北京市竞天公诚律师事务所上海分所 关于 天水华天科技股份有限公司 2024 年第一次临时股东大会 之 法律意见书 上海市徐汇区淮海中路 1010 号嘉华中心 45 层 邮编：200031 Suite 45/F, K.Wah Centre, 1010 Huaihai Road (M), Xuhui District, Shanghai 200031, China 电话/Tel: +86 21 5404 9930 传真/Fax: +86 21 5404 9931 网址/Website: www.jingtian.com 本所根据《中华人民共和国公司法》《中华人民共和国证券法》《上市公司 股东大会规则》等现行有效的法律、法规、规范性文件及《天水华天科技股份有 限公司章程》（下称"《公司章程》"），按照律师行业公认的业务标准、道德 规范和勤勉尽责精神，出具本法律意见书。 二〇二四年八月 北京市竞天公诚律师事务所上海分所 法律意见书 北京市竞天公诚律师事务所上海分所 关于天水华天科技股份有限公司 2024 年第一次临时股东大会之法律意见书 致：天水华天科技股份有限公司 为出具本法律意见书，本所律师审查了本次股东大会相关 ...

Investment Rating - The investment rating for the company is maintained at "Buy-A" [1][2]. Core Views - The report highlights the completion and production commencement of the first phase of Shanghai Huati Technology, which is expected to achieve a wafer testing capacity of 480,000 pieces per year [1]. - The company is positioned as a major integrated circuit testing center in China, focusing on wafer testing and establishing a differentiated development pattern with other testing bases [1][2]. - The anticipated revenue growth for the company from 2024 to 2026 is projected at 15.2%, 18.2%, and 12.3% respectively, with net profit growth rates of 161.6%, 53.6%, and 41.1% [1][3]. Financial Data and Valuation - The company's revenue for 2024 is estimated at 13,020 million yuan, with a year-on-year growth of 15.2% [3]. - The projected net profit for 2024 is 592 million yuan, reflecting a significant increase of 161.6% compared to the previous year [3]. - The company's P/E ratios for 2024, 2025, and 2026 are expected to be 44.0, 28.6, and 20.3 respectively, indicating a potential for improved valuation as earnings grow [3][5]. Operational Highlights - Shanghai Huati has established a cleanroom area of 30,000 square meters and over 1,300 high-end testing devices, enabling comprehensive testing capabilities across various chip types [1]. - The company employs advanced technologies such as MES, SAP, and CIM to achieve intelligent manufacturing and automation in its production processes [1][2]. - The report emphasizes the strategic importance of the company's 3D Matrix platform in enhancing its technological moat and expanding production capacity [2].

Investment Rating - The investment rating for the company is maintained at "Buy-A" [1][2]. Core Views - The company is expected to achieve a significant increase in net profit attributable to shareholders, with a projected growth of over 200% year-on-year for the first half of 2024. This is driven by a recovery in demand for electronic products and an increase in orders, leading to improved capacity utilization and revenue growth [1][2]. - The advanced packaging market is anticipated to grow at a compound annual growth rate (CAGR) of 9.81% from 2021 to 2027, reaching a market size of $59.1 billion by 2027. The 2.5D/3D packaging technology is expected to see a CAGR of 13.73%, with a projected market size of $18 billion by 2027 [1][2]. - The company is actively developing advanced packaging technologies, particularly focusing on the eSinC 2.5D packaging technology platform to meet the high-end testing needs of the AI era [1][2]. Financial Performance and Projections - The company forecasts revenues of 13.02 billion, 15.39 billion, and 17.28 billion yuan for 2024, 2025, and 2026, respectively, with growth rates of 15.2%, 18.2%, and 12.3% [2][3]. - The projected net profit attributable to shareholders for the same years is 592 million, 910 million, and 1.28 billion yuan, with growth rates of 161.6%, 53.6%, and 41.1% [2][3]. - The company's price-to-earnings (P/E) ratios are expected to be 44.3, 28.8, and 20.4 for 2024, 2025, and 2026, respectively [2][3]. Market Position and Strategy - The company is positioning itself to capture market share in the advanced packaging sector by establishing a subsidiary focused on board-level packaging technology, aiming to enhance its competitive edge in the market [2][3]. - The company is leveraging its 3D Matrix platform to integrate various advanced packaging technologies, which is expected to drive growth in its market share within the advanced packaging field [2][3].

证券代码：002185 证券简称：华天科技 公告编号：2024-031 天水华天科技股份有限公司 第七届董事会第十六次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届董事会第十六次会 议通知和议案等材料于 2024 年 7 月 19 日以电子邮件和书面送达方式送达各位董 事，并于 2024 年 7 月 24 日以通讯表决方式召开。会议应参加表决的董事 7 人， 实际参加表决的董事 7 人。本次会议符合《公司法》及《公司章程》的规定。会 议审议通过了如下决议： 一、审议通过了《关于补选公司董事的议案》。 同意提名张玉明先生、杨柳先生为公司董事候选人，任期自股东大会选举通 过之日起，至本届董事会届满。 同意 7 票，反对 0 票，弃权 0 票。 本议案在提交董事会审议前，已经过董事会提名委员会审议通过。 二、审议通过了《关于召开公司 2024 年第一次临时股东大会的议案》。 决定于 2024 年 8 月 12 日召开公司 2024 年第一次临时股东大会，审议上述 补选公司董事的议案。 同意 7 票，反 ...

证券代码：002185 证券简称：华天科技 公告编号：2024-032 天水华天科技股份有限公司 关于召开2024年第一次临时股东大会的通知 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届董事会第十六次会 议决定于2024年8月12日召开公司2024年第一次临时股东大会，审议公司第七届 董事会第十六次会议提交的相关议案，现将本次会议的有关事项通知如下： 一、召开会议的基本情况 1、股东大会届次：2024年第一次临时股东大会 2、会议召集人：公司董事会。公司于2024年7月24日召开第七届董事会第十 六次会议，审议通过了《关于召开公司2024年第一次临时股东大会的议案》，决 定召开公司2024年第一次临时股东大会。 3、会议召开的合法、合规性：本次股东大会的召集和召开符合《中华人民 共和国公司法》、《上市公司股东大会规则》、《深圳证券交易所股票上市规则》 等有关法律、行政法规、部门规章、规范性文件和公司章程的有关规定。 4、会议的召开时间： 现场会议召开时间：2024年8月12日（星期一）下午14:30 网络投 ...

Investment Rating - The investment rating for the company is "Buy" (maintained) [2] Core Views - The company reported a significant quarter-on-quarter growth in Q2 2024, maintaining a "Buy" rating. The forecast for H1 2024 indicates a net profit attributable to the parent company between 190 million to 230 million yuan, representing a year-on-year increase of 202.17% to 265.78% [2] - The company is accelerating the construction of advanced packaging capacity, with a focus on 2.5D and FOPLP technologies, which are expected to drive future growth [4] Summary by Relevant Sections Financial Performance - For H1 2024, the company expects a net profit of 190 million to 230 million yuan, with a Q2 net profit forecast of 133 million to 173 million yuan, showing a quarter-on-quarter increase of 133.16% to 203.3% [2] - The company aims for a revenue target of 13 billion yuan in 2024, reflecting a year-on-year growth of 15.06% [4] - The projected net profits for 2024, 2025, and 2026 are 664 million, 1.03 billion, and 1.54 billion yuan respectively, with corresponding EPS of 0.21, 0.32, and 0.48 yuan [2][5] Capacity Expansion - The company is investing in advanced packaging technologies, with significant projects underway: - A 9.95 billion yuan investment in a wafer-level advanced packaging production line, expected to achieve a monthly capacity of 700,000 pieces and generate annual sales of 7 billion yuan [4] - A 10 billion yuan investment in the second phase of the Nanjing project, focusing on Chiplet/FCBGA/SiP technology, projected to be completed by 2028 with an annual output value of 6 billion yuan [4] - A 3 billion yuan investment in the FOPLP board-level packaging project, expected to start production in Q1 2025 with an annual output value exceeding 900 million yuan [4] Market Position and Shareholder Confidence - The company's controlling shareholder, Huaten Electronics Group, has increased its stake by approximately 21 million shares, indicating confidence in the company's future stability and growth [3]

Investment Rating - The report maintains a "Buy" rating for the company with a target price of 11.76 CNY [2][4]. Core Views - The company is benefiting significantly from the recovery in domestic consumer electronics, leading to a substantial increase in profitability for the first half of 2024. The forecasted net profit for the first half of 2024 is expected to reach 190 to 230 million CNY, representing a year-on-year increase of 202.17% to 265.78% [2]. - The company is actively expanding its advanced packaging capabilities, particularly in FOPLP (Fan-Out Panel Level Package), which is expected to enhance its long-term growth prospects. The total investment for the new project is planned at 3 billion CNY, with an anticipated annual output value of no less than 900 million CNY once fully operational [2][3]. Financial Summary - The company's revenue for 2024 is projected to be 13.617 billion CNY, reflecting a growth of 20.5% compared to 2023. The net profit attributable to shareholders is expected to be 774 million CNY, a significant increase of 241.9% from the previous year [3][8]. - The earnings per share (EPS) for 2024 is estimated at 0.24 CNY, with projections of 0.37 CNY and 0.46 CNY for 2025 and 2026, respectively [3][8]. - The company’s return on equity (ROE) is expected to improve from 1.4% in 2023 to 4.7% in 2024, indicating a recovery in profitability [3][8]. Market Data - The company's current market capitalization is approximately 27.783 billion CNY, with a total share capital of 3.204 billion shares [5]. - The stock has traded within a range of 5.85 to 10.07 CNY over the past 52 weeks [5].

Financial Performance - The company expects net profit attributable to shareholders to be between 190 million and 230 million yuan, representing a year-on-year increase of 202.17% to 265.78% compared to 62.88 million yuan last year[3]. - The net profit after deducting non-recurring gains and losses is projected to be a loss of 49 million to 35 million yuan, showing a year-on-year improvement of 74.20% to 81.57% from a loss of 189.94 million yuan last year[3]. - Basic earnings per share are estimated to be between 0.0593 yuan and 0.0718 yuan, compared to 0.0196 yuan per share last year[3]. Market Conditions - The increase in orders and improved capacity utilization are attributed to the recovery in demand for electronic terminal products and the rebound in integrated circuit market conditions[5]. Audit and Risk Disclosure - The financial data in the earnings forecast has not been audited by registered accountants, and the final figures will be disclosed in the company's 2024 semi-annual report[4]. - The company emphasizes the importance of investors being aware of investment risks related to the preliminary nature of the earnings forecast[6].

证券代码：002185 证券简称：华天科技 公告编号：2024-030 天水华天科技股份有限公司 公司将尽快按照法定程序完成董事的补选工作。 公司对臧启楠女士在担任公司董事期间为公司所做的贡献表示衷心感谢！ 特此公告。 二〇二四年七月十三日 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）董事会于2024年7月12日 收到公司董事臧启楠女士的书面辞职报告。臧启楠女士因工作原因请求辞去公司 第七届董事会董事职务，其辞职生效后不再担任公司任何职务。 根据《公司法》、《深圳证券交易所股票上市规则》和《公司章程》的有关 规定，臧启楠女士在任期内辞职，未导致公司董事会成员低于法定最低人数，其 辞职报告自送达董事会之日起生效，其辞职不会对公司及董事会的日常运作产生 影响。截至本公告披露日，臧启楠女士未持有本公司股票，也不存在按照相关监 管规定应履行而未履行的任何承诺。 天水华天科技股份有限公司董事会 关于公司董事辞职的公告 ...

Investment Rating - The investment rating for the company is maintained at "Accumulate-A" [1] Core Views - The company is actively positioning itself in the FOPLP (Fan-Out Panel Level Packaging) sector, seizing opportunities in domestic packaging technology transformation [1] - The establishment of Jiangsu Pangu Semiconductor Technology Co., Ltd. marks a significant step towards the industrialization of multi-chip high-density panel-level fan-out packaging technology, with an expected annual output value exceeding 900 million yuan upon full production [1][2] - The advanced packaging technology is gaining attention due to its ability to meet the demands for miniaturization, lightweight, low cost, high density, and high reliability in the AI era [1] - The company is expected to see revenue growth driven by the increasing demand for advanced packaging solutions, particularly in the context of AI and high-performance computing [2] Financial Projections - Revenue projections for the company from 2024 to 2026 are 13.02 billion, 15.39 billion, and 17.28 billion yuan, with growth rates of 15.2%, 18.2%, and 12.3% respectively [2][3] - Net profit attributable to shareholders is projected to be 592 million, 910 million, and 1.28 billion yuan for the same period, with growth rates of 161.6%, 53.6%, and 41.1% respectively [2][3] - The company's PE ratios are expected to be 43.7, 28.5, and 20.2 for the years 2024, 2025, and 2026 [2][3] Market Position and Competitive Advantage - The company aims to enhance its market share in the advanced packaging sector through the development and application of panel-level packaging technology [1] - The FOPLP technology offers significant advantages in terms of area utilization and cost reduction, with a cost decrease of up to 66% compared to traditional packaging methods [1] - The company is well-positioned to capitalize on the growing demand for advanced packaging in various applications, including automotive chips, where approximately 66% of chips can utilize FOPLP technology [1]