Core Viewpoint - Wenzhou Hongfeng has established a wholly-owned subsidiary, Wenzhou Hongfeng New Materials Research Institute, with an investment of 10 million RMB to enhance its R&D capabilities and create a comprehensive innovation ecosystem in the new materials sector [1][2]. Group 1: Establishment of New Materials Research Institute - The core objective of the new materials research institute is to concentrate efforts on overcoming key technologies and enhancing independent innovation capabilities in the new materials field [2]. - The research institute aims to build a "R&D - pilot test - industrialization" full-chain transformation system, facilitating the transition from a single material supplier to a diversified material solutions provider [2]. - The institute will leverage Wenzhou Hongfeng's technological advantages in new materials and promote efficient sharing of talent and R&D equipment [2]. Group 2: Focus Areas and Technological Advancements - The research institute will focus on high-performance ultra-thin lithium battery copper foil, solid-state battery copper foil, high-end copper foil for PCBs, semiconductor etching lead frame materials, electrical contact and functional composite materials, and high-precision hard alloys [2]. - The company aims to achieve breakthroughs in critical common technologies and "bottleneck" areas through systematic theoretical research and cutting-edge technology development [2]. Group 3: Market Position and Strategic Partnerships - Wenzhou Hongfeng has become one of the largest providers of electrical contact functional composite materials and comprehensive solutions in China, with some product technical indicators reaching international advanced levels [3]. - The company has successfully entered the supply chains of international giants such as Eaton, Schneider Electric, and Siemens, highlighting its market competitiveness [3]. - The recent inclusion of Wenzhou Hongfeng's customers in NVIDIA's updated partner list for the 800V DC power architecture underscores the company's strong market position in related fields [3]. Group 4: Industry Trends and Opportunities - The national push for the rapid development of strategic emerging industries such as new energy, 5G communication, data centers, and computing centers is creating significant opportunities for composite materials [4]. - The establishment of the new materials research institute will help the company better meet market demands and strengthen collaborations with ecosystem clients like NVIDIA [4].

Core Viewpoint - Wenzhou Hongfeng has established a wholly-owned subsidiary, Wenzhou Hongfeng New Materials Research Institute, with an investment of 10 million RMB to enhance its R&D capabilities and create a comprehensive innovation ecosystem in the new materials sector [1][2]. Group 1: Establishment of New Materials Research Institute - The core objective of the new materials research institute is to concentrate efforts on overcoming key technologies and enhancing independent innovation capabilities in the new materials field [2]. - The research institute aims to build a "R&D—Pilot—Industrialization" full-chain transformation system, facilitating the transition from laboratory research to large-scale production [2]. - The institute will leverage Wenzhou Hongfeng's technological advantages in new materials and promote efficient sharing of talent and R&D equipment [2]. Group 2: Focus Areas and Technological Development - The research institute will focus on high-performance ultra-thin lithium battery copper foil, solid-state battery copper foil, high-end copper foil for PCBs, semiconductor etching lead frame materials, electrical contact and functional composite materials, and high-precision hard alloys [2]. - The company aims to achieve breakthroughs in critical common technologies and "bottleneck" areas through systematic theoretical research and cutting-edge technology development [2]. - The goal is to establish a leading position in new materials and technology innovation in China, with international influence, particularly in the electrical engineering, electronic information, new energy, semiconductor packaging, and high-end manufacturing sectors [2]. Group 3: Market Position and Strategic Partnerships - Wenzhou Hongfeng has become one of the largest providers of electrical contact functional composite materials and comprehensive solutions in China, with its technology and processes leading the domestic industry [3]. - The company has successfully entered the supply chains of international giants such as Eaton, Schneider Electric, and Siemens, highlighting its competitive market position [3]. - The recent inclusion of these companies in NVIDIA's partner list for the new 800V high-voltage direct current architecture underscores Wenzhou Hongfeng's role in the evolving market landscape [3]. Group 4: Industry Trends and Opportunities - The national push for the rapid development of strategic emerging industries such as new energy, 5G communication, data centers, and computing centers is increasing the demand for composite materials with superior performance [4]. - The establishment of the new materials research institute will help the company better meet market demands and strengthen collaborations with ecosystem clients like NVIDIA, positioning it to seize opportunities in the industry [4].

Core Viewpoint - The actual controllers of Wenzhou Hongfeng Electric Alloy Co., Ltd. experienced a passive dilution of their shareholding percentage due to the conversion of convertible bonds, reducing their combined equity from 40.68% to 39.79%, which may impact the company's operations and governance structure [1]. Summary by Relevant Sections Shareholding Changes - The actual controllers, Mr. Chen Xiao and Ms. Lin Ping, saw their combined equity percentage decrease from 40.68% to 39.79% due to the increase in total share capital resulting from the conversion of convertible bonds [1]. - The total share capital increased to 10,086,831 shares during the period from July 25, 2025, to August 1, 2025 [1]. Individual Shareholding Details - Mr. Chen Xiao's shareholding remained unchanged at 168,636,292 shares, but his percentage of total shares decreased from 37.26% to 36.45% [1]. - Ms. Lin Ping's shareholding also remained unchanged at 15,444,000 shares, with her percentage decreasing from 3.41% to 3.34% [1]. - The total number of shares held by both controllers remained at 184,080,292, but their combined percentage decreased from 40.68% to 39.79% [1]. Compliance and Legal Aspects - The shareholding change does not violate any laws or regulations, including the Securities Law and relevant management measures for listed companies [2].

证券代码：300283 证券简称：温州宏丰 编号：2025-073 债券代码：123141 债券简称：宏丰转债 温州宏丰电工合金股份有限公司 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 特别提示： 圳分公司（以下简称"中国结算"）核准的价格为准。 按照 100.92 元/张的价格强制赎回。本次赎回完成后，"宏丰转债"将在深圳证 券交易所（以下简称"深交所"）摘牌，特提醒"宏丰转债"持券人注意在限期 内转股。债券持有人持有的"宏丰转债"如存在被质押或被冻结的，建议在停止 转股日前解除质押或冻结，以免出现因无法转股而被赎回的情形。 适当性管理要求的，不能将所持"宏丰转债"转换为股票，特提请投资者关注不 能转股的风险。 转债"，将按照 100.92 元/张的价格强制赎回。因目前"宏丰转债"二级市场价 格与赎回价格存在较大差异，特提醒"宏丰转债"持券人注意在限期内转股，如 果投资者未及时转股，可能面临损失，敬请投资者注意投资风险。 自 2025 年 7 月 8 日至 2025 年 7 月 31 日，温州宏丰电工合金股份有限公司 （以下简称"公司"）股票已有 15 ...

Core Viewpoint - Wenzhou Hongfeng has established a wholly-owned subsidiary, Wenzhou Hongfeng New Materials Research Institute, with an investment of 10 million RMB to enhance its R&D capabilities and create a collaborative innovation ecosystem in the new materials sector [1][7] Group 1: Investment and Establishment - The establishment of the Hongfeng New Materials Research Institute aims to consolidate R&D resources and improve the commercialization of technological achievements [1] - The research institute will focus on overcoming key technologies and enhancing independent innovation capabilities in the new materials field [1][7] Group 2: Market Potential and Growth - The Chinese metal composite materials market is projected to grow from 26.4 billion RMB in 2020 to 42 billion RMB in 2024, with a compound annual growth rate (CAGR) of 12.31%, further increasing to 61 billion RMB by 2027 [2] - The demand for high-performance alloy materials is driven by the rapid development of strategic emerging industries such as new energy and 5G communications [2] Group 3: Technological Advancements - The research institute will leverage AI algorithms to focus on core areas such as high-performance ultra-thin lithium battery copper foil and semiconductor etching materials [2] - The company has developed significant new materials, including precision composite materials for lithium batteries and silver-copper composite materials for electric circuit protection systems [6] Group 4: Industry Position and Capabilities - Wenzhou Hongfeng is recognized as a leading provider of new alloy functional composite materials and has established itself as a core supplier in strategic emerging industries [3][7] - The company has a total of 144 effective authorized patents, including 106 invention patents, showcasing its strong R&D capabilities and industry influence [6]

| 证券代码：300283 | 证券简称：温州宏丰 | 编号：2025-071 | | --- | --- | --- | | 债券代码：123141 | 债券简称：宏丰转债 | | 温州宏丰电工合金股份有限公司 关于实际控制人因可转债转股持股比例被动稀释 触及 1%及 5%整数倍的权益变动公告 | 信息披露义务人 | 陈晓、林萍 | | | --- | --- | --- | | 住所 | 浙江省乐清市****** | | | 权益变动时间 | 2025 年 7 月 25 日至 2025 年 8 | 月 1 日 | | 权益变动过程 | 2025 年 7 月 25 日至 2025 年 8 月 1 转股导致公司总股本增加至 10,086,831 | 日，因宏丰转债 股，公司实 | | | 际控制人陈晓先生、林萍女士合计持股比例由 | | | | 40.68%被动稀释至 39.79%，权益变动触及 | 1%及 5%整 | | | 数倍。 | | | 股票简称 | 温州宏丰 股票代码 | 300283 | 1.基本情况 | 变动方向 上升□ | 下降■ | 一致行动人 | 有■ 无□ | | | --- | -- ...

| 证券代码：300283 | 证券简称：温州宏丰 | 编号：2025-072 | | --- | --- | --- | | 债券代码：123141 | 债券简称：宏丰转债 | | 为优化公司研发资源的整合和统筹管理，提升平台化创新能力和重大科技项 目承接水平，建立高效的科技成果市场化转化机制，打造公司与产业链上下游企 业、高校等协同联动的"一核多点、全链协作"科技创新生态体系。温州宏丰电 工合金股份有限公司（以下简称"公司"）以自有资金人民币 1,000 万元投资设 立全资子公司温州宏丰新材料研究院有限公司（以下简称"宏丰新材料研究 院"）。该公司已于近日办理完成相关工商注册登记手续并取得了营业执照。 根据《深圳证券交易所创业板股票上市规则》等法律法规和公司《投资管理 制度》等相关规定，本次对外投资在总裁办公会决策权限范围内，无需提交公司 董事会审议批准。 二、投资标的的基本情况 名称：温州宏丰新材料研究院有限公司 统一社会信用代码：91330300MAERTG0P3U 温州宏丰电工合金股份有限公司 关于投资设立全资子公司并完成工商登记的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 ...

| 证券代码：300283 | 证券简称：温州宏丰 | 编号：2025-073 | | --- | --- | --- | | 债券代码：123141 | 债券简称：宏丰转债 | | 温州宏丰电工合金股份有限公司 关于提前赎回"宏丰转债"的第三次提示性公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 特别提示： 1、"宏丰转债"赎回价格：100.92 元/张（含当期应计利息，当期年利率为 2%，且当期利息含税），扣税后的赎回价格以中国证券登记结算有限责任公司深 圳分公司（以下简称"中国结算"）核准的价格为准。 10、根据安排，截至 2025 年 8 月 28 日收市后仍未转股的"宏丰转债"，将 按照 100.92 元/张的价格强制赎回。本次赎回完成后，"宏丰转债"将在深圳证 券交易所（以下简称"深交所"）摘牌，特提醒"宏丰转债"持券人注意在限期 内转股。债券持有人持有的"宏丰转债"如存在被质押或被冻结的，建议在停止 转股日前解除质押或冻结，以免出现因无法转股而被赎回的情形。 11、债券持有人若转股，需开通创业板交易权限。投资者不符合创业板股票 适当性管理要 ...

Core Viewpoint - Wenzhou Hongfeng Electric Alloy Co., Ltd. has triggered the conditional redemption clause for its convertible bonds due to the stock price exceeding 130% of the conversion price for a specified period, leading to a decision to redeem the bonds at a price of 100.92 yuan per bond [2][6][7]. Group 1: Convertible Bond Redemption - The company has decided to exercise its right to redeem the "Hongfeng Convertible Bonds" early, based on the current market conditions and to reduce interest expenses [2][6]. - The redemption price is set at 100.92 yuan per bond, which includes accrued interest calculated based on a 2.0% annual interest rate [7][8]. - The redemption will be completed by September 5, 2025, with the bonds being delisted from the Shenzhen Stock Exchange after the redemption [8][9]. Group 2: Bond Issuance and Terms - The "Hongfeng Convertible Bonds" were issued with a total fundraising amount of 321.26 million yuan, netting 315.06 million yuan after expenses [2]. - The initial conversion price was set at 6.92 yuan per share, which has been adjusted to 5.35 yuan per share due to various factors including profit distribution [3][5][6]. - The bonds were listed on the Shenzhen Stock Exchange on April 8, 2022, and have a conversion period from March 21, 2022, to March 14, 2028 [3][4]. Group 3: Conditions for Redemption - The conditional redemption clause allows the company to redeem the bonds if the stock price remains above 130% of the conversion price for at least 15 trading days within a 30-day period [6][7]. - As of July 31, 2025, the stock price has met this condition, prompting the board to approve the early redemption [2][6]. Group 4: Shareholder Information - The company has confirmed that there have been no transactions of the convertible bonds by major shareholders or executives in the six months leading up to the redemption condition being met [8]. - Shareholders are advised to consult their brokerage firms regarding the conversion process before the redemption [9].

Core Insights - Wenzhou Hongfeng New Materials Research Institute Co., Ltd. has been established with a registered capital of 10 million yuan [1] - The company is wholly owned by Wenzhou Hongfeng and its legal representative is Chen Xiao [1] Company Overview - The business scope includes general projects such as new materials technology research and development, engineering and technology research and experimental development, and new materials technology promotion services [1] - Additional activities include research and development of electronic special materials, technical services, software development, and manufacturing and sales of metal materials [1] - The company is also involved in technology import and export, as well as goods import and export, operating independently under its business license [1]