Anhui Jingmei before this investment [5][11] Governance and Compliance - The investment agreement is subject to various approvals and conditions, including the completion of necessary legal and regulatory procedures [16][18] - The company has committed to ensuring that the transaction does not adversely affect the interests of shareholders, particularly minority shareholders [5][22]

中国国际金融股份有限公司 关于合肥晶合集成电路股份有限公司 拟对外投资暨关联交易的核查意见 中国国际金融股份有限公司（以下简称"保荐机构"）作为合肥晶合集成电路股份 有限公司（以下简称"晶合集成"或"公司"）首次公开发行股票并在科创板上市的保荐 机构，根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》 《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》等法律法规的 有关规定，对晶合集成拟对外投资暨关联交易的事项进行了审慎核查，具体核查情况 及意见如下： 一、关联交易概述 （一）交易概述 近年来，我国半导体产业快速发展，光刻掩模版（以下简称"光罩"）作为半导体 制造中光刻工艺的核心图形母版，是集成电路制造的关键材料之一，其重要性日益凸 显，且市场对高性能、高精度光刻掩模版的需求持续增长。2022年，晶合集成开始建 设光罩生产线项目。2024年7月，晶合集成生产出安徽省首片半导体光刻掩模版，填补 了安徽省在该领域的空白。 根据公司发展战略规划，晶合集成拟将光罩业务从公司的现有业务中划分出来独 立运营，规划设立安徽晶镁光罩有限公司（以下简称"安徽晶镁"或"标的公司"）建 设光罩 ...

Summary of Key Points Core Viewpoint Hefei Jinghe Integrated Circuit Co., Ltd. is planning to transfer the ownership of its photomask-related technology, with an assessed market value of approximately 277.32 million yuan, to establish an independent photomask business entity in collaboration with other investors [2][8]. Group 1: Company Overview - Hefei Jinghe Integrated Circuit Co., Ltd. was established on May 19, 2015, with a registered capital of 2,006.14 million yuan and is located in Hefei, Anhui Province [3][4]. - The company focuses on the research, production, and sales of integrated circuit-related products and is recognized as the first 12-inch wafer foundry enterprise in Anhui Province [3][4]. - The company went public on the Shanghai Stock Exchange's Sci-Tech Innovation Board in May 2023, marking a significant milestone as the first pure wafer foundry enterprise in Anhui to enter the capital market [3][4]. Group 2: Technology Transfer and Valuation - The purpose of the asset valuation is to provide a reference for the market value of the photomask-related technology that the company intends to transfer, facilitating the establishment of a new business entity [2][8]. - The assessed market value of the photomask-related technology is 277.32 million yuan, based on the income approach, with the valuation date set for January 31, 2025 [2][8]. - The evaluation includes 24 patents and 73 proprietary technologies, with 20 invention patents and 4 utility model patents among them [3][4]. Group 3: Assessment Methodology - The income approach was selected for the valuation due to the absence of comparable market transactions and the inadequacy of historical cost data to reflect the technology's value [7][8]. - The valuation process involved estimating future expected revenues from the technology and discounting them to present value, using a specific formula to calculate the assessed value [8]. - The assessment was conducted by Beijing Zhongqi Hua Asset Appraisal Co., Ltd., ensuring compliance with relevant laws and regulations [2][7].

Group 1: WuXi AppTec Financial Performance - WuXi AppTec reported a revenue of 20.799 billion yuan for the first half of 2025, representing a year-on-year increase of 20.64% [2] - The net profit attributable to shareholders reached 8.561 billion yuan, showing a significant growth of 101.92% compared to the previous year [2][3] - The total profit increased by 96.20% year-on-year, driven by the focus on CRDMO business model and improved operational efficiency [1][2] Group 2: Haida Group Financial Performance - Haida Group achieved a revenue of 588.31 billion yuan in the first half of 2025, marking a 12.50% increase year-on-year [6] - The net profit attributable to shareholders was 26.39 billion yuan, reflecting a growth of 24.16% compared to the same period last year [6] - The company plans to distribute a cash dividend of 2 yuan per 10 shares to all shareholders [6] Group 3: Shandong Gold's H-Share Listing - Shandong Gold's subsidiary, Shanjin International, plans to issue H-shares and apply for listing on the Hong Kong Stock Exchange [9] - The listing aims to enhance global strategic layout and accelerate overseas business development [9] Group 4: Xinwei Technology Fundraising - Lexin Technology's non-public offering has been approved, aiming to raise up to 1.778 billion yuan for various technology projects [10] - The funds will be used for the development and industrialization of Wi-Fi 7 router chips and AI edge chips [10] Group 5: Zhonghua Equipment Acquisition - Zhonghua Equipment plans to issue shares to acquire 100% equity of two companies, enhancing its capabilities in rubber machinery and chemical equipment [13] - The transaction is expected to constitute a major asset restructuring [13] Group 6: Company Leadership Changes - Jiangshan Co. elected Wang Li as the new chairman and appointed Meng Changchun as the new general manager following leadership adjustments [22] - The previous chairman, Xue Jian, will continue to provide consulting and advisory services as the honorary chairman [22]

关于合肥晶合集成电路股份有限公司 拟对外投资暨关联交易的核查意见 中国国际金融股份有限公司（以下简称"保荐机构"）作为合肥晶合集成电路股份 有限公司（以下简称"晶合集成"或"公司"）首次公开发行股票并在科创板上市的保荐 机构，根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》 《上海证券交易所科创板上市公司自律监管指引第 1 号——规范运作》等法律法规的 有关规定，对晶合集成拟对外投资暨关联交易的事项进行了审慎核查，具体核查情况 及意见如下： 一、关联交易概述 中国国际金融股份有限公司 （一）交易概述 近年来，我国半导体产业快速发展，光刻掩模版（以下简称"光罩"）作为半导体 制造中光刻工艺的核心图形母版，是集成电路制造的关键材料之一，其重要性日益凸 显，且市场对高性能、高精度光刻掩模版的需求持续增长。2022年，晶合集成开始建 设光罩生产线项目。2024年7月，晶合集成生产出安徽省首片半导体光刻掩模版，填补 了安徽省在该领域的空白。 根据公司发展战略规划，晶合集成拟将光罩业务从公司的现有业务中划分出来独 立运营，规划设立安徽晶镁光罩有限公司（以下简称"安徽晶镁"或"标的公司"）建 设光罩 ...