Workflow
PMIC
icon
Search documents
晶合集成向港交所递交上市申请 近三年研发支出32亿元
Ge Long Hui· 2025-09-29 12:29
格隆汇9月29日丨据港交所9月29日披露,合肥晶合集成电路股份有限公司(以下简称"公司"或"晶合集成")向 港交所递交上市申请,独家保荐人为中金公司。公司现时于上海证券交易所科创板上市。 公司已建立150nm至40nm技术节点的量产能力。在工艺平台应用方面,公司已具备DDIC、CIS、PMIC、 LogicIC、MCU等工艺平台的技术能力,形成了全面且多元化的工艺组合,支持公司在关键细分市场的领先 地位。根据弗若斯特沙利文的资料,2024年按收入计,公司是全球最大的DDIC晶圆代工企业、全球第五大 CIS晶圆代工企业及中国大陆第三大CIS晶圆代工企业。公司的多元化工艺平台让公司有效解决广泛应用领 域的不断变化需求,包括消费电子、汽车电子、智能家居、工业控制、AI及物联网。公司不断提升制程技 术,进一步优化了产品结构。截至最后实际可行日期,公司已开始28nm Logic IC试产,启动40nm高压 OLED DDIC风险生产,实现55nm中高阶背照式图像传感器及55nm全流程堆栈式CIS量产,并正在稳步推进 OLED DDIC等其他28nm晶圆代工解决方案的研发工作。 公司的创新源动力来自一支兼具本土与国际背景 ...
晶合集成递表港交所 营收增长速度位列全球前十大晶圆代工企业首位
Zhi Tong Cai Jing· 2025-09-29 08:58
招股书显示,晶合集成是一家全球领先的12英寸纯晶圆代工企业。自2015年成立以来,始终致力于研发 并应用行业先进的工艺,为客户提供覆盖150nm至40nm制程、多种应用的工艺平台晶圆代工业务,并稳 定推进28nm平台发展。 根据弗若斯特沙利文的资料,2020年至2024年期间,全球前十大晶圆代工企业中,晶合集成的产能和营 收增长速度为全球第一。根据同一资料来源,2024年,以营业收入计,晶合集成是全球第九大、中国大 陆第三大晶圆代工企业。 据港交所9月29日披露,合肥晶合集成电路股份有限公司(简称:晶合集成)(688249.SH)向港交所主板提交 上市申请书,中金公司(601995)为其独家保荐人。 晶合集成已建立150nm至40nm技术节点的量产能力。在工艺平台应用方面,公司已具备DDIC、CIS、 PMIC、Logic IC、MCU等工艺平台的技术能力,形成了全面且多元化的工艺组合,支持其在关键细分市 场的领先地位。 晶合集成战略性立足于半导体价值链的核心,为客户提供将芯片设计转化为低功耗、高性能的代工芯片 的专用平台。通过衔接技术发展与大规模生产,公司提供晶圆代工服务及提供广泛应用于消费电子、汽 车电子 ...
台湾半导体:台积电乘超级人工智能周期与先进制程节点需求热潮;成熟制程或逐步向UMC和VIS溢出-Taiwan SeTaiwan Semiconductors_ TSMC Riding on Super AI Cycle & Overwhelming Advanced Node Demand; Trailing Edge May Gradually Overflow to UMC and VIS
2025-09-29 03:06
A c t i o n | 25 Sep 2025 09:04:47 ET │ 26 pages Taiwan Semiconductors TSMC Riding on Super AI Cycle & Overwhelming Advanced Node Demand; Trailing Edge May Gradually Overflow to UMC and VIS CITI'S TAKE Driven by promising demand on leading edge advanced node and AI demand, we believe TSMC will reallocate more of its RD resources and capacity to the most advanced node and advanced packaging. TSMC previously already announced to sell some trailing edge WFE to VIS for VIS' Singapore fab expansion from 130nm to ...
势银观察 | 全球面板级封装产业起量,但仍处于技术推广阶段
势银芯链· 2025-09-12 04:01
Core Viewpoint - The article discusses the current state and future potential of Panel Level Packaging (PLP) technology in China, highlighting its market size, key players, and the anticipated growth in the industry [2][3][4]. Market Overview - The existing market size for PLP in China is estimated at 38 million USD, accounting for 20% of the global PLP market, with expectations to exceed 100 million USD by 2028 [2]. - The PLP technology is still in the trial-and-error phase, with major companies expressing high expectations for its future applications in storage and computing chip packaging [2]. Key Players - Major global players in the PLP market include Samsung Electronics, ASE Group, STMicroelectronics, Powertech Technology, Hefei Silan Microelectronics, and Chongqing Silan Microelectronics [2]. - Domestic companies like Silan Microelectronics and Yicheng Technology are emerging as significant competitors, with Silan Microelectronics ranking among the top two in market share for power semiconductor PLP solutions [3]. Technological Development - The article emphasizes that domestic companies are accelerating the development of PLP platforms, preparing for a new technological iteration cycle in the packaging industry over the next 2-3 years [4]. - The focus of the upcoming conference will be on advanced packaging technologies, including multi-material heterogeneous integration and optical-electrical co-packaging [6]. Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, aimed at fostering collaboration and innovation in the advanced electronic information industry [5][6].
圣邦股份-随着 SKU 扩张,PMIC 处于复苏中;二季度营收 —— 净利润因毛利率改善而超出预期;中性评级
2025-09-04 15:08
Summary of SG Micro (300661.SZ) Conference Call Company Overview - **Company**: SG Micro - **Ticker**: 300661.SZ - **Industry**: Semiconductor, specifically focusing on signal chain IC and PMIC sectors Key Financial Highlights - **2Q25 Revenues**: Rmb1.0 billion, representing a **21% YoY** increase and a **30% QoQ** increase, which was **13% higher** than Goldman Sachs estimates (GSe) [2][3] - **Net Income**: Rmb141 million, up **13% YoY** and **136% QoQ**, only **5% ahead** of GSe [2][3] - **Gross Margin**: Improved to **51.0%** in 2Q25, slightly above GSe of **50.4%**, but lower than **52.2%** in 2Q24 [2][3] - **Operating Margin**: **15.4%** in 2Q25, up from **5.9%** in 1Q25 [3] Product Performance - **Signal Chain Products**: Revenues increased by **29% YoY** in 1H25 [2] - **PMIC Products**: Revenues increased by **8% YoY** in 1H25 [2] - **Product Range**: SG Micro has approximately **5,900 ready-for-sale products**, with potential for expansion compared to over **80,000 products** from global leaders [9] Market Position and Strategy - **Competitive Strength**: SG Micro is viewed positively as a local analog leader, but faces uncertainties regarding the pace of ASP (Average Selling Price) and margin recovery due to ongoing competition [1][5] - **R&D Investment**: Continuous investment in R&D is expected to support new product launches, which include automotive-grade operational amplifiers, low noise operational amplifiers, and low power consumption temperature sensors [9][10] Earnings Revision and Forecast - **Earnings Estimates**: 2025E revenues raised by **2%** to Rmb4.216 billion, while EPS estimates for 2025-27E were adjusted down by **0%/2%/2%** due to higher operating expenses and tax rates [10][11] - **Target Price**: Raised to **Rmb87.0** from **Rmb78.3**, applying a **51x target P/E** multiple to 2026E EPS [12][19] Risks and Considerations - **Demand Fluctuations**: Risks include stronger or weaker demand for smartphones and consumer electronics [20] - **Competition**: The company faces potential challenges from domestic peers and the pace of new product launches [20] Conclusion - **Rating**: Neutral, reflecting uncertainties in ASP and margin recovery despite positive growth indicators and strong product development pipeline [1][19]
豪威集团- 车载图像传感器(CIS)放量及汽车新产品拓展;2025 年第二季度符合预期;买入
2025-09-02 14:24
Summary of OmniVision (603501.SS) Conference Call Company Overview - **Company**: OmniVision (formerly known as Will Semi) - **Industry**: Automotive Camera Image Sensors (CIS) Key Points Financial Performance - **2Q25 Results**: Revenues grew by 16% YoY, reaching Rmb 7,484 million, which was in line with guidance but 2% lower than estimates [1][3] - **Gross Margin**: Reported at 30.0%, slightly below estimates by 0.6 percentage points, attributed to higher contributions from lower-margin distribution business [3] - **Net Income**: Increased by 44% YoY to Rmb 1,162 million, exceeding estimates by 8% [3] Automotive CIS Growth - **Revenue Contribution**: Automotive CIS accounted for 37% of total CIS business in 1H25, up from 31% in 1H24, indicating strong growth momentum [2][3] - **Future Expectations**: Management is optimistic about continued growth driven by increased camera adoption and specification upgrades in smart driving technology [2] Product Development - **New Products**: The company is ramping up production of new products, including a 50Mpx sensor and a 200Mpx CIS targeting flagship models, expected to launch in 2H25 [1][2] - **Expansion into New Areas**: OmniVision has begun mass production of LCOS products for AR-HUD in passenger vehicles and launched several new automotive-related products [2] Earnings Revisions - **2025 Earnings**: Revised down by 1% due to lower revenues from smartphone CIS and changes in product mix, while 2026 and 2027 earnings were revised up by 2% each due to higher revenues from automotive new products [7][8] Valuation and Target Price - **Target Price**: Updated to Rmb 191.0, based on a 33x target P/E multiple for 2026E, reflecting long-term EPS growth potential [8][15] - **Current Price**: Rmb 145.20, indicating an upside potential of 31.5% [17] Risks - **Potential Risks**: Include slower new product expansion, weaker-than-expected demand in the smartphone market, and impacts from trade tensions [16] Additional Insights - **Operating Expenses**: The operating expense ratio was stable at 13.7% in 2Q25, indicating effective cost management [3] - **Market Position**: OmniVision is positioned to leverage growth in the automotive sector, which is seen as a major long-term driver for the company [2] This summary encapsulates the essential insights from the conference call, highlighting OmniVision's financial performance, growth strategies, and market outlook.
晶合集成(688249):CIS、PMIC营收占比持续提升,新品逐步导入市场
China Post Securities· 2025-09-02 11:22
Investment Rating - The report maintains a "Buy" rating for the company, expecting a relative increase in stock price of over 20% compared to the benchmark index within the next six months [7][15]. Core Views - The company has shown a continuous increase in revenue and profit, with H1 2025 revenue reaching 5.198 billion yuan, up 18.21% year-on-year, and net profit attributable to shareholders at 332 million yuan, up 77.61% year-on-year [3][4]. - The company is actively expanding its product offerings, particularly in CIS and PMIC segments, which are increasingly contributing to revenue [5][6]. - The company is also making significant advancements in new product development, particularly in OLED display driver chips, with expectations for mass production by the end of 2025 [6]. Company Overview - The latest closing price of the company's stock is 24.89 yuan, with a total market capitalization of 49.9 billion yuan [2]. - The company has a total share capital of 2.006 billion shares, with 1.187 billion shares in circulation [2]. - The company's asset-liability ratio stands at 48.2%, and the current P/E ratio is 92.19 [2]. Financial Performance - For H1 2025, the company achieved a comprehensive gross margin of 25.76% [4]. - The main business revenue for H1 2025 was 5.130 billion yuan, with a significant portion coming from various process nodes and application products [5]. - Revenue projections for 2025, 2026, and 2027 are estimated at 10.864 billion yuan, 12.485 billion yuan, and 14.153 billion yuan, respectively, with net profits expected to be 854 million yuan, 1.256 billion yuan, and 1.526 billion yuan [7][11].
晶合集成(688249):25H1业绩保持增长态势,产品结构持续优化
Huachuang Securities· 2025-09-01 11:34
Investment Rating - The report maintains a "Strong Buy" rating for the company, with a target price of 32.1 yuan [2][7]. Core Views - The company achieved a revenue of 5.198 billion yuan in H1 2025, representing a year-on-year growth of 18.21%. The net profit attributable to shareholders reached 332 million yuan, up 77.61% year-on-year [7]. - The demand for the company's products is driven by the acceleration of domestic substitution in CIS, growth in automotive semiconductors, and power management chips, alongside the release of new products [7]. - The company’s product structure is continuously optimized, with DDIC, CIS, PMIC, MCU, and Logic contributing 60.61%, 20.51%, 12.07%, 2.14%, and 4.09% to the main business revenue respectively [7]. - The company’s R&D investment reached 695 million yuan in H1 2025, a year-on-year increase of 13.13%, indicating a strong focus on enhancing technological capabilities [7]. Financial Summary - Total revenue projections for 2024A, 2025E, 2026E, and 2027E are 9,249 million yuan, 11,557 million yuan, 13,303 million yuan, and 14,437 million yuan respectively, with corresponding growth rates of 27.7%, 24.9%, 15.1%, and 8.5% [3][8]. - Net profit attributable to shareholders is forecasted to be 533 million yuan, 807 million yuan, 1,119 million yuan, and 1,404 million yuan for the same years, with growth rates of 151.8%, 51.5%, 38.6%, and 25.4% respectively [3][8]. - The company’s earnings per share (EPS) are projected to be 0.27 yuan, 0.40 yuan, 0.56 yuan, and 0.70 yuan for 2024A, 2025E, 2026E, and 2027E respectively [3][8].
晶合集成-向 40 纳米 -28 纳米工艺迁移,产能稳定扩张;第二季度营收、净利润符合预期但毛利率不及预期;买入
2025-09-01 03:21
Summary of Nexchip Earnings Call Company Overview - **Company**: Nexchip (688249.SS) - **Industry**: Semiconductor manufacturing Key Financial Metrics - **2Q25 Revenues**: Rmb2.6 billion, representing a **21% YoY** increase and a **2% QoQ** increase [1][2] - **Net Income**: Rmb197 million, up **83% YoY** and **45% QoQ** [1][2] - **Gross Margin (GM)**: 24.3%, down from the previous quarter due to increased depreciation and amortization (D&A) expenses [1][2] Core Insights - **Production Capacity**: Nexchip is ramping up production with new capacities, particularly in 40nm and 28nm technologies, which are expected to contribute significantly to revenue growth [1][2][13] - **Product Mix Improvement**: The revenue contribution from Display Driver ICs (DDIC) has decreased to 61% in 1H25, while contributions from Camera Image Sensors (CIS) and Power Management ICs (PMIC) are increasing [2][10] - **Future Outlook**: Management anticipates adding another 20k wafer per month (wpm) in 2H25, bringing total capacity to 160k wpm, with 28nm mass production expected to start by early 2026 [13] Earnings Revision - **Earnings Forecast**: Earnings for 2025-2027 have been revised down by **4% to 6%** mainly due to lower revenues from DDIC products, but revenue growth is still expected at **19%**, **32%**, and **16%** for 2025, 2026, and 2027 respectively [10][11] - **Gross Margin Adjustments**: GM estimates have been cut by **2.7ppts**, **0.2ppts**, and **0.1ppts** for 2025-2027 due to rising D&A expenses [10] Market Position and Valuation - **Target Price**: Updated to Rmb28.6, based on a target P/E of **43x** for 2026E, reflecting a strong growth outlook compared to peers [14][19] - **Peer Comparison**: Nexchip's average earnings growth is projected at **48% YoY** in 2026-2027, positioning it favorably against competitors like SMIC and UMC [16] Risks and Challenges - **Potential Risks**: Slower-than-expected capacity expansion, weaker demand in DDIC and CIS markets, and intense competition are noted as key risks [19] Additional Insights - **ASP Stability**: Management indicated that while utilization rates are strong, they do not plan to raise prices proactively due to ongoing market competition [13] - **Strategic Partnerships**: Collaborations with clients, such as SmartSens, are expected to secure orders and enhance product offerings [1][13] This summary encapsulates the essential points from the earnings call, highlighting Nexchip's financial performance, strategic direction, and market outlook.
晶合集成(688249):公司业绩稳健增长,新品研发持续推进
Ping An Securities· 2025-08-31 09:09
Investment Rating - The report maintains a "Recommended" investment rating for the company [1][10]. Core Views - The company has demonstrated steady growth in performance, with a revenue of 5.198 billion yuan for the first half of 2025, representing an 18.21% year-on-year increase, and a net profit attributable to shareholders of 332 million yuan, up 77.61% year-on-year [5][9]. - The company is focusing on continuous product research and development, with significant achievements in the first half of 2025, including a 13.13% increase in R&D expenditure to 695 million yuan, accounting for 13.37% of revenue [9][10]. - The company is expected to maintain stable growth in operating performance, with a diversified product layout showing initial results, particularly in the DDIC, CIS, and PMIC sectors [9][10]. Financial Summary - Revenue projections for 2025-2027 are adjusted to 872 million yuan, 1.342 billion yuan, and 1.811 billion yuan respectively, with corresponding P/E ratios of 55.9X, 36.3X, and 26.9X based on the closing price on August 29 [10]. - The company’s revenue and net profit are expected to grow at rates of 26.1% and 63.6% respectively in 2025, with a gross margin of 27.2% [12]. - The company’s total assets are projected to be 52.426 billion yuan in 2025, with a debt ratio of 49.0% [11][12].