Dowstone(300409)

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道氏技术与能斯达、芯培森达成人形机器人关键材料合作
Bei Jing Shang Bao· 2025-07-29 12:47
Core Viewpoint - Guangdong Daoshi Technology Co., Ltd. has signed a strategic cooperation agreement with Suzhou Nengsida Electronics Technology Co., Ltd. and its affiliate Guangdong Chiperson Technology Co., Ltd. to enhance the development and market expansion of key components for humanoid robots [1] Group 1: Strategic Cooperation - The three parties will integrate their strengths to focus on the research and market development of materials needed for electronic muscles, electronic skin, and joints in humanoid robots [1] - Daoshi Technology will be responsible for the research and production of carbon materials, while Nengsida will apply these carbon materials in material formulations [1] - Chiperson will provide molecular simulation design and high-speed computing support for the materials [1] Group 2: Market Development - The collaboration aims to jointly explore downstream markets to promote the sales and application of key components [1]
道氏技术(300409.SZ):拟与能斯达等围绕人形机器人电子皮肤等关键零部件所需材料的研发与市场拓展等方面展开深度合作
Ge Long Hui A P P· 2025-07-29 11:50
Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to enhance collaboration in the field of new materials, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The agreement aims to integrate the strengths of all parties involved to develop and market key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - The collaboration will leverage the technological and production advantages of the company in carbon materials, while Nengsida has developed multiple electronic skin products for humanoid robots [1] - Chipenson's APU computing servers will provide high-speed computing support for various material research scenarios [1] Group 2: Product Development and Market Expansion - The strategic partnership will facilitate the application of carbon materials, including graphene powder, carbon nanotube powder, and conductive pastes, in humanoid robot components [1] - This initiative is expected to accelerate the application process of carbon materials in critical components, thereby enhancing the company's competitiveness in the new materials and related industries [1] - The cooperation aligns with the company's long-term development strategy and benefits all shareholders [1]
道氏技术拟与能斯达、芯培森就碳材料应用于人形机器人关键零部件开展合作
Zhi Tong Cai Jing· 2025-07-29 11:40
Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Xinpeisen Technology Co., Ltd. to enhance innovation in the new materials sector, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration aims to integrate the strengths of all parties in the development and market expansion of key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - The partnership will leverage Nengsida's advancements in electronic skin technology and Xinpeisen's APU computing servers to support material research and development [1] Group 2: Product Development - The strategic cooperation will facilitate the expansion of applications for carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The focus will be on accelerating the application process of carbon materials in critical components of humanoid robots, enhancing product performance [1]
道氏技术(300409.SZ)拟与能斯达、芯培森就碳材料应用于人形机器人关键零部件开展合作
智通财经网· 2025-07-29 11:38
Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to enhance the development and market expansion of key materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration focuses on integrating the strengths of each party in the development of materials needed for humanoid robot components such as electronic muscles, electronic skin, and joints [1] - The partnership aims to leverage the company's technological and production advantages in carbon materials, while Nengsida has launched several electronic skins for humanoid robots [1] - Chipenson's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the joint efforts in material development [1] Group 2: Product Application and Market Expansion - The strategic cooperation will help the company expand the application scenarios of its carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The initiative is expected to accelerate the application process of carbon materials in key components of humanoid robots, enhancing product performance [1]
道氏技术:与能斯达及芯培森签署战略合作协议 将碳材料应用于人形机器人电子肌肉等关键零部件材料配方中
Mei Ri Jing Ji Xin Wen· 2025-07-29 11:37
Core Viewpoint - The announcement highlights a strategic cooperation agreement between the company, Suzhou Nengsida Electronics Technology, and its affiliate Guangdong Chipenson Technology, focusing on the development and market expansion of key components for humanoid robots, including electronic muscles, electronic skin, and joints [1] Group 1 - The agreement aims to integrate the strengths of the three parties in the research and development of materials required for key components of humanoid robots [1] - The collaboration will involve the application of carbon materials in the formulation of electronic muscles, electronic skin, and joints, enhancing product performance [1] - The agreement is a framework agreement, with specific cooperation matters to be approved and disclosed according to relevant regulations [1]
道氏技术:与两家公司签订《战略合作协议》
Mei Ri Jing Ji Xin Wen· 2025-07-29 11:35
Group 1 - The company, Dao Shi Technology, has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to focus on innovation in the new materials sector [1] - Dao Shi Technology has established technical and production advantages in carbon material products, while Nengsida has launched several electronic skins for humanoid robots [1] - The collaboration aims to integrate the strengths of all parties to develop and market key components such as electronic muscles, electronic skin, and joints for humanoid robots, enhancing product performance through the application of carbon materials [1] Group 2 - For the fiscal year 2024, Dao Shi Technology's revenue composition is projected to be 99.97% from manufacturing and 0.03% from other sources [1] - As of the report, Dao Shi Technology has a market capitalization of 13.9 billion yuan [1]
道氏技术:签订人形机器人相关战略合作框架协议
Zheng Quan Shi Bao Wang· 2025-07-29 11:32
Core Viewpoint - Dao's Technology (300409) has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chip Peisen Technology Co., Ltd. to enhance innovation in the new materials sector, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The agreement aims to integrate the strengths of the three companies in the development and market expansion of key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - Dao's Technology has established technical and production advantages in carbon material products, while Nengsida has launched multiple electronic skin products for humanoid robots [1] - Chip Peisen's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the collaboration [1] Group 2: Focus on Carbon Materials - The collaboration will focus on applying carbon materials in the formulation of key components for humanoid robots, enhancing product performance [1]
道氏技术:公司与能斯达及关联方芯培森签署战略合作框架协议
Xin Lang Cai Jing· 2025-07-29 11:29
Group 1 - The core point of the article is the strategic cooperation agreement signed between the company, Suzhou Nengsida Electronic Technology Co., Ltd., and its affiliate Guangdong Chip Peisen Technology Co., Ltd. to enhance the development and market expansion of key components for humanoid robots [1] - The collaboration will focus on integrating strengths in the research and development of materials needed for electronic muscles, electronic skin, and joints of humanoid robots [1] - The agreement serves as a framework for long-term cooperation, guiding future specific collaboration matters that will follow relevant approval procedures and information disclosure obligations [1]
道氏技术:公司与能斯达及关联方芯培森签署战略合作框架协议 围绕人形机器人电子肌肉等方面展开深度合作
news flash· 2025-07-29 11:27
Core Viewpoint - The company, Daoshi Technology, has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chiperson Technology Co., Ltd. to enhance the development and market expansion of key components for humanoid robots [1] Group 1 - The collaboration will focus on integrating each party's strengths in the research and development of materials needed for electronic muscles, electronic skin, and joints in humanoid robots [1] - The agreement aims to apply carbon materials in the formulation of key component materials for humanoid robots, thereby improving product performance [1] - This framework agreement serves as a guiding document for the long-term cooperation among the three parties, with specific cooperation matters to follow relevant approval procedures and information disclosure obligations [1]
道氏技术(300409) - 关于签订战略合作框架协议的公告
2025-07-29 11:22
关于签订战略合作框架协议的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有 虚假记载、误导性陈述或重大遗漏。 特别提示: 证券代码:300409 证券简称:道氏技术 公告编号:2025-082 广东道氏技术股份有限公司 1.广东道氏技术股份有限公司(以下简称"道氏技术"或"公司")本次签订 《战略合作协议》,不会对公司本年度财务状况及经营业绩构成重大影响,如 后续具体合作对公司当年度业绩有重大影响将另行公告。 2.公司最近三年内签署的框架性协议或意向性协议均在正常履行中。 3.根据相关法律法规,本次签署《战略合作协议》无需提交公司董事会或 股东大会审议,也不构成《上市公司重大资产重组管理办法》规定的重大资产 重组事项。 一、协议签署概况 近日,公司与苏州能斯达电子科技有限公司(以下简称"能斯达")及关联 方广东芯培森技术有限公司(以下简称"芯培森")签署了《战略合作协议》。 公司聚焦新材料领域创新,已在碳材料产品上具备技术和生产优势,能斯达已 推出多款电子皮肤并应用于人形机器人,芯培森研发的APU算力服务器为多个 材料研发场景提供高速算力支撑,三方将整合各自优势,围绕人形机器人电子 肌肉、 ...