香港聯合交易所有限公司及證券及期貨事務監察委員會對本公告的內容概不 負 責，對 其 準 確 性 或 完 整 性 亦 不 發 表 任 何 意 見，並 明 確 表 示 概 不 就 因 本 公 告 全 部或任何部分內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 NEXCHIP SEMICONDUCTOR CORPORATION* 合肥晶合集成電路股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 警 告 本公告乃根據香港聯合交易所有限公司（「聯交所」）以及證券及期貨事務監察 委員會（「證監會」）的 規 定 而 刊 發，僅 用 作 向 香 港 的 公 眾 人 士 提 供 資 料。 閣 下 閱 覽 本 公 告，即 代 表 閣 下 知 悉、接 納 並 向 合 肥 晶 合 集 成 電 路 股 份 有 限 公 司 （「本公司」）、其 獨 家 保 薦 人、整 體 協 調 人、顧 問 或 包 銷 團 成 員 表 示 同 意： (a) 在聯交所網站登載本公告，並不引起本公司、其獨家保薦人、整體協調人、 顧問或包銷團成員須在香港或任何其他司法權區進行發售或配售活動的 責 任。本 公 司 最 終 會 否 進 行 發 售 ...

The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. NEXCHIP SEMICONDUCTOR CORPORATION* 合肥晶合集成電路股份有限公司 (A joint stock company incorporated in the People's Republic of China with limited liability) WA ...

Group 1 - Hefei Jinghe Integrated Circuit Co., Ltd. has officially submitted its listing application to the Hong Kong Stock Exchange, aiming for a main board listing [1] - The exclusive sponsor for this issuance is China International Capital Corporation (CICC) [1] - Jinghe Integrated Circuit specializes in semiconductor manufacturing, with products including logic chips, memory chips, and specialty process chips, widely used in smart terminals, automotive electronics, and the Internet of Things [3] Group 2 - The company has a strong market competitiveness in the domestic wafer foundry sector, achieving breakthroughs in advanced processes and specialty processes through continuous R&D and capacity expansion [3] - Jinghe Integrated Circuit's core production base is located in Hefei, with a production capacity for 12-inch wafers [3] - The company has been increasing its R&D investment and accelerating the layout of advanced process nodes, particularly in power management chips and display driver chips, establishing a stable customer base and promoting domestic substitution [3] Group 3 - The listing in Hong Kong is expected to help the company broaden its financing channels, enhance capital strength, and accelerate its international strategy, improving its competitive position in the global semiconductor supply chain [3] - The domestic wafer foundry industry is experiencing rapid development opportunities due to the continuous growth in global semiconductor market demand [3] - The company plans to use the funds raised from the listing to further expand production line construction, optimize product structure, and accelerate R&D investment in high-end processes, thereby continuously enhancing its core competitiveness and supporting the self-controllable development of China's semiconductor industry chain [3]

Core Viewpoint - Hefei Jinghe Integrated Circuit Co., Ltd. has submitted a listing application to the Hong Kong Stock Exchange, with CICC as the exclusive sponsor, while currently being listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board [1] Group 1: Company Overview - The company is a global leader in 12-inch pure wafer foundry services, focusing on advanced process research and application, providing wafer foundry services across process nodes from 150nm to 40nm, and steadily advancing the 28nm platform [4][5] - The company has established mass production capabilities for technology nodes from 150nm to 40nm and has a diverse process platform covering DDIC, CIS, PMIC, Logic IC, and MCU, which supports its leading position in key market segments [5][6] Group 2: Market Position and Growth - According to Frost & Sullivan, from 2020 to 2024, the company has the fastest capacity and revenue growth among the top ten global wafer foundry companies, and by 2024, it is projected to be the ninth largest globally and the third largest in mainland China by revenue [4] - The company is expected to be the largest DDIC wafer foundry globally and the fifth largest CIS wafer foundry globally by 2024, as well as the third largest CIS wafer foundry in mainland China [5] Group 3: Financial Performance - The company's revenue for the years ending December 31 for 2022, 2023, and 2024, as well as for the six months ending June 30, 2024, and 2025, were RMB 10.026 billion, RMB 7.183 billion, RMB 9.120 billion, RMB 4.331 billion, and RMB 5.130 billion respectively [6] - The company's attributable profit for the same periods were RMB 3.045 billion, RMB 119 million, RMB 482 million, RMB 195 million, and RMB 232 million respectively [6][7] Group 4: R&D and Future Plans - The company has a high-quality R&D team with 1,924 members, accounting for 35% of total employees, with 64.8% holding a master's degree or higher, reflecting its academic depth and professional strength [6] - The funds from the upcoming financing will be used for R&D and optimization of a new generation 22nm technology platform, AI-based intelligent R&D and production planning, establishing a R&D and sales center in Hong Kong, and general corporate purposes [9]

每经AI快讯，9月29日，利弗莫尔证券显示，合肥晶合集成电路股份有限公司向港交所提交上市申请 书，独家保荐人为中金公司（601995）。 ...

The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Application Proof, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Application Proof. Application Proof of Nexchip Semiconductor Corporation* 合肥晶合集成電路股份有限公司 (A joint stock company incorporated in the People's Republic of C ...

香港聯合交易所有限公司及證券及期貨事務監察委員會對本申請版本的內容概不負責，對其準確性或完整 性亦不發表任何聲明，並明確表示概不就因本申請版本全部或任何部分內容而產生或依賴該等內容而引致 的任何損失承擔任何責任。 NEXCHIP SEMICONDUCTOR CORPORATION* 合肥晶合集成電路股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 的申請版本 警 告 本申請版本乃根據香港聯合交易所有限公司（「聯交所」）及證券及期貨事務監察委員會（「證監會」）的要求而 刊發，僅用作提供資訊予香港公眾人士。 本申請版本為草擬本，其內所載資訊並不完整，亦可能會作出重大變動。閣下閱覽本文件，即代表閣下知悉、 接納並向合肥晶合集成電路股份有限公司（「本公司」，連同其附屬公司統稱「本集團」）、本公司的獨家保薦人、 整體協調人、顧問或包銷團成員表示同意： 本申請版本不會向於美國的人士刊發或分發，當中所述證券並無亦不會根據1933年美國證券法登記，且在 根 據1933年美國證券法辦理登記手續或取得豁免前不得於美國發售或出售。不會於美國公開發售證券。 本申請版本及當中所載資料均非於美國或任何其他禁止進行有關要約或銷售的 ...

Core Viewpoint - The stock of Hefei Jinghe Integrated Circuit Co., Ltd. experienced significant price fluctuations, with a cumulative closing price increase of over 30% over three consecutive trading days, prompting the company to clarify its operational status and confirm no undisclosed major information [2][3]. Stock Trading Anomaly - The company's stock price increased by over 30% from September 24 to September 26, 2025, which is classified as an abnormal trading fluctuation according to the Shanghai Stock Exchange regulations [2]. - The closing price of the stock on September 26, 2025, was 32.90 yuan per share, with trading volumes significantly higher than previous levels, indicating increased market activity [2][4]. Operational Status - The company confirmed that its daily operations are normal, with no significant changes in market conditions or production costs, and that its internal operations are stable [3]. - There have been no major adjustments in industry policies or market environments affecting the company's operations [3]. Major Events - The company held a board meeting on August 28, 2025, approving the issuance of H-shares and plans for listing on the Hong Kong Stock Exchange, with further developments to be disclosed in compliance with legal requirements [4]. - As of the announcement date, the company and its controlling shareholders have no undisclosed major information that could significantly impact stock prices [4][7]. Media and Market Rumors - The company has not identified any media reports or market rumors that could have a significant impact on its stock trading prices [5]. Board Statement - The board of directors confirmed that, apart from disclosed matters, there are no undisclosed items that should be reported according to the relevant regulations of the Shanghai Stock Exchange [7].

格隆汇9月26日｜晶合集成公告，合肥晶合集成电路股份有限公司股票于2025年9月24日、2025年9月25 日和2025年9月26日连续3个交易日内收盘价格涨幅偏离值累计超过30%，根据《上海证券交易所交易规 则》等有关规定，属于股票交易异常波动的情形。经公司自查，并发函询证公司控股股东，截至本公告 披露日，不存在应披露而未披露的重大信息。公司目前生产经营正常，生产经营未发生重大变化。 ...

Core Viewpoint - Huqin Technology Co., Ltd. has submitted an application for H-share listing on the Hong Kong Stock Exchange, aiming to enhance global operations and advanced manufacturing capabilities, marking a new chapter in its internationalization [2] Group 1: Company Overview - Established in 2005, Huqin Technology is a globally recognized ODM manufacturer, with a revenue exceeding 100 billion yuan in 2024, and is the leading ODM in smartphone shipments from 2020 to 2024 [3] - The company has upgraded its strategy to a "3+N+3" intelligent product platform, focusing on smartphones, personal computers, and data center businesses while expanding into automotive electronics, software, and robotics [3] Group 2: Market Position and Growth Potential - The global ODM market for smartphones is expected to see an increase in penetration from 24.4% in 2015 to 42% by 2025, indicating significant growth potential compared to the 80% penetration in the PC sector [4] - The rapid development of AI is anticipated to drive Huqin Technology's growth, with AI PC penetration in Greater China projected to reach 34% by 2025 [4] Group 3: Data Center Business - Huqin Technology's data center business is expected to grow rapidly, supported by the demand for AI computing and the "East Data West Computing" initiative, with the market size projected to reach 318 billion yuan by 2025 [5] - The company has invested 14.75 billion yuan in R&D over the past three years, employing over 19,000 R&D personnel, which constitutes 27.4% of its workforce [5] Group 4: Vertical Integration and Acquisitions - Since 2022, Huqin Technology has made several acquisitions to enhance its vertical integration strategy, including companies specializing in precision components for smart devices [6] - The acquisition of a 6% stake in Hefei Jinghe Integrated Circuit Co., Ltd. for 2.39 billion yuan marks Huqin's entry into the semiconductor manufacturing sector, aligning with its strategy to integrate vertically [8] Group 5: Future Growth Strategies - Huqin Technology plans to expand into the robotics market by acquiring a majority stake in Shenzhen Haocheng Intelligent Technology Co., Ltd., aiming to develop its robotics business as a core growth area [11] - The company is focused on high-growth sectors and aims to leverage its technological strengths to achieve synergies with acquired companies, enhancing its competitive edge in the global market [13]