Group 1 - The core viewpoint of the news is the performance of the China Securities Index, which reflects the overall performance of representative state-owned enterprises in strategic emerging industries [1][2] - The China Securities Index for strategic emerging industries increased by 1.61% to 1349.56 points, with a trading volume of 14.663 billion yuan [1] - Over the past month, the index has risen by 0.59%, but it has decreased by 6.91% over the past three months and by 4.98% year-to-date [1] Group 2 - The index is customized by China Chengtong Holdings Group and includes 50 state-owned enterprises with high growth potential from the strategic emerging industries [1] - The top ten holdings in the index are: Northern Huachuang (11.31%), BOE Technology Group (9.49%), China Aluminum (8.81%), Shengyi Technology (5.47%), Goldwind Technology (4.36%), China Power (4.06%), Jingfang Technology (2.94%), Jinghe Integration (2.8%), Shenghe Resources (2.77%), and Aerospace Rainbow (2.47%) [1] - The market distribution of the index holdings shows that the Shenzhen Stock Exchange accounts for 51.52%, the Shanghai Stock Exchange for 47.69%, and the Beijing Stock Exchange for 0.79% [1] Group 3 - In terms of industry composition, the index sample shows that information technology accounts for 45.56%, industrials for 29.62%, materials for 16.55%, communication services for 4.01%, utilities for 2.08%, consumer staples for 1.75%, and healthcare for 0.42% [2] - The index samples are adjusted every six months, with adjustments implemented on the next trading day after the second Friday of June and December [2] - Weight factors are adjusted in accordance with the sample adjustments, and special circumstances may lead to temporary adjustments [2]

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688249 证券简称：晶合集成 公告编号：2025-031 合肥晶合集成电路股份有限公司 关于2025年限制性股票激励计划内幕信息知情人 买卖公司股票情况的自查报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 合肥晶合集成电路股份有限公司（以下简称"公司"）于2025年3月14日召开了第二届董事会第十七次会 议、第二届监事会第十次会议，审议通过了《关于公司〈2025年限制性股票激励计划（草案）〉及其摘 要的议案》等相关议案，并于2025年3月15日在上海证券交易所网站（www.sse.com.cn）披露了相关公 告。 根据《上市公司信息披露管理办法》《上市公司股权激励管理办法》《上海证券交易所科创板股票上市 规则》《科创板上市公司自律监管指南第4号一一股权激励信息披露》等法律、法规及规范性文件的要 求，公司对2025年限制性股票激励计划（以下简称"本激励计划"）采取了充分必要的保密措施，同时对 本激励计划内幕信息知情人进行了登记管理。公司通过中国证券登记结算 ...

证券代码：688249 证券简称：晶合集成 公告编号：2025-031 合肥晶合集成电路股份有限公司 关于 2025 年限制性股票激励计划内幕信息知情人 买卖公司股票情况的自查报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 合肥晶合集成电路股份有限公司（以下简称"公司"）于 2025 年 3 月 14 日 召开了第二届董事会第十七次会议、第二届监事会第十次会议，审议通过了《关 于公司<2025 年限制性股票激励计划（草案）>及其摘要的议案》等相关议案， 并于 2025 年 3 月 15 日在上海证券交易所网站（www.sse.com.cn）披露了相关公 告。 根据《上市公司信息披露管理办法》《上市公司股权激励管理办法》《上海证 券交易所科创板股票上市规则》《科创板上市公司自律监管指南第 4 号——股权 激励信息披露》等法律、法规及规范性文件的要求，公司对 2025 年限制性股票 激励计划（以下简称"本激励计划"）采取了充分必要的保密措施，同时对本激励 计划内幕信息知情人进行了登记管理。公司通过中国证券登记结算有限责任 ...

本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 5 月 28 日 （二） 股东会召开的地点：安徽省合肥市新站区合肥综合保税区内西淝河路 88 号公司会议室 证券代码：688249 证券简称：晶合集成 公告编号：2025-030 合肥晶合集成电路股份有限公司 2024年年度股东会决议公告 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 495 | | --- | --- | | 普通股股东人数 | 495 | | 2、出席会议的股东所持有的表决权数量 | 1,235,849,954 | | 普通股股东所持有表决权数量 | 1,235,849,954 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 63.5710 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 63.5 ...

上海市徐汇区淮海中路999号 =海环贸广场写字楼一期17层 邮编:200031 17/F, One ICC, Shanghai ICC 999 Huai Hai Road (M) Shanghai, 200031 P.R. China 北京市金杜律师事务所上海分所 关于合肥晶合集成电路股份有限公司 2024年年度股东会 的法律意见书 致:合肥晶合集成电路股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受合肥晶合集成电路股份有 限公司（以下简称公司或晶合集成）委托,根据《中华人民共和国证券法》（以下简 称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券监 督管理委员会《上市公司股东会规则（2025 修订）》（以下简称《股东会规则》）等 中华人民共和国境内(以下简称中国境内,为本法律意见书之目的,不包括中国香港 特别行政区、中国澳门特别行政区和中国台湾地区）现行有效的法律、行政法规、规 章和规范性文件和现行有效的《合肥晶合集成电路股份有限公司公司章程》（以下简 称《公司章程》）有关规定,指派律师出席公司于 2025年 5 月 28日召开的 2024 年年 度股东会（以下简称本次股 ...

Group 1 - The Shanghai Stock Exchange National New Sci-Tech Board State-Owned Enterprises Index (950253) opened lower and fluctuated, down 0.22% to 962.8 points, with a trading volume of 9.947 billion [1] - Over the past month, the index has decreased by 0.54%, by 9.92% over the past three months, and by 1.03% year-to-date [1] - The index is composed of state-owned enterprises listed on the Sci-Tech Board or companies with state capital participation without actual control, reflecting the overall performance of state-owned enterprises on the Sci-Tech Board [1] Group 2 - The top ten weights in the index are: China Resources Microelectronics (6.11%), Haiguang Information (5.67%), Western Superconducting (5.54%), Huahai Qingshi (5.29%), SMIC (5.14%), Jinghe Integrated (3.97%), Zhongwei Company (3.83%), Huahong Semiconductor (3.75%), Zhongke Star Map (3.56%), and China Communication Signal (3.18%) [1] - The index's holdings are entirely from the Shanghai Stock Exchange, with a sector breakdown of 53.68% in Information Technology, 30.17% in Industry, 9.97% in Materials, 3.54% in Healthcare, and 2.65% in Communication Services [1] Group 3 - The index sample is adjusted every six months, with adjustments implemented on the next trading day following the second Friday of June and December [2] - Weight factors are generally fixed until the next scheduled adjustment, with temporary adjustments made under special circumstances [2]

Core Insights - The Chinese semiconductor materials industry is facing both strategic opportunities and transformation challenges amid a global semiconductor industry restructuring [1] - The report by Deloitte outlines the upgrade path for the semiconductor materials industry driven by policy incentives, technological breakthroughs, and emerging market demands [1] Group 1: Policy and Market Opportunities - The domestic semiconductor materials sector is experiencing significant growth opportunities due to downstream capacity expansion and localization policies [2] - The establishment of the National Integrated Circuit Industry Investment Fund Phase III, with a scale exceeding 300 billion yuan, is injecting vital support into the industry [2] - Tax incentives, such as income tax reductions and R&D expense deductions, are helping companies lower operational costs [2] - The construction of 12-inch wafer fabs by companies like SMIC and Hua Hong Semiconductor is accelerating the upgrade of the semiconductor materials industry [2] Group 2: Emerging Market Demands - There is a surging demand for high-performance semiconductor materials in sectors like electric vehicles, 5G communication, and AI [2] - The application of silicon carbide (SiC) in electric vehicle inverters is witnessing continuous growth [2] Group 3: Competitive Landscape and Challenges - The pressure from U.S. tariffs is pushing companies to shift towards local supply chains, creating space for domestic materials [3] - Domestic mature process materials, such as silicon carbide wafers, are priced at only one-third of international counterparts, attracting global orders to China [3] - The semiconductor materials industry faces long R&D and industrialization cycles, with initial high depreciation costs impacting short-term profitability [3] Group 4: Future Market Projections - The semiconductor materials market is expected to exceed its 2022 size by 2025, driven by emerging applications in electric vehicles, smart driving, AI, and green energy [4] - The global silicon carbide materials market is projected to surpass 6 billion USD by 2025, with automotive applications accounting for over 30% [5] Group 5: Technological Advancements - Key breakthroughs in areas like photoresists and wet electronic chemicals are anticipated within the next three to five years [5] - The National Integrated Circuit Industry Investment Fund Phase III has earmarked over 50 billion yuan for critical material R&D and industrialization [5] - Domestic companies are achieving technological breakthroughs in high-end wet electronic chemicals, such as electronic-grade phosphoric acid and sulfuric acid [5] Group 6: Market Entry and Global Expansion - The rapid development of the domestic semiconductor industry is creating more market space for new entrants, particularly in low localization sectors like photoresists and electronic specialty gases [6] - To penetrate international markets, companies need to overcome high-end material challenges and establish certification barriers while expanding global resource layouts [6]

首次授予激励对象名单的审核意见及公示情况说明 证券代码：688249 证券简称：晶合集成 公告编号：2025-029 合肥晶合集成电路股份有限公司 监事会关于公司 2025 年限制性股票激励计划 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 合肥晶合集成电路股份有限公司（以下简称"公司"）于 2025 年 3 月 14 日 召开了第二届董事会第十七次会议、第二届监事会第十次会议，审议通过了《关 于公司<2025 年限制性股票激励计划（草案）>及其摘要的议案》等相关议案， 根据《上市公司股权激励管理办法》 （以下简称" 《管理办法》"）、 《上海证券交易 所科创板股票上市规则》 （以下简称"《上市规则》"）、 《科创板上市公司自律监管 指南第 4 号——股权激励信息披露》（以下简称"《监管指南》"）等法律法规的 相关规定，公司对 2025 年限制性股票激励计划首次授予激励对象名单在公司内 部进行了公示。公司监事会结合公示情况对拟激励对象进行了核查，相关公示情 况及核查情况如下： 一、公示情况说明及核查方式 公司于 2025 ...

Core Points - The company, Hefei Jinghe Integrated Circuit Co., Ltd., is preparing for its 2024 annual shareholders' meeting, focusing on various proposals including the 2025 restricted stock incentive plan and the confirmation of related party transactions for 2024 [1][2][3] Meeting Procedures - Shareholders and their representatives must sign in at least half an hour before the meeting, presenting necessary identification and documentation [2][3] - The meeting will follow a structured agenda, allowing shareholders to exercise their rights to speak, inquire, and vote [2][3][4] - Voting will be conducted both on-site and online, with results announced after the meeting [4][5] Proposals Overview - Proposal 1: Revision of the company's articles of association and related registration matters [6][9] - Proposal 2: Amendments to governance rules to enhance corporate governance [9] - Proposal 3: Termination of certain fundraising projects and reallocation of funds to other projects, specifically increasing investment in the 28nm logic and OLED chip process platform project [10][15] - Proposal 4: Implementation of the 2025 restricted stock incentive plan to attract and retain talent [16][19] - Proposal 5: Establishment of assessment management measures for the 2025 restricted stock incentive plan [18] - Proposal 6: Authorization for the board to manage the 2025 restricted stock incentive plan [19] - Proposal 7: Approval of the 2024 annual report and summary [21] - Proposal 8: Approval of the 2024 financial settlement report [22] - Proposal 9: Approval of the 2025 financial budget [22] - Proposal 10: Profit distribution plan for 2024, proposing a cash dividend of 1.00 yuan per 10 shares [22][23] - Proposal 11: Presentation of the 2024 board work report [24] - Proposal 12: Presentation of the 2024 supervisory board work report [25] - Proposal 13: Presentation of the 2024 independent directors' performance reports [25] - Proposal 14: Anticipated related party transactions for 2025 and confirmation of 2024 transactions [25]

合肥晶合集成电路股份有限公司 2024 年年度股东会会议资料 证券代码：688249 证券简称：晶合集成 合肥晶合集成电路股份有限公司 2024 年年度股东会 会议资料 2025 年 5 月 | | | | | | 为维护广大投资者的合法权益，确保合肥晶合集成电路股份有限公司（以下 简称"公司"或"晶合集成"）股东会的正常秩序和议事效率，保障股东在本次 股东会期间依法行使权利，根据《中华人民共和国公司法》（以下简称"《公司 法》"）、《中华人民共和国证券法》（以下简称"《证券法》"）、《上市公 司股东会规则》以及《合肥晶合集成电路股份有限公司章程》（以下简称"《公 司章程》"）、《合肥晶合集成电路股份有限公司股东大会议事规则》（以下简 称"《股东大会议事规则》"）等相关规定，特制定本会议须知： 一、公司负责本次股东会的议程安排和会务工作，为确认出席会议的股东或 其代理人或其他出席者的出席资格，会议工作人员将对出席会议者的身份进行必 要的核对工作，请被核对者给予配合。 二、出席会议的股东及股东代理人须在会议召开前半小时到会议现场办理签 到手续，并按规定出示证券账户卡、身份证明文件或营业执照/注册证书复印件 （加 ...