| 证券代码：688372 | 证券简称：伟测科技 | 公告编号：2025-070 | | --- | --- | --- | | 转债代码：118055 | 转债简称：伟测转债 | | 上海伟测半导体科技股份有限公司 第二届董事会第二十一次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 上海伟测半导体科技股份有限公司（以下简称"公司"）第二届董事会第二 十一次会议于 2025 年 8 月 19 日以现场及通讯相结合的方式召开。本次会议通知 已于 2025 年 8 月 8 日以电子邮件的方式发出。本次会议由公司董事长骈文胜先 生主持，本次会议应出席董事 8 名，实际出席董事 8 名。本次会议的召集、召开 方式符合有关法律、法规和《公司章程》的规定。 二、董事会会议审议情况 （一）审议通过《关于<公司 2025 年半年度报告>及其摘要的议案》 董事会审计委员会对本项议案发表了同意的意见。 表决结果：8 票同意，0 票反对，0 票弃权。 具体内容详见公司于同日在上海证券交易所网站上披露的相 ...

上海伟测半导体科技股份有限公司2025 年半年度报告 公司代码：688372 公司简称：伟测科技 转债代码：118055 转债简称：伟测转债 上海伟测半导体科技股份有限公司 2025 年半年度报告 1 / 168 上海伟测半导体科技股份有限公司2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确 性、完整性，不存在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 二、 重大风险提示 公司已在本半年度报告中详细阐述公司在经营过程中可能面临的各种风险及应对措施，敬请 查阅本报告第三节"管理层讨论与分析"中"四、风险因素"相关内容。 三、 公司全体董事出席董事会会议。 四、 本半年度报告未经审计。 五、 公司负责人骈文胜、主管会计工作负责人王沛及会计机构负责人（会计主管人员）徐芳声 明：保证半年度报告中财务报告的真实、准确、完整。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 无 七、 是否存在公司治理特殊安排等重要事项 □适用 √不适用 八、 前瞻性陈述的风险声明 √适用 □不适用 本半年度报告所涉及的公司未来计划、发 ...

每经AI快讯，8月20日，伟测科技(688372.SH)发布2025年半年度报告，上半年实现营业收入6.34亿元， 同比增长47.53%；归属于上市公司股东的净利润1.01亿元，同比增长831.03%。公司表示，业绩增长主 要得益于集成电路行业需求增长及公司产能利用率提升。 ...

格隆汇8月20日｜A股市场半导体板块走强，其中，芯原股份涨近16%，艾为电子涨13%，盛科通信、成 都华微涨超8%，南芯科技涨超7%，寒武纪涨超5%，华海诚科、龙迅股份、润欣科技、航宇微涨超 4%，伟测科技涨超3%。 MACD金叉信号形成，这些股涨势不错！ | 代码 | 名称 | | 涨幅% ↓ | 总市值 | 年初至今涨幅% | | --- | --- | --- | --- | --- | --- | | 688521 | 芯原股份 | # | 15.86 | 775亿 | 181.27 | | 688798 | 艾为电子 | 张 | 13.02 | 214亿 | 32.40 | | 688702 | 盛科通信-し | | 8.76 | 412亿 | 19.76 | | 688709 | 成都华微 | | 8.35 | 247亿 | 25.73 | | 688484 | 南芯科技 | | 7.99 | 211亿 | 38.41 | | 688256 | 寒武纪-U | 1 | 5.61 | 4126亿 | 49.90 | | 600360 | *ST华微 | 1 | 4.97 | 95.26 Z | 11 ...

天眼查商业履历信息显示，上海伟测半导体科技股份有限公司，成立于2016年，位于上海市，是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本11383.4777万人民币，实缴资本 5272.5544万人民币。公司法定代表人为骈文胜。 通过天眼查大数据分析，上海伟测半导体科技股份有限公司共对外投资了9家企业，参与招投标项目4 次，知识产权方面有商标信息4条，专利信息68条，此外企业还拥有行政许可19个。 来源：金融界 金融界消息 截至2025年8月14日收盘，伟测科技（688372）报收于63.47元，上涨2.77%，换手率 10.53%，成交量10.88万手，成交金额6.86亿元。 资金流向方面，今日主力资金净流入2036.92万元，占比成交额2.97%。其中，超大单净流入752.43万 元、占成交额1.1%，大单净流入1284.49万元、占成交额1.87%，中单净流出流出312.32万元、占成交额 0.46%，小单净流出1724.61万元、占成交额2.52%。 伟测科技最新一期业绩显示，截至2025一季报，公司营业总收入2.85亿元、同比增长55.39%，归属净利 润2591.82万元，同比 ...

金融界消息 截至2025年7月30日收盘，伟测科技（688372）报收于60.0元，下跌1.41%，换手率4.07%， 成交量4.20万手，成交金额2.53亿元。 天眼查商业履历信息显示，上海伟测半导体科技股份有限公司，成立于2016年，位于上海市，是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本11383.4777万人民币，实缴资本 5272.5544万人民币。公司法定代表人为骈文胜。 通过天眼查大数据分析，上海伟测半导体科技股份有限公司共对外投资了9家企业，参与招投标项目4 次，知识产权方面有商标信息4条，专利信息68条，此外企业还拥有行政许可18个。 来源：金融界 资金流向方面，今日主力资金净流出2582.86万元，占比成交额10.2%。其中，超大单净流入286.04万 元、占成交额1.13%，大单净流出2868.90万元、占成交额11.33%，中单净流出流入573.92万元、占成交 额2.27%，小单净流入2008.93万元、占成交额7.93%。 伟测科技最新一期业绩显示，截至2025一季报，公司营业总收入2.85亿元、同比增长55.39%，归属净利 润2591.82万元，同比增 ...

金融界消息 截至2025年7月29日收盘，伟测科技（688372）报收于60.86元，上涨0.15%，换手率 4.03%，成交量4.16万手，成交金额2.53亿元。 资金流向方面，今日主力资金净流出2152.03万元，占比成交额8.5%。其中，超大单净流出2234.47万 元、占成交额8.83%，大单净流入82.45万元、占成交额0.33%，中单净流出流入828.62万元、占成交额 3.27%，小单净流入1323.41万元、占成交额5.23%。 伟测科技最新一期业绩显示，截至2025一季报，公司营业总收入2.85亿元、同比增长55.39%，归属净利 润2591.82万元，同比增长8577.53%，扣非净利润1417.55万元，同比增长443.64%，流动比率0.986、速 动比率0.978、资产负债率48.67%。 天眼查商业履历信息显示，上海伟测半导体科技股份有限公司，成立于2016年，位于上海市，是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本11383.4777万人民币，实缴资本 5272.5544万人民币。公司法定代表人为骈文胜。 通过天眼查大数据分析，上海伟测半导体科技股份有限 ...

Group 1 - Changshi Capital announced the completion of its hard technology Phase III fund with a total of 728 million yuan raised, supported by university funds including those from Huazhong University of Science and Technology and University of Electronic Science and Technology [1] - The trend of universities establishing mother funds and leveraging alumni resources is accelerating the transformation and industrialization of technological achievements, with "alumni economy" becoming a new link between innovation and implementation [1][8] - A collaborative mechanism involving universities, alumni, venture capital institutions, and local governments is gradually forming within China's technological innovation system, facilitating funding and pathways for early-stage projects [1][6] Group 2 - The national strategy in the semiconductor field has shifted from "inclusive support" to focusing on "small giants" in specific segments, reshaping venture capital institutions' judgment standards and empowerment paths for early-stage technology companies [2] - The first visit of the "alumni enterprise visit" series took place at Weicet Technology, which has become a benchmark in China's third-party integrated circuit testing service sector, showcasing the importance of alumni networks in resource connection and market access [3][4] Group 3 - Changshi Capital has been deeply involved in the hard technology sector and has successfully attracted support from local state-owned financial institutions and industry leaders for its Phase III fund [6][7] - The collaboration between universities and venture capital institutions is evolving into a four-party coordination mechanism that accelerates the industrialization of scientific research achievements [6][8] - The electronic engineering alumni association is exploring the establishment of early-stage angel funds to focus on key technology directions, promoting the incubation and industrialization of research achievements [8][9] Group 4 - The alumni association's activities have shifted from traditional large gatherings to more focused and resource-coordinated platforms, emphasizing the importance of passing on knowledge from experienced alumni to younger generations [8] - The exploration of mechanisms within the alumni association reflects a structural shift in the innovation ecosystem of universities from "research-led" to "implementation-oriented" [8][9] - The collaborative system being developed among universities, alumni, capital, and industry is crucial for the future growth of China's hard technology innovation ecosystem [9]

Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]

Core Points - The report discusses the issuance of convertible bonds by Shanghai Weice Semiconductor Technology Co., Ltd, with the bond code 118055.SH, and highlights the management of bondholder rights by Ping An Securities [1][2] - The bond has a total issuance scale of RMB 1.175 billion, with a maturity period of six years from April 9, 2025, to April 8, 2031 [3][4] - The initial conversion price of the bonds is set at RMB 82.15 per share, which has been adjusted to RMB 62.68 per share due to corporate actions [5][9] Bond Issuance Details - The bond issuance was approved by the board of directors and shareholders' meetings held in April 2024 and January 2025, respectively [2] - The bond has a tiered interest rate structure: 0.10% for the first year, 0.30% for the second year, and 0.60% for the third year [3] - Interest payments will be made annually, with the first payment starting from the issuance date [4][5] Conversion and Adjustment Mechanism - The conversion period for the bonds starts on October 15, 2025, and ends on April 8, 2031 [5][9] - The conversion price can be adjusted based on various corporate actions, including stock dividends and capital increases, following specific formulas outlined in the bond's prospectus [6][7] - The adjusted conversion price reflects the impact of a recent stock incentive plan, resulting in a new price of RMB 62.68 per share [8][9] Credit Rating and Management - The bonds have been rated AA by Zhongjian Pengyuan Credit Rating Co., Ltd, with a stable outlook [6] - The bonds are not secured by any collateral, and the management will continue to monitor the interests of bondholders closely [6][9]