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飞凯材料:公司紫外固化光纤光缆涂覆材料客户覆盖国内外大中型光纤光缆制造企业
Zheng Quan Ri Bao Wang· 2026-02-02 08:11
证券日报网讯2月2日,飞凯材料(300398)在互动平台回答投资者提问时表示,公司紫外固化光纤光缆 涂覆材料下游客户几乎覆盖了国内外大中型光纤光缆制造企业。 ...
飞凯材料股价涨5.09%,华夏基金旗下1只基金位居十大流通股东,持有246.47万股浮盈赚取327.81万元
Xin Lang Cai Jing· 2026-01-30 06:02
Group 1 - The core viewpoint of the news is that Feikai Materials has seen a stock price increase of 5.09%, reaching 27.47 CNY per share, with a trading volume of 1.172 billion CNY and a turnover rate of 7.80%, resulting in a total market capitalization of 15.574 billion CNY [1] - Feikai Materials, established on April 26, 2002, and listed on October 9, 2014, specializes in the research, production, and sales of new materials, particularly ultraviolet curing materials suitable for high-tech applications [1] - The company's main business revenue composition includes: display materials at 52.32%, semiconductor materials at 24.51%, ultraviolet curing materials at 22.78%, and other materials at 0.40% [1] Group 2 - Among the top circulating shareholders of Feikai Materials, Huaxia Fund's Huaxia CSI 1000 ETF (159845) reduced its holdings by 7,500 shares in the third quarter, now holding 2.4647 million shares, which represents 0.44% of the circulating shares [2] - The Huaxia CSI 1000 ETF has a current scale of 49.908 billion CNY, with a year-to-date return of 9.67%, ranking 1624 out of 5557 in its category, and a one-year return of 44.21%, ranking 1738 out of 4285 [2] - The fund manager, Zhao Zongting, has been in position for 8 years and 291 days, overseeing a total fund asset scale of 356.966 billion CNY, with the best fund return during his tenure being 122.37% and the worst being -32.63% [2]
飞凯材料20260126
2026-01-26 15:54
Summary of the Conference Call for Feikai Materials Company Overview - **Company**: Feikai Materials - **Year**: 2025 - **Total Revenue**: Over 3.2 billion CNY Key Business Segments and Performance 1. UV Curing Materials - **Revenue**: Approximately 560 million CNY, a year-on-year increase of about 15% - **Drivers**: Growth in multimode fiber and drone fiber applications, expected to continue into 2026, potentially reaching historical highs of over 500 million CNY [2][8] 2. Semiconductor Materials - **Total Revenue**: 670 million CNY, flat compared to 2024 - **Wet Electronic Chemicals Revenue**: 330 million CNY, a year-on-year increase of 25% - **Factors**: Strong demand from AI computing, data centers, automotive-grade chips, and storage markets, with expectations for continued growth in 2026 [2][6] 3. LCD Business - **Total Revenue**: Approximately 1.32 billion CNY after acquiring Japan's JNC liquid crystal business - **Integration**: Improved gross margins expected in the second half of the year due to better profit management [2][10] 4. Pharmaceutical Intermediates - **Revenue**: 160 million CNY, a year-on-year decrease of nearly 5% - **TMO Product Revenue**: 41 million CNY, a year-on-year increase of 50%, driven by export growth in the European market [2][5][17] Strategic Developments 1. Acquisition of JNC - **Impact**: Expanded market share in the small and medium-sized LCD market, with over 600 high-value patents aiding in establishing a strong patent moat [2][9] 2. New Production Capacity - **Location**: Zhangjiagang - **Expected Production Start**: 2027 - **Total Capacity**: Estimated at 30,000 tons, with an expected output value of 700-800 million CNY [2][12] 3. Sale of Dairui Company - **Reason**: Geopolitical factors limiting supply to major clients like TSMC; sold for 227.5 million CNY to avoid future performance pressure [4][13] Market Trends and Future Outlook 1. Semiconductor and Display Markets - **Demand**: Strong growth in semiconductor and display sectors, particularly in AI computing and advanced packaging technologies [6][15] - **LCD Market**: Stable demand with annual global demand around 900 tons, with price stability expected due to concentrated production among a few manufacturers [11] 2. Focus on High-Margin Products - **Strategy**: Continued emphasis on high-margin products and optimization of profit management to enhance overall profitability [4][19] 3. 2026 Development Outlook - **Goals**: Focus on high-barrier sectors, organic synthesis, and formula development, alongside mergers and acquisitions to explore new opportunities [18][19] Additional Insights - **Drone Fiber Applications**: Emerging demand noted, with a small contribution to overall revenue growth [7] - **Environmental Regulations**: TMO products gaining traction in Europe due to completed INCI certification, expected to maintain growth momentum [17] This summary encapsulates the key points from the conference call, highlighting the performance, strategic initiatives, and future outlook of Feikai Materials.
公司互动丨这些公司披露在算力等方面最新情况
Di Yi Cai Jing· 2026-01-26 14:43
1月26日,多家上市公司通过互动平台、披露投资者关系活动记录表等渠道披露公司在算力等方面最新 情况: 【算力】 甘咨询:公司无算力方面的业务 (本文来自第一财经) 首都在线:将持续把握封关机遇,深化跨境算力服务能力 【半导体】 雷电微力:自研芯片已应用于北斗导航卫星 太力科技:公司依托核心材料技术优势深度布局航天应用赛道 飞凯材料:正合作开发与调试相关材料,共同提升HBF制程工艺 【航天】 【其他】 思进智能:多工位智能精密温热镦成形装备已进入实质性研制阶段 ...
飞凯材料:公司始终关注并跟进包括HBF在内的先进封装技术发展趋势
Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, particularly HBF, and is developing materials that can be applied in HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF manufacturing processes [1] - The company is currently in the verification and introduction phase for temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials that are compatible with HBF process conditions [1] - The company is collaborating closely with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of the HBF process [1] Group 2: Future Outlook - The company plans to leverage its existing collaboration foundation to continuously iterate and innovate its material technologies [1] - The goal is to establish a solid technical advantage and enhance market influence in advanced packaging fields such as HBF [1]
飞凯材料:截至2026年1月9日股东人数66175户
Xin Lang Cai Jing· 2026-01-26 13:19
Group 1 - The company, Feikai Materials, reported that as of January 9, 2026, the number of shareholders is 66,175 [2][4][5]
飞凯材料:截至2026年1月20日股东人数为69827户
Zheng Quan Ri Bao Wang· 2026-01-26 11:45
Group 1 - The core point of the article is that Feikai Materials (300398) reported a total of 69,827 shareholders as of January 20, 2026 [1]
飞凯材料:公司将持续聚焦客户前沿需求,推动材料技术的迭代与创新
Zheng Quan Ri Bao Wang· 2026-01-26 11:40
Core Viewpoint - Feikai Materials (300398) is actively involved in the semiconductor advanced packaging sector, focusing on the production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF and HBM manufacturing processes [1] Group 1: Product Development - The company has achieved stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants for HBF and HBM manufacturing processes [1] - The packaging processes for HBF and HBM involve wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated scaled revenue [1] Group 2: Collaboration and Innovation - The company is closely collaborating with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of HBF and HBM process technologies [1] - Future efforts will continue to focus on customer cutting-edge demands, driving the iteration and innovation of material technologies [1]
飞凯材料:正合作开发与调试相关材料 共同提升HBF制程工艺
Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, including HBF, and is developing materials suitable for HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants applicable to HBF manufacturing processes [1] - The HBF packaging process involves wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated significant revenue [1] Group 2: Collaboration and Future Prospects - The company is closely collaborating with relevant manufacturers to develop and test related materials [1] - The goal of this collaboration is to enhance the maturity and reliability of the HBF process technology [1]
飞凯材料发预增,预计2025年归母净利润3.5亿元至4.55亿元,同比增长42.07%至84.69%
Zhi Tong Cai Jing· 2026-01-23 10:03
Group 1 - The company Feikai Materials (300398.SZ) has disclosed its annual performance forecast for 2025, expecting a net profit attributable to shareholders of between 350 million yuan and 455 million yuan, representing a year-on-year growth of 42.07% to 84.69% [1] - The net profit after deducting non-recurring gains and losses is projected to be between 325 million yuan and 423 million yuan, indicating a year-on-year increase of 35.58% to 76.25% [1]