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迈为股份(300751) - 第三届董事会第十八次会议决议公告
2025-11-21 09:14
证券代码:300751 证券简称:迈为股份 公告编号:2025-064 苏州迈为科技股份有限公司第三届董事会第十八次会议通知于 2025 年 11 月 14 日以邮件、书面送达和电话的方式发出。会议于 2025 年 11 月 21 日上午 10:00 在苏州市吴江区大兢路 8 号行政办公楼 1 楼会议室以现场会议结合通讯 表决的方式召开。本次会议应出席会议董事 7 人,实际参加董事 7 人,会议由董 事长周剑主持,公司高级管理人员列席了会议。本次会议的召集、召开和表决程 序符合有关法律、法规和《公司章程》的规定,会议形成的决议合法有效。 二、董事会会议审议情况 本次会议以记名方式投票表决,审议通过以下事项: 1、审议通过《关于对部分应收账款进行债务重组的议案》 本议案详情请见公司于同日在巨潮资讯网(http://www.cninfo.com.cn)披 露的《关于日常经营重大合同进展暨部分应收账款进行债务重组的公告》。 表决结果:同意7票,弃权0票,反对0票。 三、备查文件 苏州迈为科技股份有限公司 第三届董事会第十八次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚 假记载、误导 ...
迈为股份(300751) - 关于日常经营重大合同进展暨部分应收账款进行债务重组的公告
2025-11-21 09:14
证券代码:300751 证券简称:迈为股份 公告编号:2025-063 苏州迈为科技股份有限公司 关于日常经营重大合同进展暨部分应收账款进行债务重组 的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有 虚假记载、误导性陈述或重大遗漏。 重要内容提示: 1、苏州迈为科技股份有限公司(以下简称"公司")作为债权人,甘肃金 刚光伏股份有限公司(以下简称"金刚光伏"、"*ST 金刚")之控股子公司欧 昊新能源电力(甘肃)有限责任公司、苏州金刚光伏科技有限公司(以下合称"债 务人")作为债务人,本次应收账款债务重组总金额为 37,092.45 万元,预计造 成公司债务重组损失 8,546.50 万元。 2、本次债务重组事项不构成重大资产重组。本次债务重组有利于加速现金 流的回笼,降低应收款项风险。 二、债务重组对方的基本情况 (一)欧昊新能源电力(甘肃)有限责任公司 1、注册地址:甘肃省酒泉市肃州区经济技术开发区南园(奥凯路向南 500 米) 2、统一社会信用代码:91620902MA73F4H2X3 3、注册资本:30000 万人民币 公司于 2025 年 11 月 21 日召开第三届董事会第十八 ...
今日共59只个股发生大宗交易,总成交13.35亿元
Di Yi Cai Jing· 2025-11-18 09:47
Group 1 - A total of 59 stocks in the A-share market experienced block trading today, with a total transaction value of 1.335 billion yuan [1] - The top three stocks by transaction value were Shanxi Fenjiu (186 million yuan), Hanrui Cobalt (109 million yuan), and Jinkong Electric (80.34 million yuan) [1] - Among the stocks, 9 were traded at par, 5 at a premium, and 45 at a discount; the stocks with the highest premium rates were Bosi Software (19.41%), Jiaxun Feihong (16.8%), and Yongtai Energy (11.11%) [1] - The stocks with the highest discount rates included Zhi De Mai (20.12%), Wens Foodstuff Group (19.6%), and Nuo Si Ge (19.44%) [1] Group 2 - The ranking of institutional buy amounts was led by Shanxi Fenjiu (167 million yuan), followed by Keli'er (37.41 million yuan) and Sanfeng Intelligent (29.27 million yuan) [1] - Other notable institutional buys included Action Education (18.20 million yuan), Chunfeng Power (12.87 million yuan), and Zhi De Mai (11.47 million yuan) [1] - The top stock sold by institutional special seats was Jinkong Electric (80.34 million yuan), followed by Maiwei Co. (3.21 million yuan) [2]
迈为股份(300751):半导体设备加速放量,钙钛矿先发优势明显
Soochow Securities· 2025-11-18 09:32
Investment Rating - The report maintains a "Buy" rating for the company [1] Core Views - The company is experiencing accelerated growth in semiconductor equipment, with a significant advantage in perovskite technology [1] - The forecast for net profit attributable to the parent company for 2025-2027 is 7.6 billion, 8.8 billion, and 11.0 billion RMB respectively, with corresponding P/E ratios of 39, 34, and 27 times [1] Financial Performance Summary - Total revenue for 2023 is projected at 8,089 million RMB, with a year-on-year growth of 94.99%. However, a decline of 23.09% is expected in 2025 [1][8] - Net profit attributable to the parent company for 2023 is estimated at 913.90 million RMB, with a growth of 6.03%. A decrease of 17.39% is anticipated in 2025 [1][8] - The latest diluted EPS for 2023 is 3.27 RMB, expected to drop to 2.74 RMB in 2025 before rising to 3.93 RMB by 2027 [1][8] Market Position and Product Development - The company has made significant advancements in semiconductor wafer etching and advanced packaging equipment, achieving key breakthroughs with differentiated technology [7] - The company has successfully launched several core devices in the semiconductor packaging sector and has a leading market share in laser grooving equipment [7] - The company is expanding its product matrix in 2024, introducing new equipment such as temporary bonding machines and laser debonding machines [7] - The company is also rapidly advancing in perovskite technology, adding a full suite of equipment necessary for perovskite tandem solar cells [7]
迈为股份今日大宗交易平价成交3万股,成交额321.06万元
Xin Lang Cai Jing· 2025-11-18 08:53
Group 1 - On November 18, Maiwei Co., Ltd. executed a block trade of 30,000 shares, with a transaction amount of 3.21 million yuan, accounting for 0.56% of the total transaction volume for the day [1][2] - The transaction price was 107.02 yuan, which remained unchanged compared to the market closing price of 107.02 yuan [1][2]
光伏设备板块11月17日跌1.33%,迈为股份领跌,主力资金净流出41.94亿元
Zheng Xing Xing Ye Ri Bao· 2025-11-17 08:53
证券之星消息,11月17日光伏设备板块较上一交易日下跌1.33%,迈为股份领跌。当日上证指数报收于 3972.03,下跌0.46%。深证成指报收于13202.0,下跌0.11%。光伏设备板块个股涨跌见下表: | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 603398 | *ST沐邦 | 8.61 | 5.00% | 1.98万 | 1705.64万 | | 688147 | 微导纳米 | 59.48 | 3.30% | 21.61万 | 13.18亿 | | 300093 | *ST全刚 | 14.59 | 3.04% | 5.89万 | 8394.16万 | | 003022 | 联泓新科 | 22.25 | 2.72% | 40.59万 | 9.04亿 | | 300051 | 班升科技 | 7.19 | 1.41% | 11.19万 | 8003.22万 | | 000821 | 京山轻机 | 13.92 | 1.38% | 37.02万 | 5.20亿 | | 605117 | 德业股 ...
存储芯片板块冲高回落 迈为股份、诚邦股份跌超6%
Xin Lang Cai Jing· 2025-11-17 05:15
Group 1 - The storage chip sector experienced a sharp rise followed by a decline, with Maiwei Co., Ltd. and Chengbang Co., Ltd. both dropping over 6% [1] - Shannon Semiconductor fell more than 4%, while Jiangbolong, Haoshanghao, and Huahaikongke also saw declines [1]
光伏设备板块持续走低 国晟科技跌超8%



Xin Lang Cai Jing· 2025-11-17 02:28
Core Viewpoint - The photovoltaic equipment sector continues to decline, with Guosheng Technology dropping over 8%, and other companies such as Hongyuan Green Energy, Maiwei Co., and Shuangliang Energy also experiencing declines [1] Company Summary - Guosheng Technology has seen a significant drop of over 8% in its stock price [1] - Hongyuan Green Energy, Maiwei Co., and Shuangliang Energy are following suit with declines in their stock prices [1] Industry Summary - The overall trend in the photovoltaic equipment sector is negative, indicating potential challenges within the industry [1]
迈为股份股价跌5.01%,易方达基金旗下1只基金位居十大流通股东,持有322.43万股浮亏损失1844.32万元
Xin Lang Cai Jing· 2025-11-17 02:07
Group 1 - The core point of the news is that Maiwei Co., Ltd. has experienced a decline in stock price, dropping 5.01% to 108.48 CNY per share, with a total market value of 30.31 billion CNY and a cumulative drop of 4.36% over three consecutive days [1] - Maiwei Co., Ltd. is engaged in the design, research and development, production, and sales of high-end intelligent manufacturing equipment, with its main business revenue composition being 75.00% from solar cell production equipment, 18.10% from single machines, and 6.90% from parts and others [1] Group 2 - From the perspective of major circulating shareholders, E Fund's Chuangye ETF (159915) reduced its holdings by 541,400 shares in the third quarter, now holding 3,224,300 shares, which accounts for 1.67% of circulating shares, resulting in a floating loss of approximately 18.44 million CNY today [2] - E Fund's Chuangye ETF has achieved a return of 47.2% this year, ranking 602 out of 4,216 in its category, and a return of 34.96% over the past year, ranking 851 out of 3,956 [2]
发展异质异构集成技术,逐渐成为大算力需求下的“重中之重”
势银芯链· 2025-11-15 00:02
Core Insights - The article discusses the growing demand for "big computing power" driven by advancements in AI and high-performance computing, highlighting the need for a transformation in chip manufacturing due to challenges like the "von Neumann bottleneck" and the slowdown of Moore's Law [2][3] - Heterogeneous integration and heterogeneous-hybrid integration technologies are becoming crucial for achieving high-performance, multifunctional electronic systems, supported by national policies promoting foundational research in advanced technologies [2][3] Group 1: Heterogeneous Integration - Heterogeneous integration focuses on integrating different semiconductor materials (e.g., silicon-based chips with gallium nitride and silicon carbide) into a single package to overcome physical limitations of single materials [3] - The main challenges include managing thermal expansion coefficient mismatches, material interface defects, and thermal management [3] Group 2: Heterogeneous-Hybrid Integration - Heterogeneous-hybrid integration combines different process nodes (e.g., 7nm logic chips with 28nm I/O chips) and functional modules (e.g., CPU, GPU, memory) using advanced packaging technologies to create system-in-package (SIP) solutions [3] - This approach aims to optimize cost and performance while addressing challenges such as interconnect standardization, yield control, and signal integrity [3] Group 3: Upcoming Forum - TrendBank plans to host the "2025 Heterogeneous-Hybrid Integration Frontier Forum" in Ningbo on November 18-19, 2025, focusing on cutting-edge heterogeneous-hybrid integration technologies [4] - The forum will feature discussions on various topics related to heterogeneous-hybrid integration, with confirmed participation from several key industry players and research institutions [4][6] Group 4: Conference Details - The conference is expected to attract 300-500 participants and will include a range of presentations from experts in the field, covering advancements in semiconductor technologies and integration methods [36][37] - Registration details indicate different ticket pricing options, including early bird discounts and student rates [37]