利好消息再度密集来袭，2月25日午后，商业航天概念突发异动，菲利华一度狂飙16%创历史新高，航 天发展涨超6%。所在的军工板块整体拉升，高人气军工ETF华宝（512810）涨逾1%，日线冲击四连 阳。 | 分时 多日 1分 5分 · | | | | | F9 盘前盘后 婴加 九转 画线 工具 @ (7 ) | | | | | | 蛋工ETF华宝 ① | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | | | | 512810(至工ETF华型 13:37 价 0.879 器歌 0.009(1.03%) 均价 0.8 S | | | 1.15% | | 0.879 +0.009 +1.03% | | COLOR A | | | 0.877 | | | | JUTY | | | 0.77% | | SSE CNY 13:37:51 交易中 查看L2全县 | | | 通政区 . + | | | | | ning on | | | | | 净值走势 | | SCOTTE III PROPE 101 ...

格隆汇2月25日丨菲利华(300395.SZ)涨8.89%，报113.090元，股价创历史新高，总市值590.63亿元。 ...

2月25日，菲利华涨5.15%，截至发稿，报109.21元/股，成交28.28亿元，换手率5.25%，总市值570.37亿 元。 申万菱信中证军工指数A（163115）成立日期2021年1月1日，最新规模7.33亿。今年以来收益8.73%， 同类排名1589/5570；近一年收益40.41%，同类排名1179/4305；成立以来收益104.14%。 申万菱信中证军工指数A（163115）基金经理为王赟杰。 截至发稿，王赟杰累计任职时间5年220天，现任基金资产总规模51.66亿元，任职期间最佳基金回报 60.57%， 任职期间最差基金回报-25.46%。 声明：市场有风险，投资需谨慎。 本文基于第三方数据库自动发布，不代表新浪财经观点，任何在本 文出现的信息均只作为参考，不构成个人投资建议。如有出入请以实际公告为准。如有疑问，请联系 biz@staff.sina.com.cn。 责任编辑：小浪快报 资料显示，湖北菲利华石英玻璃股份有限公司位于湖北省荆州市东方大道68号，成立日期1999年1月22 日，上市日期2014年9月10日，公司主营业务涉及主要从事光通讯、半导体、太阳能、航空航天及其他 领域用高性能石英 ...

1、机构称AI芯片领域，钻石散热潜在市场空间广阔。 明日线索 2月24日，培育钻石概念大涨，四方达20cm涨停，黄河旋风涨停。 消息面上，河南省科技厅官微此前消息，热沉片是金刚石家族的新成员，它让超硬材料成功进入高端芯片散热这个新赛道。黄 河旋风表示，从热沉片上切割出来所需要的形状，以某种方式贴合在芯片上，做成顶级散热器，这将大大促进高功率器件、 5G/6G通信、AI算力性能的提升。如今，制约产业化的尺寸瓶颈已被突破，黄河旋风成功研制出国内可量产的最大8英寸热沉 片。据悉，公司热沉片生产车间将于今年2月份投入量产，这是功能性金刚石从实验室，迈向规模化商业应用的一个里程碑。 据中邮证券，AI芯片领域，钻石散热潜在市场空间广阔。假设2030年全球AI芯片市场规模为3万亿人民币；AI芯片中钻石散热方 案渗透率分别为5%、10%、20%、50%；钻石散热价值量占比分别为5%、8%、10%，进行弹性测算，钻石散热市场空间的区间 为75亿至1500亿元。 | 图表12: Al 芯片领域钻石散热市场空间弹性测算表 | | | | | | | --- | --- | --- | --- | --- | --- | | 单位( ...

A股马年首个交易日（2月24日），军工板块盘初短线下探后快速回升，而后持续飘红，高人气军工ETF 华宝（512810）摸高1.98%，收涨1.16%日线三连阳，全天频现溢价，收盘溢价率仍有0.29%，显示买盘 资金活跃。 成份股57涨23跌，中航重机、菲利华涨超8%居前，中国动力大涨6.17%，权重股中国船舶、航发动力、 光启技术齐涨超2%。臻镭科技、航天发展等多只商业航天人气股逆市下跌。 消息面上，春节前后军工各领域催化不断。国内，春运期间，14架国产大飞机C919日均执飞近50班航 班，同比增长52.6%，2026国产化进度加速可期。商业航天方面，业内人士表示，3至6月有望迎来可回 收火箭试验的密集验证。 东方证券最新研报建议"加大军工板块配置，核心看好大飞机和军贸"。该机构认为，大飞机瓶颈环节提 速超预期、军贸在中东等新市场份额提升的预期有望随近期地缘事件强化，应重点加大这两个方向的配 置，并等待商业航天、内需方向的机会。* 【投军工，选"八一"】代码有"八一"的军工ETF华宝（512810）（原国防军工ETF）覆盖"大飞机、商业 航天、低空经济、卫星导航、军工信息化、可控核聚变"等诸多热门主题，同时是 ...

【天风建筑建材 & 新材料】周观点 20260223 节前1-2周涨幅较好的主线为：①AI 算力相关电子材料主线，以特种电子布为核心的玻纤领涨建材板块；PCB 基材、半导体封装材料、液冷相关标的领涨新材料板块；②AI + 建筑主线，VR/AR 应用、算力 + 工程咨询设计相 关标的领涨建筑板块；③外围市场 PCB 核心基材、半导体设备/材料主线领涨。 下周重点关注： 1、科技主线持续回归，核心推荐【电子布】赛道：①供需格局持续失衡，行业整体供需缺口约 20%，26 年 1 月 起全品类电子布均出现供应紧张，企业在手订单已达 2 个月水平，预计26 年全年将维持供应偏紧格局；②产能供 给刚性收缩，普通电子布产能向高端转移带来60% 产能损失，全品类供给持续收缩；③涨价节奏加快、弹性充 足，25 年电子布行业普遍提价 4-5 次，26 年 已提价10%，高端 DK 布、Q 布、CTE布价格仍处上行通道；④扩产 瓶颈短期无法突破，高端产品生产依赖的丰田高端织布机交付周期长达 1-2 年，但需关注池窑法突破（单个池窑 年产3000吨VS坩埚36吨）带来的供应增加（29年有可能供过于求）；⑤库存与需求端共振，CCL及电 ...

军工股震荡走高，亚星锚链涨停，捷强装备、菲利华、天海防务、航发动力、航天环宇跟涨。 ...

PCB概念股持续拉升，中材科技、江南新材、国际复材、宏和科技、中国巨石、铜冠铜箔盘中创新高， 山东玻纤、天通股份涨停，明阳电路、德龙激光涨超10%，逸豪新材、菲利华、深南电路跟涨。 ...

Investment Rating - The industry is rated as "Buy" with expectations of an increase exceeding 15% in the next 3-6 months [57]. Core Insights - The report emphasizes that upstream materials are a key inflationary component in the PCB upgrade iteration process, with three main conclusions: the number of PCBs is increasing, the value of PCBs per cabinet/GPU is rising, and upstream materials are undergoing continuous upgrades [2][8]. - The market is focusing on materials that are close to "ultimate" technology or "upgrade" directions, indicating a potential profit release in 2026 [3][18]. - The report highlights the significant price inflation in electronic fabrics, particularly Low-CTE and Q fabrics, driven by supply constraints and increasing demand from high-end applications [4][15][24]. Summary by Sections Upstream Materials - The report identifies that the PCB board count is increasing, and the corresponding value per cabinet/GPU is also on the rise, particularly with the introduction of new PCB designs like the Vera Rubin NVL144 CPX [2][8]. - Continuous upgrades in PCB upstream materials are necessary to meet the higher demands for transmission speed and signal integrity from AI applications [11][12]. - Upstream materials are prone to inflation, with significant price differences observed in various generations of electronic fabrics [15][18]. Electronic Fabrics - The report predicts a continued price increase for Low-CTE fabrics in 2026 due to supply shortages and rising demand from high-end applications [4][36]. - The second-generation Low-Dk fabrics are expected to face a clear supply-demand gap in 2026, driven by the large-scale deployment of Google's TPU V7 and above [36][37]. - Q fabrics are highlighted for their superior performance and scarcity, with a gradual increase in production expected in 2027 [26][34]. Copper Foil - The report notes a clear upgrade trend in HVLP copper foil, with significant price increase potential due to rising demand from AI applications and planned expansions by leading manufacturers [5][41]. - The market for carrier copper foil is identified as a second growth pole, with a current global market size of approximately 5 billion, primarily dominated by Japanese companies [49][50]. Resins - The report discusses the importance of resin types, particularly carbon-hydrogen resins, in high-frequency and high-speed applications, with domestic companies accelerating production to meet demand [51][54].

Investment Rating - The industry is rated as "Buy" with an expected increase of over 15% in the next 3-6 months [57]. Core Insights - The report emphasizes that upstream materials are a key inflationary component in the PCB upgrade iteration process, with three main conclusions: the number of PCBs is increasing, the value of PCBs per cabinet/GPU is rising, and upstream materials are undergoing continuous upgrades [2][8]. - The market is focusing on materials that are close to "ultimate" technology or "upgrade" directions, indicating a potential profit release in 2026 [3][18]. - The report highlights the significant price inflation in electronic fabrics, particularly Low-CTE and Q fabrics, driven by supply constraints and increasing demand from AI applications [4][15][26]. Summary by Sections Upstream Materials - The report identifies that the PCB upgrade process is characterized by increasing PCB quantities and value, with a focus on the evolving requirements for materials such as electronic fabrics, copper foil, and resins [2][8]. - It notes that the industry trends for upstream materials lag behind PCB developments by 0.5-1 year, suggesting a delayed but strong profit release potential in 2026 [3][21]. - The sensitivity of material prices to market trends is highlighted, indicating that cost structures and supply dynamics are favorable for upstream materials [3][22]. Electronic Fabrics - The report predicts a continued price increase for Low-CTE fabrics due to supply shortages and rising demand, particularly from high-end applications [4][38]. - Q fabrics are expected to see significant adoption starting in 2027, with a strong short-term outlook due to supply constraints [26][34]. - The second-generation Low-Dk fabrics are anticipated to face a clear supply-demand gap in 2026, driven by the large-scale rollout of Google's TPU V7 and above [36][37]. Copper Foil - The report discusses the clear upgrade path for HVLP copper foil, with major producers expanding capacity and confirming strong demand trends [5][41]. - The market for carrier copper foil is identified as a second growth area, with a current global market size of approximately 5 billion, primarily dominated by Japanese firms [49]. - Price increases for HVLP copper foil are expected, supported by strong demand from AI and high-performance computing applications [46][45]. Resins - The report highlights the importance of resin types in high-frequency and high-speed applications, with carbon-hydrogen resins being the mainstream choice for advanced PCBs [51][54]. - Domestic companies are accelerating production to meet the growing demand for high-performance resins, indicating a shift towards local supply chains [54].