股票上市地点：深圳证券交易所 股票简称：易天股份 股票代码：300812 信息披露义务人：千吉（嘉兴）股权投资合伙企业（有限合伙） 住所：浙江省嘉兴市南湖区东栅街道南江路 1856 号基金小镇 1 号楼 205 室-81 深圳市易天自动化设备股份有限公司 简式权益变动报告书（受让方） 上市公司名称：深圳市易天自动化设备股份有限公司 （自主申报） 通讯地址：广东省深圳市南山区南头街道梦海大道 5033 号卓越前海壹号 B 座 6 层 604 股份变动性质：股份增加、持股比例上升（协议转让） 签署日期：2025 年 10 月 19 日 1 信息披露义务人声明 一、信息披露义务人依据《中华人民共和国公司法》《中华人民共和国证券 法》《上市公司收购管理办法》《公开发行证券的公司信息披露内容与格式准则 第 15 号——权益变动报告书》等相关法律、法规和规范性文件编写本报告书。 二、信息披露义务人签署本报告书已获得必要的授权和批准。 三、依据《中华人民共和国证券法》《上市公司收购管理办法》的规定，本 报告书已全面披露信息披露义务人在深圳市易天自动化设备股份有限公司（以下 简称"易天股份"或"公司"）中拥有权益的股份变动情 ...

证券代码：300812 证券简称：易天股份 公告编号：2025-052 深圳市易天自动化设备股份有限公司 关于控股股东、实际控制人拟协议转让公司部分股份 暨权益变动的提示性公告 公司控股股东、实际控制人柴明华先生、高军鹏先生、胡靖林先生及其一 致行动人深圳市易天恒投资管理合伙企业（有限合伙）及受让方千吉（嘉兴） 股权投资合伙企业（有限合伙）保证向本公司提供的信息内容真实、准确、完 整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 特别提示： 1、深圳市易天自动化设备股份有限公司（以下简称"公司"或"易天股份"） 的控股股东、实际控制人柴明华先生、高军鹏先生、胡靖林先生与千吉（嘉兴） 股权投资合伙企业（有限合伙）（以下简称"千吉投资"）于 2025 年 10 月 19 日签署了《股份转让协议》（以下简称"本协议"），柴明华先生、高军鹏先生、 胡靖林先生拟通过协议转让的方式向千吉投资转让其持有的公司无限售流通股 股份分别为 2,982,649 股、2,503,787 股、1,517,416 股，分别占公司总股本的 比例为 2.1293%、1.7874%、 ...

Group 1 - The core focus of the company is on the research and development of fully automated micro-level high-precision micro-assembly equipment and Mini LED repair equipment [2] - The company has launched a 3μm high-precision placement equipment that can be applied in the Chiplet-specific equipment field, enabling domestic substitution [2] - The micro-assembly equipment has entered the supply chain systems of major organizations such as China Aerospace Science and Technology Corporation and AVIC Optoelectronics [2]

（文章来源：证券日报） 证券日报网讯易天股份10月9日在互动平台回答投资者提问时表示，在先进封装设备领域，公司控股子 公司微组半导体以倒装贴片技术为核心不断提升产品性能，丰富产品线，涵盖了Dipping/TCB/覆膜等工 艺，相关产品可用于SIP（系统级封装）、MEMS器件、射频器件、微波器件和混合电路的微组装，已 取得了日月新半导体、高通、长电科技等客户订单，其中部分订单已经验收。微组半导体的微组装设备 可应用于部分光模块的部分器件组装工序，设备精度已满足100G的精度，在800G/1.6T的精度方向尚处 在市场调研阶段，尚待进一步研发。公司目前的产能能够满足客户订单需求，暂无产能扩张计划。 ...

格隆汇10月9日丨易天股份(300812.SZ)在投资者互动平台表示，在先进封装设备领域，公司控股子公司 微组半导体以倒装贴片技术为核心不断提升产品性能，丰富产品线，涵盖了Dipping/TCB/覆膜等工艺， 相关产品可用于SIP（系统级封装）、MEMS器件、射频器件、微波器件和混合电路的微组装，已取得 了日月新半导体、高通、长电科技等客户订单，其中部分订单已经验收。 微组半导体的微组装设备可 应用于部分光模块的部分器件组装工序，设备精度已满足100G的精度，在800G/1.6T的精度方向尚处在 市场调研阶段，尚待进一步研发。 公司目前的产能能够满足客户订单需求，暂无产能扩张计划。 ...

Core Viewpoint - Yitian Co., Ltd. (300812) is actively engaged in the MicroLED sector, highlighting its proprietary AM-10HB chip mounter as a key packaging device for MicroLED micro-displays and its collaboration with Shanghai Xianyao [1] Group 1: Company Developments - The company’s subsidiary, Micro Group Semiconductor, has developed the AM-10HB chip mounter, which is essential for MicroLED micro-display production [1] - Yitian has established a partnership with Shanghai Xianyao to enhance its capabilities in the MicroLED field [1] Group 2: Product Offerings - In the VR/AR/MR display device sector, the company provides a range of equipment necessary for the production processes, including MicroOLED (silicon-based OLED) wafer display polarizer attachment equipment, PF film attachment equipment, OCA bonding equipment, HTH full bonding equipment, optical assembly equipment, and fully automated testing equipment [1] - The company’s equipment covers essential processes in module assembly and post-assembly stages for VR/AR/MR technologies [1] Group 3: Client Engagement - Yitian has secured orders from notable clients such as BOE Technology Group, Visionox Technology, Goertek Inc. (002241), Wuhu Microdisplay, and Dream Display Technology [1]

Core Viewpoint - Yitian Co., Ltd. (300812) focuses on providing specialized equipment and overall solutions for flat panel displays and semiconductor devices, aiming to replace imports with domestic products to reduce costs and improve efficiency for clients [1] Product Categories - The main product categories include LCD display equipment, flexible OLED display equipment, VR/AR/MR display equipment, Mini/MicroLED equipment, traditional packaging equipment, and advanced packaging equipment [1] - These products are widely applicable in the production of display components for consumer electronics such as mobile phones, tablets, automotive displays, computers, televisions, commercial displays, and wearable devices [1]

Core Viewpoint - Yitian Co., Ltd. specializes in providing overall solutions for flat panel display equipment and semiconductor equipment, and does not directly produce PCB products [1] Group 1 - The company utilizes a fully automatic bonding production line that employs ACF conductive particle glue technology to connect PCB with COF [1] - This technology is part of the packaging process for display module driver circuits, which involves circuit board assembly applications [1]

Core Viewpoint - The company Yitian Co., Ltd. (300812) has confirmed that its subsidiary, Micro Group Semiconductor, has developed micro-assembly equipment that meets the precision requirements for certain components in optical modules, specifically achieving 100G precision and securing customer orders [1] Group 1 - The micro-assembly equipment can be applied to specific assembly processes of optical module components [1] - The company plans to enhance product precision and increase research and development efforts towards achieving 800G and 1.6T precision [1]

Group 1 - The company, Yitian Co., Ltd. (300812), has a diverse product range including LCD display devices, flexible OLED display devices, VR/AR/MR display devices, Mini/MicroLED devices, traditional packaging equipment, and advanced packaging equipment [1] - The applications of these products are extensive, covering 5G optical communication module assembly and the production of display devices for consumer electronics [1]