| | 代码 7 | 简称 | 收盘价(原始币种) | 权重 | | --- | --- | --- | --- | --- | | 1 | 300308.SZ | 中际旭创 | 149.82 | 12.4085% | | 2 | 300502.SZ | 新易盛 | 130.90 | 11.6006% | | 3 | 300394.SZ | 天孚通信 | 84.99 | 4.1995% | | ব | 301236.SZ | 软通动力 | 53.15 | 3.9140% | | 5 | 300442.SZ | 润泽科技 | 48.38 | 2.9276% | | 6 | 300458.SZ | 全志科技 | 38.27 | 2.8722% | | 7 | 300474.SZ | 景嘉微 | 71.51 | 2.8116% | | 8 | 300454.SZ | 深信服 | 89.83 | 2.7406% | | ə | 300223.SZ | 北京君正 | 66.93 | 2.7002% | | 10 | 300017.SZ | 网宿科技 | 10.31 | 2.6805% | 从投资逻辑来看，中国软科技实力 ...

证券代码：300223 证券简称：北京君正 公告编号：2025-036 北京君正集成电路股份有限公司 股东部分股份质押和解除质押的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 北京君正集成电路股份有限公司（以下简称"公司"）近日收到控股股东李 杰的通知，获悉其所持有本公司的部分股份办理了质押和解除质押手续，具体事 项如下： 一、股东股份质押基本情况 | 股东 | 是否为控 股股东或 | 本次质押 | 占其所 | 占公司 | 是否 | 是否为 | 质押起 | | 质押到 | | 质押 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 名称 | 第一大股 | 数量（股） | 持股份 | 总股本 | 为限 | 补充 | 始日 | | 期日 | 质权人 | 用途 | | | 东及其一 | | 比例 | 比例 | 售股 | 质押 | | | | | | | | 致行动人 | | | | | | | | | | | | 李杰 | 是 | 4,448,800 | ...

Industry Overview - The Internet of Things (IoT) chip industry has a comprehensive supply chain, with upstream suppliers providing raw materials and equipment, midstream manufacturers handling design, production, and testing, and downstream application service providers integrating chips into various devices [1][2]. Key Players - Major upstream suppliers include SMIC, Zhonghuan, Nanda Optoelectronics, and others, while midstream manufacturers consist of ZTE, Tailin Microelectronics, and others. Downstream service providers include Alibaba Cloud, China Mobile IoT, and Xiaomi [2]. Regional Distribution - Key IoT chip companies are concentrated in economically developed regions such as Jiangsu, Guangdong, Beijing, and Shanghai, with Jiangsu and Shanghai showing rapid development in the IoT chip sector [4]. Business Layout Comparison - Companies like Silan Micro, SiTewave, and Allwinner Technology focus primarily on the domestic market, while Beijing Junzheng, Zhaoyi Innovation, and Ankai Micro target international markets. Tailin Microelectronics has a significant focus on IoT chips, with 90.62% of its revenue coming from this sector [6][8]. Investment Trends and Business Plans - Companies are increasing R&D investments to enhance chip performance. For instance, Ruixin Micro plans to launch a new AI vision chip by May 2025, while Allwinner Technology is focusing on low-power designs for its IoT Bluetooth audio chips [9][10].

Group 1 - The A-share market experienced an overall pullback on July 7, with AI hardware sectors like optical modules and optical communications leading the decline, as companies such as Zhongji Xuchuang and Tianfu Communication fell over 4% [1] - The AI computing sector is showing signs of rapid recovery, providing a low-entry opportunity for investors, as Nvidia's GB200 production peaks and the next-generation AI server chip GB300 is expected to launch in the second half of 2025 [1] - According to Galaxy Securities, the current market is at the bottom of AI expectations, indicating a potential revival in the AI computing industry chain, which could lead to new investment opportunities [1] Group 2 - Investors can focus on the 5G Communication ETF (515050), which tracks the CSI 5G Communication Theme Index and covers key players in the Nvidia, Apple, and Huawei supply chains across various sectors including AI computing, 6G, and consumer electronics [2] - The AI-focused ETF, Huaxia (159381), tracks the ChiNext AI Index and includes leading companies in the optical module sector, with over 33% weight in optical modules and major holdings in Zhongji Xuchuang, New Yisheng, and Tianfu Communication [2]

Core Viewpoint - The AI camera glasses market in China is experiencing a paradox where local products are available, yet the market remains stagnant despite significant global growth, primarily dominated by Ray-Ban Meta's offerings [2][3]. Group 1: Market Dynamics - In Q1 2025, the global AI smart glasses market saw a dramatic increase in sales, reaching 600,000 units, a 216% year-on-year growth, with Ray-Ban Meta capturing 528,000 units [2]. - The Chinese market has local products like Raybird V3 and Xiaomi AI glasses, but the overall market is characterized by a disconnect between hype and actual sales [2][3]. Group 2: Industry Challenges - The market faces dual industrial bottlenecks: a lack of mature adaptation solutions beyond Qualcomm AR1, leading to "patchwork innovation," and an underestimation of the system-level design complexity required for AI glasses [3]. - The technical complexity of AI camera glasses is significantly higher than traditional wearables, with challenges in achieving a balance between weight (50g) and performance (12MP camera and 4-hour battery life) [3][6]. Group 3: Technological Developments - The cost reduction of AI models has led to increased confidence among chip manufacturers to enter the AI glasses market, which was previously met with skepticism [5][6]. - AI audio glasses have made headway by leveraging existing TWS earphone supply chains, while AI camera glasses struggle due to their complex technology stack [6][8]. Group 4: Chip Innovations - Companies like Junzheng are proactively providing dedicated chips for AI glasses, marking a shift in the industry landscape [8][10]. - Junzheng's C100 chip, with a size of 5mm x 6mm and a weight of 0.053g, achieves 1080P video recording at a power consumption of 280mW, showcasing advancements in low power and miniaturization [8][9]. Group 5: Future Outlook - The global smart glasses shipment is projected to reach 12.8 million units by 2025, growing at 26%, driven by advancements in Chinese chip technology and market demand [11]. - Junzheng is developing the next generation CW series ISP, aiming for further miniaturization and lower power consumption, which could redefine the AI camera glasses market in China [11][10].

Group 1 - The core viewpoint of the article highlights the continuous growth of China's semiconductor materials market, with Taiwan being the largest consumer market globally [2] - The semiconductor materials are categorized into front-end manufacturing materials and back-end packaging materials, with specific components listed for each category [1] - The market size for semiconductor silicon wafers in China is projected to exceed $2 billion in 2024, reflecting significant growth driven by policy support and technological advancements [3] Group 2 - China's semiconductor equipment market has become the largest globally, with a market size of $366 billion in 2023, showing a 29% year-on-year increase [6] - The demand for thin film deposition equipment in China has been steadily increasing, with the market size growing from 16.8 billion yuan in 2018 to 60 billion yuan in 2023, indicating a compound annual growth rate of 28.99% [8] - The semiconductor materials market in mainland China reached $131 billion in 2023, with projections of $142 billion for 2024 [2]

Investment Rating - The report maintains a "Positive" investment rating for the electronic industry [4] Core Viewpoints - The niche DRAM supply-demand structure is being reshaped, with ongoing market prosperity driven by AI and domestic substitution opportunities [2][19] - The DDR4 series has shown a continuous upward trend in prices, with significant increases reported in June 2025 [7][8] - The supply gap for DDR4 and LPDDR4 persists, benefiting Tier 2 manufacturers significantly [12][18] Summary by Sections Investment Recommendations and Targets - The report suggests focusing on companies such as Zhaoyi Innovation, Beijing Junzheng, Fudan Microelectronics, and others due to the reshaping of the niche storage market and AI-driven growth opportunities [2][19] Market Trends - As of June 27, 2025, DDR4 product prices have increased significantly, with some specifications seeing price hikes of over 60% compared to the end of May [7][8] - The third quarter is expected to see further increases in DDR4 contract prices, with potential rises of 15% or more [10] Supply Chain Dynamics - Major suppliers like Micron are confirming production halts, which may exacerbate shortages in LPDDR4, leading to potential price increases [10][12] - Chinese mainland niche DRAM manufacturers are rapidly growing due to strong supply chain capabilities, with Zhaoyi Innovation and Beijing Junzheng ranking sixth and seventh globally in the niche DRAM market [18]

Core Viewpoint - The Internet of Things (IoT) chip market in China is experiencing significant growth, with projections indicating a market size of approximately 4.3 trillion yuan in 2024 and 5.1 trillion yuan in 2025, driven by the increasing number of IoT connected devices and advancements in technology such as 5G and AI [1][4][8]. Industry Definition and Classification - IoT chips are integrated circuits specifically designed for IoT devices, serving as core hardware components that connect physical devices to the internet. They are categorized into various types, including security chips, mobile payment chips, communication RF chips, and identity recognition chips [2][4]. Current Development Status - The number of IoT connected devices in China is expected to grow from 2.43 billion in 2019 to 15.11 billion in 2024, with the market size increasing from 1.7556 trillion yuan to 4.307 trillion yuan during the same period. By 2025, the number of devices is projected to reach approximately 17.34 billion, with a market size of about 5.0608 trillion yuan [4][6]. Industry Chain - The IoT chip industry chain consists of upstream raw materials (silicon wafers, packaging materials), midstream chip manufacturing (design, testing), and downstream applications (smart cities, smart homes, industrial IoT) [10][12]. Competitive Landscape - The competitive landscape of the IoT chip market is characterized by international giants dominating the high-end sector (e.g., Qualcomm, Intel) while domestic companies focus on the mid-to-low-end market. Key domestic players include Huawei, ZTE Microelectronics, and several others [16][19]. Industry Development Trends - The IoT chip industry is expected to see continuous advancements in performance and quality, with a significant focus on low power consumption as a key development direction. The integration of microprocessors, memory, and network interfaces in IoT chips facilitates data collection, processing, and transmission [23].

股票简称：北京君正 股票代码：300223 北京君正集成电路股份有限公司 简式权益变动报告书 上市公司名称：北京君正集成电路股份有限公司 股票上市地点：深圳证券交易所 信息披露义务人：北京屹唐盛芯半导体产业投资中心（有限合伙） 住所：北京市北京经济技术开发区景园北街 2 号 52 幢 309 室 通讯地址：北京市北京经济技术开发区荣华中路 22 号 A 座 22 层 股份变动性质：股份减少 签署日期：二〇二五年六月二十三日 信息披露义务人声明 一、信息披露义务人依据《中华人民共和国公司法》、《中华人民共和国证 券法》、《上市公司收购管理办法》、《公开发行证券公司信息披露内容与格式 准则第 15 号—权益变动报告书》及相关的法律、法规编制本报告书。 二、信息披露义务人签署本报告书已获得必要的授权和批准，其履行亦不违 反信息披露义务人章程或内部规则中的任何条款，或与之相冲突。 三、依据《中华人民共和国证券法》、《上市公司收购管理办法》的规定， 本报告书已全面披露信息披露义务人在北京君正集成电路股份有限公司中拥有 权益的股份变动情况。 截至本报告书签署日，除本报告书披露的持股信息外，信息披露义务人没有 通过任何其他 ...

证券代码：300223 证券简称：北京君正 公告编号：2025-035 特别提示： 1、本次权益变动为公司股东持股比例减少，不触及要约收购，不会导致公 司控制权发生变化。 北京君正集成电路股份有限公司 2、本次权益变动后，公司股东北京屹唐盛芯半导体产业投资中心（有限合 伙）持有公司股份数量为 48,253,988 股，占公司总股本的 9.99998%，仍为持有 公司 5%以上股份的股东。 关于披露简式权益变动报告书的提示性公告 3、本次权益变动不涉及公司控股股东、实际控制人，不会导致公司控股股 东及实际控制人发生变化，不会影响公司的治理结构和持续经营。 公司股东北京屹唐盛芯半导体产业投资中心（有限合伙）保证向本公司提供 的信息内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 一、权益变动基本情况 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 近日，北京君正集成电路股份有限公司（以下简称"公司"）收到北京屹唐盛 芯半导体产业投资中心（有限合伙）（以下简称"屹唐盛芯"）出具的《简式权 益变动报告书》，截止 2025 年 6 月 23 日，屹唐盛芯持有公 ...