星宸科技（301536）(301536.SZ)公告，公司拟使用自有资金和/或自筹资金(含股票回购专项贷款资金 等)以集中竞价方式回购部分公司已发行的普通股(A股)股票用于实施股权激励和/或员工持股计划。本次 回购股份的价格为不超过88.90元/股(含)，拟回购资金总额不低于6000万元(含)，不超过1.2亿元(含)。回 购期限为自公司董事会审议通过本次回购方案之日起不超过12个月。 ...

Core Viewpoint - The company plans to repurchase its A-shares using its own and/or self-raised funds to implement equity incentives and/or employee stock ownership plans [1] Group 1: Repurchase Details - The repurchase price will not exceed 88.90 RMB per share, which is 150% of the average trading price over the last 30 trading days prior to the board's approval [1] - The total amount for the repurchase will be no less than 60 million RMB and no more than 120 million RMB [1] - Based on the upper and lower limits of the repurchase amount and the maximum repurchase price, the estimated number of shares to be repurchased is between 674,916 and 1,349,831 shares, representing 0.16% to 0.32% of the company's total share capital [1] Group 2: Repurchase Timeline - The repurchase period will last no more than 12 months from the date of the board's approval of the repurchase plan [1]

智通财经APP讯，星宸科技(301536.SZ)公告，公司拟使用自有资金和/或自筹资金(含股票回购专项贷款 资金等)以集中竞价方式回购部分公司已发行的普通股(A股)股票用于实施股权激励和/或员工持股计划。 本次回购股份的价格为不超过88.90元/股(含)，拟回购资金总额不低于6000万元(含)，不超过1.2亿元 (含)。回购期限为自公司董事会审议通过本次回购方案之日起不超过12个月。 ...

证券代码：301536 证券简称：星宸科技 公告编号：2026-001 第二届董事会第十三次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 2026年1月8日，星宸科技股份有限公司（以下简称"公司"）第二届董事会 第十三次会议在公司会议室以现场会议及通讯会议相结合的方式召开，会议通 知于2026年1月6日以电话或邮件的形式发出，经全体董事一致同意，本次会议 豁免通知时限的要求。会议应出席董事9人，实际出席董事9人，会议由董事长 林永育先生主持，部分高级管理人员列席会议。本次会议的召开符合相关法律 法规和《公司章程》规定。 二、董事会会议审议情况 1、审议通过《关于以集中竞价交易方式回购公司股份方案的议案》 经审议，董事会认为：基于对公司未来持续发展的坚定信心及对公司内在 价值的高度认可，为了维护广大投资者利益，增强投资者对公司的信心；同时 为进一步建立健全公司长效激励机制、充分调动核心员工的积极性、提升团队 凝聚力、携手共促公司的长远健康发展，在综合考量公司经营情况、财务状况、 未来盈利能力及近期公司股票二级市场表现等因素 ...

证券代码：301536 证券简称：星宸科技 公告编号：2026-002 星宸科技股份有限公司 关于以集中竞价交易方式回购公司股份方案的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 重要内容提示： 1、回购股份基本情况 星宸科技股份有限公司（以下简称"公司"）拟使用自有资金和/或自筹资金 （含股票回购专项贷款资金等）以集中竞价方式回购部分公司已发行的人民币普 通股（A股）股票用于实施股权激励和/或员工持股计划。本次回购股份的价格为 不超过88.90元/股（含），回购价格上限未超过公司董事会审议通过回购股份方 案前30个交易日公司股票交易均价的150%，拟回购资金总额不低于人民币6,000 万元（含），不超过人民币12,000万元（含）。按回购总金额上下限和回购股份 价格上限测算，预计可回购股份数量为674,916股至1,349,831股，占公司目前总 股本比例为0.16%至0.32%。具体回购数量及回购金额以回购期满或回购完毕时 实际回购的股份数量和回购金额为准。回购期限为自公司董事会审议通过本次回 购方案之日起不超过12个月。 公司将在回购期限内根据市 ...

证券日报网讯1月5日，星宸科技（301536）在互动平台回答投资者提问时表示，公司后续将尽快推出面 向具身智能机器人大小脑的SoC芯片，该芯片属于机器人大小脑的主控芯片，相关业务尚处于前期研发 及市场接洽阶段。 ...

Investment Rating - The industry investment rating is maintained as "Positive" [5] Core Insights - The report emphasizes the importance of advancements and innovations in edge AI, predicting accelerated integration into various hardware products and industrial applications by 2026 [9][10] - Key players in the edge AI sector include chip manufacturers, terminal product manufacturers, and core component manufacturers, with specific companies highlighted for investment opportunities [3][10] Summary by Sections Investment Recommendations and Targets - Focus on the upgrade and innovation breakthroughs in edge AI, with recommended stocks including: - Edge AI main control chip manufacturers: Amlogic, Aojie Technology, Hengxuan Technology, Espressif Technology, Starshine Technology, Rockchip [3][10] - Terminal product manufacturers: Lenovo Group, Xiaomi Group, Luxshare Precision, Linying Intelligent Manufacturing, BYD Electronics, Lens Technology, Ezviz, Innosilicon [3][10] - Core component manufacturers: Huanxu Electronics, Sunny Optical Technology, Orbbec, SUTENG, STMicroelectronics, OmniVision, and Pegatron [3][10]

Core Viewpoint - The company, Xingchen Technology, has developed chip products for commercial low-altitude economic devices and consumer drones using 3D ToF technology, and has also released chips for mid-to-high-end automotive laser radar, while not currently engaging in millimeter-wave radar chips or space communication fields [1] Group 1 - The company has a smart perception business line that utilizes 3D ToF technology [1] - Chip products have been developed for commercial low-altitude economic devices and consumer-grade drones [1] - The company has released chips aimed at mid-to-high-end automotive laser radar [1]

每经AI快讯，12月30日，星宸科技（301536）在互动平台表示，公司车规级激光雷达SPAD芯片 SS905HP(高线数)与SS901(低线数)覆盖超1000线至192线分辨率的长距离应用，适用于L3及以上场景； 已进入客户对接落地阶段，第一批产品将于2026年上半年量产。 ...

Core Viewpoint - Xingchen Technology (301536.SZ) is currently not involved in the fields of millimeter-wave radar chips and space communication [1] Group 1: Business Focus - The company has developed chip products for commercial low-altitude economy devices and consumer-grade drones using 3D ToF technology [1] - It has also released chip products aimed at mid-to-high-end automotive laser radar [1]