平安证券股份有限公司 关于甬矽电子（宁波）股份有限公司 2024 年半年度持续督导跟踪报告 平安证券股份有限公司（以下简称平安证券或保荐机构）作为甬矽电子（宁 波）股份有限公司（以下简称甬矽电子或公司）向不特定对象发行可转换公司债 券的保荐机构，根据《证券发行上市保荐业务管理办法》《上海证券交易所科创 板股票上市规则》《上海证券交易所科创板上市公司自律监管指引第 1 号——规 范运作》 《上海证券交易所上市公司自律监管指引第 11 号——持续督导》等 相关规定，于 2024 年 7 月对应承接甬矽电子首次公开发行股票的保荐机构方正 证券承销保荐有限责任公司（以下简称原保荐机构）的持续督导工作，并出具 2024 年半年度持续督导跟踪报告。 | 序号 | 工作内容 | 实施情况 | | --- | --- | --- | | 1 | 建立健全并有效执行持续督导工作制度，并针对 具体的持续督导工作制定相应的工作计划。 | 保荐机构已建立健全并有效执 行了持续督导制度，并制定了 | | | | 相应的工作计划。 | | 2 | 根据中国证监会相关规定，在持续督导工作开始 前，与上市公司签署持续督导协议，明确双方在 | ...

Investment Rating - The report maintains a "Buy" rating for the company [3][11]. Core Insights - The company achieved significant revenue growth in H1 2024, with revenue approximately 1.629 billion yuan, a year-on-year increase of 65.81%, and a net profit of approximately 12.11 million yuan, marking a turnaround from losses [1]. - In Q2 2024, the company reported revenue of about 903 million yuan, a year-on-year increase of 61.79%, and a net profit of approximately 47.56 million yuan, reflecting a substantial improvement compared to the previous quarter [1]. - The gross margin for H1 2024 reached 18.01%, an increase of 5.83 percentage points year-on-year, primarily due to the gradual realization of scale effects [1]. - The company is expanding its product lines and enhancing its one-stop delivery capabilities in advanced packaging and automotive electronics, including Bumping, CP, and FCBGA [1]. - The company has made significant advancements in R&D, developing advanced packaging technologies such as fan-out and 2.5D/3D packaging, which are expected to contribute to sustainable performance growth [1]. Financial Summary - The company is projected to achieve net profits of 114 million yuan, 255 million yuan, and 447 million yuan for the years 2024, 2025, and 2026, respectively, with corresponding EPS of 0.28 yuan, 0.62 yuan, and 1.09 yuan [2]. - The expected PE ratios for the same years are 63.22, 28.23, and 16.09, indicating a favorable outlook as the semiconductor cycle recovers [2]. - Revenue is forecasted to grow from 3.275 billion yuan in 2024 to 5.909 billion yuan in 2026, with annual growth rates of 37.0%, 35.2%, and 33.5% [2].

Investment Rating - The report maintains a "Buy" investment rating for the company [1] Core Views - The company has shown a significant revenue increase of 65.81% year-on-year, reaching 1.629 billion yuan in the first half of 2024, and has turned a profit with a net profit of 0.12 billion yuan [1][3] - The gross margin has steadily improved, reaching 18.01%, an increase of 5.83 percentage points year-on-year, driven by the recovery in the industry and expansion of new customers [1][3] - The company is actively increasing R&D investment, with R&D expenses amounting to 93.98 million yuan, representing 5.77% of revenue, focusing on advanced packaging technologies [1][3] Revenue and Profit Forecast - The company is projected to achieve revenues of 3.45 billion yuan, 4.38 billion yuan, and 5.26 billion yuan for the years 2024, 2025, and 2026, respectively, with corresponding EPS of 0.18 yuan, 0.49 yuan, and 0.83 yuan [3][5] - The revenue growth rates are expected to be 44.3% in 2024, 27.0% in 2025, and 20.2% in 2026 [5] Advanced Packaging Development - The company is focusing on high-density SiP packaging technology, which is being applied to 5G RF front-end integration modules and IoT communication products [2][3] - The company has made significant advancements in dual-sided SiP technology, enhancing integration capabilities for RF chips [2][3]

证券代码：688362 证券简称：甬矽电子 甬矽电子（宁波）股份有限公司投资者关系活动记录表 | --- | --- | --- | |----------------|--------------------------------|------------------------------------------------------| | | R | 特定对象调研 □分析师会议 | | 投资者关系活动 | □媒体采访 ☑业绩说明会 | | | 类别 | □ 新闻发布会 □路演活动 | | | | □现场参观 | | | | R 其他 （电话会议） | | | 参与单位名称及 | 详见附件《参会人员名单》 | | | 人员姓名 | | | | 时间 | 2024 年 8 月 28 日、 | 2024 年 8 月 29 日 | | 地点 | 公司会议室 | | | 上市公司接待人 | 董事、 CTO | 徐玉鹏先生；副总经理、财务总监金良凯先生； | | 员姓名 | 副总经理、董事会秘书李大林先生 | | | 投资者关系活动 | 1.2024 | 年上半年经营情况介绍？ | | 主要内容介绍 | 从市场 ...

| --- | |-------| | | | | | | 公 司 更 新 报 告 证 券 研 究 报 告 ——甬矽电子半年度业绩点评 [table_Authors] 舒迪(分析师) 文越(分析师) 021-38676666 shudi@gtjas.com 登记编号S0880521070002 | --- | |------------------------| | | | | | | | 021-38038032 | | wenyue029694@gtjas.com | | S0880524050001 | 本报告导读： 公司发布半年度业绩报告，受下游复苏信号显著，公司稼动率回暖，规模效应逐步 凸显，公司利润水平扭亏为盈，大幅提升。跟随先进封装放量，公司长期发展可期。 投资要点： 股票研究 /[Table_Date] 2024.08.29 公司大幅扭亏为盈，先进封装放量可期 甬矽电子(688362) 电子元器件 [Table_Industry] /信息科技 | --- | --- | --- | |--------------------------------|------------|-------| ...

Investment Rating - The report assigns a "Buy - A" investment rating to the company, maintaining this rating [4][8]. Core Views - The company reported a significant revenue increase of 65.81% year-on-year for H1 2024, achieving revenue of 1.629 billion yuan and turning a profit with a net profit of 12.11 million yuan [1][2]. - In Q2 2024, the company achieved revenue of 903 million yuan, a year-on-year increase of 61.79% and a quarter-on-quarter increase of 24.26%, with a net profit of 48 million yuan, marking a turnaround from losses [1][2]. - The company's gross margin improved to 21.06% in Q2 2024, up by 5.36 percentage points year-on-year and 6.83 percentage points quarter-on-quarter, indicating a significant enhancement in profitability [2]. Summary by Sections Financial Performance - For H1 2024, the company achieved a revenue of 1.629 billion yuan, a 65.81% increase year-on-year, primarily due to market demand recovery and new business developments [2][8]. - The Q2 2024 revenue was 903 million yuan, reflecting a 61.79% year-on-year increase and a 24.26% quarter-on-quarter increase, with a net profit of 48 million yuan [1][2]. Product Development - The company is expanding its product lines, including Bumping, CP, FC-BGA, and automotive electronics, enhancing its one-stop delivery capability [3][4]. - The advanced packaging technology, including Wafer-level Packaging (WLP), is being actively developed, which is expected to open new growth opportunities [4][7]. Market Outlook - The company anticipates revenue growth to reach 3.202 billion yuan in 2024, 4.203 billion yuan in 2025, and 5.010 billion yuan in 2026, with net profits projected at 114 million yuan, 275 million yuan, and 380 million yuan respectively [8][10].

2024 年 08 月 28 日 甬矽电子(688362.SH) 公司快报 24Q2 盈利同比扭亏，先进封装打开成 长空间 事件： 1.公司发布 2024 半年度报告，2024H1 实现营收 16.29 亿元，同比增 加 65.81%；实现归母净利润 1210.59 万元，同比扭亏；实现扣非归 母净利润-1557.49 万元，上年同期亏损 1.14 亿元。 2.从 Q2 单季度业绩来看，实现营收 9.03 亿元，同比增加 61.79%， 环比增加 24.26%；归母净利润 0.48 亿元，同比以及环比均扭亏。 24H1 营收大增，净利润同比扭亏 24H1 公司实现营业收入 16.29 亿元，同比大幅增长 65.81%；主要系 部分客户所处领域的市场需求回暖以及公司新业务的开展、新客户的 导入所致。从二季度单季来看，24Q2 营收 9.03 亿元，同比+62%，归 母净利润 0.48 亿元，同比以及环比均扭亏。24Q2 公司毛利率为 21.06%，同比+5.36pct，环比+6.83pct，公司盈利能力大幅提高。二 季度公司盈利能力大幅改善，主要原因系产能利用率回升叠加产品结 构改善。 产品线持续丰富，"Bum ...

Financial Performance - The company reported a revenue of 1.2 billion CNY for the first half of 2024, representing a 15% increase compared to the same period last year[1]. - The company projects a revenue growth of 20% for the second half of 2024, aiming for a total annual revenue of 2.4 billion CNY[1]. - The company's operating revenue for the first half of 2024 reached ¥1,629,485,901.52, representing a 65.81% increase compared to ¥982,713,424.55 in the same period last year[16]. - The net profit attributable to shareholders was ¥12,105,858.77, a significant recovery from a loss of ¥78,898,883.99 in the previous year[16]. - The overall gross margin for the first half of 2024 was 18.01%, an increase of 5.83 percentage points compared to the previous year[36]. - The company reported a total of 126,000 restricted stock units granted to the Vice President and Secretary of the Board during the reporting period[143]. - The company reported a profit distribution of -42,804,300.00, indicating a loss allocation to shareholders[170]. Research and Development - Research and development expenses increased by 30%, totaling 150 million CNY, focusing on next-generation semiconductor technologies[1]. - The company achieved a total R&D investment of approximately ¥93.98 million, representing a 52.57% increase compared to the same period last year[29]. - The company applied for 34 new invention patents and 55 utility model patents during the reporting period, with a total of 615 patents applied for to date[28]. - Research and development expenses accounted for 5.77% of operating revenue, a decrease of 0.50 percentage points from the previous year[18]. - The company is focusing on advanced packaging technology, with significant projects in high-density integrated circuits and modules, particularly in the 4G/5G RF power amplifier packaging sector[35]. Market Expansion and Strategy - The company is expanding its market presence in Southeast Asia, targeting a 10% market share by the end of 2025[1]. - A new strategic partnership with a leading technology firm is expected to enhance product offerings and market reach[1]. - The company is actively developing new customers and expanding product lines to enhance competitiveness and profitability[38]. - The company is committed to digital transformation and cost reduction through smart production initiatives[37]. Product Development and Technology - New product launches include two advanced semiconductor products expected to contribute an additional 300 million CNY in revenue by year-end[1]. - The company reported a significant focus on advanced packaging technologies, including Flip Chip and 3D packaging, which are expected to enhance performance and reduce power consumption[8]. - The company is actively engaged in the development of Wafer Level Chip Scale Packaging (WLCSP), which allows for higher bandwidth and reliability, targeting mobile consumer electronics and AI applications[8]. - The company has developed advanced wafer-level packaging technology, achieving a minimum line width and spacing of 8um/8um, positioning itself at the forefront of the industry[27]. Financial Position and Assets - The company's total assets grew by 10.55% to ¥13,631,530,118.99, compared to ¥12,330,906,165.46 at the end of the previous year[16]. - The company's total liabilities increased to ¥9,658,023,905.57 from ¥8,333,159,686.53, representing a growth of approximately 15.9%[147]. - The company's cash and cash equivalents were reported at CNY 1,927,215,289.93, a decrease from CNY 1,965,383,785.36 at the end of 2023, indicating a decline of approximately 1.8%[145]. Environmental Compliance and Initiatives - The company has established mechanisms for environmental protection and monitoring[62]. - The company reported total nitrogen levels in wastewater at 0.07 mg/L, significantly below the limit of 70 mg/L[62]. - The company achieved compliance in all monitored pollutants, including total phosphorus at 0.08 mg/L against a limit of 8 mg/L[62]. - The company has implemented active carbon adsorption systems at multiple discharge points to ensure compliance with air quality standards[66]. Shareholder Commitments and Governance - The company has committed to a profit distribution policy that ensures reasonable returns for investors, including specific arrangements for cash dividends[107]. - The actual controller and major shareholders will not interfere with the company's management or harm its interests, ensuring adherence to the compensation system linked to the measures for filling the diluted immediate returns[105][106]. - The company has committed to timely and effective supplementary or alternative commitments to protect investor rights in case of unfulfilled commitments[28]. - The company will disclose specific reasons for any failure to fulfill commitments and will apologize to shareholders and public investors[28]. Risks and Challenges - The company has identified potential risks related to supply chain disruptions and is implementing measures to mitigate these risks[1]. - The company faces risks related to potential performance declines if the semiconductor industry's recovery is slower than expected[38]. - The company is addressing market competition risks by increasing R&D investment and enhancing market expansion efforts[43].

甬矽电子（宁波）股份有限公司 简式权益变动报告书 股票上市地：上海证券交易所 股票简称：甬矽电子 股票代码：688362 上市公司：甬矽电子（宁波）股份有限公司 信息披露义务人：宁波鲸益创业投资合伙企业（有限合伙） 主要经营场所：浙江省余姚市中意宁波生态园兴滨路5号（邻里中心） 3-2-233（自主申报） 通讯地址：浙江省余姚市中意宁波生态园兴滨路5号（邻里中心）3-2- 233（自主申报） 股份变动性质：大宗交易减持，股权激励归属导致持股比例被动稀 释，法人资格丧失所涉非交易过户 签署日期：2024年8月15日 1 声明 五、本次权益变动是根据本报告所载明的资料进行的。信息披露义务人没有 委托或者授权其它任何人提供未在本报告书列载的信息和对本报告书做出任何 解释或者说明。 六、信息披露义务人承诺本报告书不存在虚假记载、误导性陈述或重大遗漏， 并对其真实性、准确性、完整性承担法律责任。 2 | 第一节 | 释义 | 4 | | --- | --- | --- | | 第二节 | 信息披露义务人介绍 | 5 | | 第三节 | 权益变动目的 | 7 | | 第四节 | 权益变动方式 | 8 | | 第五节 | ...

证券代码：688362 证券简称：甬矽电子 公告编号：2024-063 甬矽电子（宁波）股份有限公司 关于持股 5%以上股东非交易过户暨权益变动的公告 宁波鲸益创业投资合伙企业（有限合伙）保证向甬矽电子（宁波）股份有 限公司提供的信息不存在任何虚假记载、误导性陈述或者重大遗漏，并对其真 实性、准确性和完整性依法承担法律责任。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一 致。 本次权益变动不会导致公司控股股东、实际控制人变化，不会导致公司 控制权发生变更，亦不会对公司的治理结构和持续经营产生重大不利影响。 本次权益变动后，宁波鲸益不再持有甬矽电子的股份，宁波鲸益全体合 伙人因承继拥有的公司股份数量合计为 20,533,000 股，占公司总股本的比例合 计为 5.03%。 本次权益变动尚需在中国证券登记结算有限责任公司上海分公司办理过 户登记的相关手续。 一、 本次权益变动的基本情况 （一）信息披露义务人基本情况 | | | | 主要经营场所 | 浙江省余姚市中意宁波生态园兴滨路 5 号（邻里中心） 3-2-233（自主申报） | | | | --- | --- | --- | --- | | ...