合肥晶合集成电路股份有限公司监事会 关于公司 2025 年限制性股票激励计划首次授予 激励对象名单（截至首次授予日）的核查意见 合肥晶合集成电路股份有限公司（以下简称"公司"）于 2025 年 6 月 26 日 召开第二届监事会第十三次会议，审议通过了《关于向 2025 年限制性股票激励 计划激励对象首次授予限制性股票的议案》。监事会依据《中华人民共和国公司 法》（以下简称"《公司法》"）、《中华人民共和国证券法》《国有控股上市公司(境 内)实施股权激励试行办法》《关于规范国有控股上市公司实施股权激励制度有关 问题的通知》《上市公司股权激励管理办法》（以下简称"《管理办法》"）、《上海 证券交易所科创板股票上市规则》（以下简称"《上市规则》"）、《科创板上市公司 自律监管指南第 4 号——股权激励信息披露》等相关法律、行政法规、规范性文 件及《合肥晶合集成电路股份有限公司章程》（以下简称"《公司章程》"）的有关 规定，对公司 2025 年限制性股票激励计划（以下简称"本激励计划"）截至首次 授予日的激励对象名单进行审核，发表核查意见如下： （4）具有《公司法》规定的不得担任公司董事、高级管理人员情形的； （5 ...

Core Viewpoint - On June 20, a total of 9 stocks on the Sci-Tech Innovation Board experienced block trading, with a cumulative transaction amount of 77.84 million yuan [1][2]. Group 1: Trading Overview - There were 14 block trades executed, totaling 3.64 million shares and an aggregate transaction value of 77.84 million yuan [1]. - The stock with the highest transaction amount was Hongsoft Technology, with 2 block trades totaling 448,000 shares and a transaction value of 17.92 million yuan [1]. - Other notable stocks in terms of transaction value included Zhuhai Guanyu and Delong Laser, with transaction amounts of 15.83 million yuan and 9.48 million yuan, respectively [1]. Group 2: Price and Performance Analysis - The average discount rates for block trades relative to the closing prices were highest for Zhongyou Technology, Hongsoft Technology, and Chengdu Xian Dao, with discount rates of 13.40%, 10.25%, and 9.49% respectively [1]. - The only stock with a premium was Transsion Holdings, which had a premium rate of 1.96% [1]. - The Sci-Tech 50 Index fell by 0.53%, with 170 stocks rising, accounting for 28.91% of the total [1]. - Among the stocks involved in block trading, the average decline was 2.04%, with Delong Laser and Jinghe Integration showing gains of 2.86% and 0.41%, while Zhongyou Technology, Jingye Intelligent, and Ankai Micro experienced declines of 7.58%, 3.87%, and 3.51% respectively [1]. Group 3: Institutional Participation - Among the block trades, there were 5 transactions involving institutional buyers or sellers across 4 stocks [2]. - The leading stocks for institutional buying were Hongsoft Technology and Delong Laser, with amounts of 10.92 million yuan and 9.48 million yuan respectively [2]. - The stocks with the highest institutional selling amounts were Zhongyou Technology and Jingye Intelligent, with amounts of 8.40 million yuan and 2.00 million yuan respectively [2]. Group 4: Capital Flow - Two stocks saw net inflows of capital, with Hongsoft Technology and Jinghe Integration receiving net inflows of 234,790 yuan and 1,310 yuan respectively [2]. - Conversely, the stocks with the highest net outflows included Zhongyou Technology, Chengdu Xian Dao, and Ankai Micro, with net outflows of 49.71 million yuan, 11.33 million yuan, and 10.03 million yuan respectively [2].

Core Insights - The "Eight Articles" of the Sci-Tech Innovation Board have revitalized the capital market ecosystem, with significant growth in M&A activities and IPOs for unprofitable companies [1] - Since the release of the "Eight Articles," there have been 106 new M&A transactions on the Sci-Tech Innovation Board, with 60 completed and a total transaction value exceeding 140 billion yuan [1] - Institutional innovations are strengthening the connection between "hard tech" companies and the capital market, enhancing the flexibility of capital to promote technological advancements [1] Group 1: Company Responses to "Eight Articles" - Baili Tianheng's chairman highlighted that the "Eight Articles" have deepened reforms and increased support for high-quality development of unprofitable companies, allowing for successful IPOs even before profitability [1] - Jinghe Integrated's chairman noted that the "Eight Articles" have improved financing efficiency and innovation mechanisms, enabling the company to issue 2 billion yuan in technology innovation bonds [2] - Chip Origin's chairman mentioned that the "Eight Articles" support refinancing for R&D, allowing the company to accelerate its strategic layout in Chiplet technology [3] Group 2: Recommendations for Future Reforms - Tianyue Advanced's chairman expressed the need for more long-term capital to focus on outstanding Sci-Tech Innovation Board companies and suggested enhancing the inclusivity of capital operations for hard tech companies [7] - Du Jinhao from Ailis proposed increasing liquidity by attracting more long-term funds and promoting international connectivity for quality Sci-Tech enterprises [7] - The emphasis on improving corporate governance and enhancing profitability through cash dividends was also highlighted as a key area for development [4]

公司公告汇总 晶合集成发布了关于差异化分红送转特殊除权除息事项的核查意见以及2024年年度权益分派实施公告。 根据公告，公司拟向全体股东每10股派发现金红利1.00元，不送红股，不进行公积金转增股本。实际参 与分配的股本数为1,944,046,657股，合计拟派发现金红利194,404,665.70元。股权登记日为2025年6月18 日，除权（息）日和现金红利发放日均为2025年6月19日。公司总股本2,006,135,157股，扣除回购专用 证券账户中股份数62,088,500股。差异化分红方案中，公司回购的股份不享有利润分配权利。本次分红 除权除息参考价格为前收盘价格减去0.0969元/股。红利委托中国结算上海分公司派发，扣税方面，自 然人股东及证券投资基金根据持股期限不同，实际税负分别为20%、10%或暂免征收个人所得税。对于 QFII股东，公司代扣代缴税率为10%的现金红利所得税。香港联合交易所投资者通过"沪股通"持有本公 司股票的，本公司按照10%的税率代扣所得税。其他机构投资者和法人股东每股实际派发现金红利为税 前人民币0.10元。咨询方式：证券事务部，联系电话0551-62637000转6126 ...

证券代码：688249 证券简称：晶合集成 公告编号：2025-032 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容的 真实性、准确性和完整性依法承担法律责任。 重要内容提示： 每股现金红利0.10元（含税） ● 相关日期 ■ 一、通过分配方案的股东会届次和日期 合肥晶合集成电路股份有限公司 本次利润分配方案经合肥晶合集成电路股份有限公司（以下简称"公司"）2025年5月28日的2024年年度 股东会审议通过。 二、分配方案 1.发放年度：2024年年度 2.分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任公司上海分公司（以下简 称"中国结算上海分公司"）登记在册的本公司全体股东（公司回购专用证券账户除外）。 根据《中华人民共和国公司法》《中华人民共和国证券法》《上海证券交易所上市公司自律监管指引第 7号一一回购股份》等相关法律、行政法规、部门规章及其他规范性文件以及《公司章程》的有关规 定，公司回购的股份不享有股东会表决权、利润分配、公积金转增股本、认购新股和配股等权利。 3.差异化分红送转方案： （1 ...

证券代码：688249 证券简称：晶合集成 公告编号：2025-032 合肥晶合集成电路股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 股权登记日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | | 2025/6/18 | 2025/6/19 | 2025/6/19 | 一、 通过分配方案的股东会届次和日期 本次利润分配方案经合肥晶合集成电路股份有限公司（以下简称"公司"）2025 年 5 月 28 日的2024年年度股东会审议通过。 二、 分配方案 1. 发放年度：2024年年度 2. 分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东 （公司回购专用证券账户除外）。 是否涉及差异化分红送转：是 每股分配比例 每股现金红利0.10元（含税） 相关日期 表决权、利润分配、公积金转增股本、认购新股和配股等权利。 3. 差异化分红 ...

中国国际金融股份有限公司 根据《公司法》《证券法》《上海证券交易所上市公司自律监管指引第 7 号 -- 回购股份》等相关法律法规、规范性文件以及《公司章程》的有关规定, 上述公司回购的股份不享有股东会表决权、利润分配、公积金转增股本、认购新 股和配股等权利。因此，公司 2024年度利润分配实施差异化分红。 关于合肥晶合集成电路股份有限公司 差异化分红送转特殊除权除息事项的核查意见 中国国际金融股份有限公司(以下简称"中金公司"或"保荐机构")作为 合肥晶合集成电路股份有限公司(以下简称"晶合集成"或"公司")首次公开 发行股票并在科创板上市的保荐机构,根据《中华人民共和国公司法》(以下简 称"《公司法》")、《中华人民共和国证券法》(以下简称"《证券法》")、《证券发 行上市保荐业务管理办法》《上海证券交易所科创板股票上市规则》《上海证券交 易所上市公司自律监管指引第 7 号 -- 回购股份》等有关规定,对晶合集成差异 化分红送转特殊除权除息事项进行了审慎核查,具体情况如下: 一、本次差异化分红的原因 2023 年 12 月 22 日，公司召开了第一届董事会第二十三次会议，审议通过 了《关于以集中竞价交易方式 ...

Core Insights - The Bluetooth chip market is experiencing significant growth, with global shipments increasing from 4.2 billion units in 2018 to 5.3 billion units in 2022, representing a compound annual growth rate (CAGR) of 5.99%. It is projected to reach approximately 5.9 billion units by 2024 [1][14]. - The market is characterized by a strong international presence, with Nordic, Dialog, and Texas Instruments holding a combined 61% share of the global BLE chip market. Chinese companies are emerging through differentiated strategies, focusing on low-power Bluetooth chips and specific application scenarios [1][14]. - The Bluetooth chip industry is expected to penetrate various applications, including smart industrial devices, automotive equipment, smart city solutions, and smart home technologies, driving rapid growth in the Chinese Bluetooth chip sector [1][14]. Industry Overview - Bluetooth chips are integrated circuits that enable short-range wireless communication, applicable in audio transmission, data transfer, and location services. They can be categorized into classic Bluetooth chips and BLE (low-energy) chips [4][15]. - The industry has evolved since the 1990s, with significant advancements driven by the rise of IoT, autonomous driving, and 5G technologies, leading to a high growth phase starting in 2017 [6][15]. Market Dynamics - The Bluetooth chip industry value chain consists of upstream resource providers, midstream chip manufacturers, and downstream users. Upstream includes design tool suppliers and wafer manufacturers, while midstream focuses on Bluetooth chip manufacturers providing various products [8][15]. - The Chinese Bluetooth chip industry is still in its early stages but holds substantial growth potential, especially with the advent of the metaverse era [1][14]. Key Players - Notable companies in the Bluetooth chip sector include: - **Yuchip Technology**: Focuses on low-power AIoT chip design, with significant revenue from smart audio SoC chips [29]. - **Hengxuan Technology**: Specializes in low-power wireless computing SoC chips, with a strong presence in smart wearable and home markets [31]. - **Zhongke Blue Communication**: Engages in wireless audio SoC chip development, covering various product lines [28][31]. - **Tai Ling Microelectronics**: Recently went public, focusing on low-power Bluetooth and Zigbee technology chips [28]. - **Jieli Technology**: Concentrates on system-level chips for audio and wearable devices [28]. Future Trends - The industry is expected to see technological innovations that enhance performance, including higher bandwidth and lower latency, driven by the adoption of Bluetooth 5.4 and subsequent versions [33]. - Application scenarios are diversifying beyond traditional consumer electronics into smart homes, wearables, and automotive electronics, with increasing demand for reliable solutions in B2B markets [34]. - Domestic Bluetooth chip companies are strengthening collaborations across the supply chain, aiming for a complete ecosystem from design to application, with a noticeable trend towards domestic substitution in the face of international competition [35].

Group 1 - The China Securities Index Strategic Emerging Industries Index (CSI Strategic Emerging, 932266) experienced a decline of 1.31%, closing at 1373.82 points with a trading volume of 18.306 billion [1] - Over the past month, the CSI Strategic Emerging Industries Index has increased by 2.28%, but it has decreased by 5.17% over the last three months and is down 0.40% year-to-date [1] - The index is customized by China Chengtong Holdings Group and includes 50 state-owned enterprises with significant growth potential from the strategic emerging industries [1] Group 2 - The top ten holdings of the CSI Strategic Emerging Industries Index are: Northern Huachuang (10.89%), BOE Technology Group (9.45%), China Aluminum (8.97%), Shengyi Technology (5.46%), Goldwind Technology (4.23%), China Power (4.0%), Shenghe Resources (3.04%), Jingfang Technology (2.83%), Jinghe Integration (2.73%), and Aerospace Rainbow (2.57%) [1] - The market share of the index holdings is distributed as follows: Shenzhen Stock Exchange 50.94%, Shanghai Stock Exchange 48.28%, and Beijing Stock Exchange 0.78% [1] Group 3 - The industry composition of the index holdings is as follows: Information Technology 45.31%, Industrials 29.35%, Materials 16.90%, Communication Services 4.22%, Utilities 2.04%, Consumer Staples 1.75%, and Health Care 0.43% [2] - The index samples are adjusted biannually, with adjustments implemented on the next trading day following the second Friday of June and December [2] - Weight factors are generally fixed until the next scheduled adjustment, with special circumstances allowing for temporary adjustments [2]

Core Insights - The global wafer foundry industry experienced a 5.4% quarter-over-quarter decline in total revenue for Q1 2025, amounting to $36.403 billion, but showed a significant year-over-year growth of 24.8% [1] - The traditional seasonal slowdown in the wafer foundry industry was somewhat mitigated this year due to uncertainties in international conditions prompting downstream customers to stock up inventory and China's ongoing trade-in policy [1] Industry Performance - Despite facing seasonal challenges, the wafer foundry industry demonstrated resilience, with expectations for revenue growth in Q2 2025 driven by the launch of new smartphone models and stable demand from AI and HPC sectors [4] - The top ten global wafer foundries accounted for 97% of the market share in Q1 2025, with a total revenue of $36.403 billion [2] Company Rankings - TSMC led the market with a revenue of $25.517 billion in Q1 2025, despite a 5.0% decline from Q4 2024, maintaining a market share of 67.6% [2] - Samsung's revenue fell by 11.3% to $2.893 billion, resulting in a market share of 7.7% [2] - SMIC reported a slight revenue increase of 1.8% to $2.247 billion, raising its market share to 6.0% [2] - Vanguard's capacity utilization was above average due to customer stockpiling, while Tower Semiconductor faced significant seasonal impacts and did not benefit from China's subsidy policies [4]