天眼查商业履历信息显示，上海伟测半导体科技股份有限公司，成立于2016年，位于上海市，是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本11383.4777万人民币，实缴资本 5272.5544万人民币。公司法定代表人为骈文胜。 通过天眼查大数据分析，上海伟测半导体科技股份有限公司共对外投资了9家企业，参与招投标项目4 次，知识产权方面有商标信息4条，专利信息68条，此外企业还拥有行政许可19个。 来源：金融界 金融界消息 截至2025年8月14日收盘，伟测科技（688372）报收于63.47元，上涨2.77%，换手率 10.53%，成交量10.88万手，成交金额6.86亿元。 资金流向方面，今日主力资金净流入2036.92万元，占比成交额2.97%。其中，超大单净流入752.43万 元、占成交额1.1%，大单净流入1284.49万元、占成交额1.87%，中单净流出流出312.32万元、占成交额 0.46%，小单净流出1724.61万元、占成交额2.52%。 伟测科技最新一期业绩显示，截至2025一季报，公司营业总收入2.85亿元、同比增长55.39%，归属净利 润2591.82万元，同比 ...

金融界消息 截至2025年7月30日收盘，伟测科技（688372）报收于60.0元，下跌1.41%，换手率4.07%， 成交量4.20万手，成交金额2.53亿元。 天眼查商业履历信息显示，上海伟测半导体科技股份有限公司，成立于2016年，位于上海市，是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本11383.4777万人民币，实缴资本 5272.5544万人民币。公司法定代表人为骈文胜。 通过天眼查大数据分析，上海伟测半导体科技股份有限公司共对外投资了9家企业，参与招投标项目4 次，知识产权方面有商标信息4条，专利信息68条，此外企业还拥有行政许可18个。 来源：金融界 资金流向方面，今日主力资金净流出2582.86万元，占比成交额10.2%。其中，超大单净流入286.04万 元、占成交额1.13%，大单净流出2868.90万元、占成交额11.33%，中单净流出流入573.92万元、占成交 额2.27%，小单净流入2008.93万元、占成交额7.93%。 伟测科技最新一期业绩显示，截至2025一季报，公司营业总收入2.85亿元、同比增长55.39%，归属净利 润2591.82万元，同比增 ...

金融界消息 截至2025年7月29日收盘，伟测科技（688372）报收于60.86元，上涨0.15%，换手率 4.03%，成交量4.16万手，成交金额2.53亿元。 资金流向方面，今日主力资金净流出2152.03万元，占比成交额8.5%。其中，超大单净流出2234.47万 元、占成交额8.83%，大单净流入82.45万元、占成交额0.33%，中单净流出流入828.62万元、占成交额 3.27%，小单净流入1323.41万元、占成交额5.23%。 伟测科技最新一期业绩显示，截至2025一季报，公司营业总收入2.85亿元、同比增长55.39%，归属净利 润2591.82万元，同比增长8577.53%，扣非净利润1417.55万元，同比增长443.64%，流动比率0.986、速 动比率0.978、资产负债率48.67%。 天眼查商业履历信息显示，上海伟测半导体科技股份有限公司，成立于2016年，位于上海市，是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本11383.4777万人民币，实缴资本 5272.5544万人民币。公司法定代表人为骈文胜。 通过天眼查大数据分析，上海伟测半导体科技股份有限 ...

Group 1 - Changshi Capital announced the completion of its hard technology Phase III fund with a total of 728 million yuan raised, supported by university funds including those from Huazhong University of Science and Technology and University of Electronic Science and Technology [1] - The trend of universities establishing mother funds and leveraging alumni resources is accelerating the transformation and industrialization of technological achievements, with "alumni economy" becoming a new link between innovation and implementation [1][8] - A collaborative mechanism involving universities, alumni, venture capital institutions, and local governments is gradually forming within China's technological innovation system, facilitating funding and pathways for early-stage projects [1][6] Group 2 - The national strategy in the semiconductor field has shifted from "inclusive support" to focusing on "small giants" in specific segments, reshaping venture capital institutions' judgment standards and empowerment paths for early-stage technology companies [2] - The first visit of the "alumni enterprise visit" series took place at Weicet Technology, which has become a benchmark in China's third-party integrated circuit testing service sector, showcasing the importance of alumni networks in resource connection and market access [3][4] Group 3 - Changshi Capital has been deeply involved in the hard technology sector and has successfully attracted support from local state-owned financial institutions and industry leaders for its Phase III fund [6][7] - The collaboration between universities and venture capital institutions is evolving into a four-party coordination mechanism that accelerates the industrialization of scientific research achievements [6][8] - The electronic engineering alumni association is exploring the establishment of early-stage angel funds to focus on key technology directions, promoting the incubation and industrialization of research achievements [8][9] Group 4 - The alumni association's activities have shifted from traditional large gatherings to more focused and resource-coordinated platforms, emphasizing the importance of passing on knowledge from experienced alumni to younger generations [8] - The exploration of mechanisms within the alumni association reflects a structural shift in the innovation ecosystem of universities from "research-led" to "implementation-oriented" [8][9] - The collaborative system being developed among universities, alumni, capital, and industry is crucial for the future growth of China's hard technology innovation ecosystem [9]

Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]

Core Points - The report discusses the issuance of convertible bonds by Shanghai Weice Semiconductor Technology Co., Ltd, with the bond code 118055.SH, and highlights the management of bondholder rights by Ping An Securities [1][2] - The bond has a total issuance scale of RMB 1.175 billion, with a maturity period of six years from April 9, 2025, to April 8, 2031 [3][4] - The initial conversion price of the bonds is set at RMB 82.15 per share, which has been adjusted to RMB 62.68 per share due to corporate actions [5][9] Bond Issuance Details - The bond issuance was approved by the board of directors and shareholders' meetings held in April 2024 and January 2025, respectively [2] - The bond has a tiered interest rate structure: 0.10% for the first year, 0.30% for the second year, and 0.60% for the third year [3] - Interest payments will be made annually, with the first payment starting from the issuance date [4][5] Conversion and Adjustment Mechanism - The conversion period for the bonds starts on October 15, 2025, and ends on April 8, 2031 [5][9] - The conversion price can be adjusted based on various corporate actions, including stock dividends and capital increases, following specific formulas outlined in the bond's prospectus [6][7] - The adjusted conversion price reflects the impact of a recent stock incentive plan, resulting in a new price of RMB 62.68 per share [8][9] Credit Rating and Management - The bonds have been rated AA by Zhongjian Pengyuan Credit Rating Co., Ltd, with a stable outlook [6] - The bonds are not secured by any collateral, and the management will continue to monitor the interests of bondholders closely [6][9]

向不特定对象发行可转换公司债券 第三次临时受托管理事务报告 （2025 年度） 受托管理人：平安证券股份有限公司 股票简称：伟测科技 股票代码：688372.SH 债券简称：伟测转债 债券代码：118055.SH 上海伟测半导体科技股份有限公司 二〇二五年七月 二、"伟测转债"基本情况 重要声明 本报告依据《公司债券发行与交易管理办法》《上海伟测半导体科技股份有 限公司向不特定对象发行可转换公司债券受托管理协议》（以下简称《受托管理 协议》）《上海伟测半导体科技股份有限公司向不特定对象发行可转换公司债券 募集说明书》（以下简称《募集说明书》）等相关规定，以及上海伟测半导体科 技股份有限公司（以下简称公司、伟测科技或发行人）出具的相关说明文件以及 提供的相关资料等，由本次债券受托管理人平安证券股份有限公司（以下简称平 安证券）编制。 本报告不构成对投资者进行或不进行某项行为的推荐意见，投资者应对相关 事宜做出独立判断，而不应将本报告中的任何内容据以作为平安证券所作的承诺 或声明。请投资者独立征询专业机构意见，在任何情况下，投资者不能将本报告 作为投资行为依据。 平安证券作为伟测科技向不特定对象发行可转换公司债券 ...

Core Points - The announcement details the results of the second vesting period of the 2023 restricted stock incentive plan for Shanghai Weicai Semiconductor Technology Co., Ltd, with 535,796 shares set to be listed on July 18, 2025 [1][6][8] Group 1: Incentive Plan Overview - The stock listing type is for equity incentive shares, with a total of 535,796 shares available for trading [1][6] - The company completed the share registration for the second vesting period of the 2023 restricted stock incentive plan on July 14, 2025 [1][6] - The incentive plan was approved by the board and shareholders through a series of meetings and disclosures starting from April 19, 2023 [2][4][5] Group 2: Vesting Details - A total of 201 individuals are eligible for the vesting, with the shares distributed among directors, senior management, and other key personnel [6][8] - The number of shares vested for key personnel includes 84,500 shares for the chairman and general manager, and 67,600 shares for other directors [6][8] - The shares are sourced from the company's directed issuance of A-shares to the incentive recipients [6][8] Group 3: Financial Impact - The total share capital after the vesting will increase to 148,943,529 shares, with the newly vested shares accounting for approximately 0.36% of the total [8][9] - The company's net profit for the first quarter of 2025 was reported at 25,918,206.33 yuan, with basic earnings per share of 0.2277 yuan [8][9] - The vesting of shares is not expected to have a significant impact on the company's financial condition or operating results [8][9]

关于调整"伟测转债"转股价格的公告 | 证券代码：688372 | 证券简称：伟测科技 | 公告编号：2025-068 | | --- | --- | --- | | 转债代码：118055 | 转债简称：伟测转债 | | 上海伟测半导体科技股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 调整前转股价格：62.82 元/股 调整后转股价格：62.68 元/股 转股价格调整实施日期：2025 年 7 月 18 日 "伟测转债"的转股期：2025 年 10 月 15 日至 2031 年 4 月 8 日，目前 尚未进入转股期。 一、转股价格的调整依据 重要提示： 上海伟测半导体科技股份有限公司（以下简称"公司"）于 2025 年 7 月 14 日收到中国证券登记结算有限责任公司上海分公司出具的《证券变更登记证明》， 完成了公司 2023 年限制性股票激励计划第二类限制性股票第二个归属期的股份 登记工作，公司授予 201 名激励对象共 535,796 股，使公司总股本由 148,407,733 股变更为 148,94 ...

| 证券代码：688372 | 证券简称：伟测科技 公告编号：2025-067 | | --- | --- | | 转债代码：118055 | 转债简称：伟测转债 | 上海伟测半导体科技股份有限公司 关于 2023 年限制性股票激励计划第二个归属期 归属结果暨股份上市公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次股票上市类型为股权激励股份；股票认购方式为网下，上市股数为 535,796股。 本次股票上市流通总数为535,796股。 本次股票上市流通日期为2025 年 7 月 18 日。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限责 任公司上海分公司(以下简称"中登上海分公司")相关业务规定，上海伟测半导 体科技股份有限公司（以下简称"公司"）于 2025 年 7 月 14 日收到中登上海分 公司出具的《证券变更登记证明》，公司完成了 2023 年限制性股票激励计划第二 个归属期的股份登记工作。现将有关情况公告如下： 一、本激励计划已履行的决策程序和信息披露情况 （一）202 ...