Group 1 - The Shanghai Stock Exchange Sci-Tech Innovation Board Chip Design Theme Index (950162) has decreased by 1.27%, with major stocks such as Haiguang Information down by 0.92% and Cambrian Technology down by 0.8% [1] - Over the past year, the index has increased by 77.07% [1] - The E Fund Sci-Tech Chip Design ETF (589030) has attracted over 98 million in the last 5 days and over 210 million in the last 10 days [1] Group 2 - Major global PC manufacturers, including HP, Dell, Acer, and Asus, are considering sourcing memory chips from Chinese manufacturers due to tight supply and rising costs in the tech industry [3] - CITIC Securities believes that AI-driven logic and storage expansion demand will continue to rise, with a significant gap in advanced logic production in domestic fabs [3] - The E Fund Sci-Tech Chip Design ETF tracks the Sci-Tech Innovation Board Chip Design Theme Index, covering various segments of the semiconductor industry, with digital and analog chip design accounting for 94.1% of the index [3]

份额方面，科创芯片设计ETF易方达最新份额达5.17亿份，创成立以来新高。（数据来源：Wind） 资金流入方面，科创芯片设计ETF易方达最新资金净流入4523.93万元。拉长时间看，近5个交易日内有 4日资金净流入，合计"吸金"1.34亿元，日均净流入达2685.83万元。（数据来源：Wind） 截至2026年2月5日 15:00，上证科创板芯片设计主题指数(950162)下跌1.40%。成分股方面涨跌互现，国 芯科技领涨11.30%，纳芯微上涨6.28%，思特威上涨3.98%；芯原股份领跌7.19%，盛科通信下跌 4.49%，普冉股份下跌3.76%。科创芯片设计ETF易方达(589030)下跌1.49%，最新报价0.99元。（以上所 列股票仅为指数成份股，无特定推荐之意） 流动性方面，科创芯片设计ETF易方达盘中换手8.17%，成交4184.11万元。拉长时间看，截至2月4日， 科创芯片设计ETF易方达近1年日均成交9205.08万元。 规模方面，科创芯片设计ETF易方达最新规模达5.21亿元，创成立以来新高。（数据来源：Wind） 从估值层面来看，科创芯片设计ETF易方达跟踪的上证科创板芯片设计主题指数最 ...

Core Viewpoint - The semiconductor sector experienced a decline following a significant drop in AMD's stock price, which fell over 16%, marking its largest decline since 2018 due to disappointing earnings and concerns about AI's impact on software and data companies [1] Group 1: Market Reaction - Hong Kong stocks in the semiconductor sector fell, with notable declines including Hua Hong Semiconductor down over 6%, Shanghai Fudan down 4%, and Zhaoyi Innovation down 3.88% [1] - Other companies such as SMIC and Jingmen Semiconductor also saw declines exceeding 3%, indicating a broader market reaction to AMD's performance [1] Group 2: Investor Concerns - Investors are increasingly worried that advancements in artificial intelligence may undermine the profitability of companies focused on coding, databases, and IT services [1] - Recent developments, such as the launch of new tools by Anthropic, have intensified these concerns among investors [1]

截至2026年2月5日 09:31，上证科创板人工智能指数(950180)下跌1.72%。成分股方面，澜起科技领跌 4.19%，云天励飞下跌3.24%，芯原股份下跌3.07%，福昕软件下跌2.77%，星环科技下跌2.03%。科创 AIETF博时(588790)下跌1.83%，最新报价0.86元。拉长时间看，截至2026年2月4日，科创AIETF博时近 1月累计上涨11.46%。（以上所列股票仅为指数成份股，无特定推荐之意） 份额方面，科创AIETF博时近1周份额增长7.86亿份，实现显著增长。（数据来源：Wind） 从资金净流入方面来看，科创AIETF博时近4天获得连续资金净流入，最高单日获得4.42亿元净流入， 合计"吸金"7.03亿元，日均净流入达1.76亿元。（数据来源：Wind）科创AIETF博时紧密跟踪上证科创 板人工智能指数，上证科创板人工智能指数从科创板市场中选取30只市值较大的为人工智能提供基础资 源、技术以及应用支持的上市公司证券作为指数样本，以反映科创板市场代表性人工智能产业上市公司 证券的整体表现。 数据显示，截至2026年1月30日，上证科创板人工智能指数(950180)前十大权重股分 ...

港股芯片股持续走低，华虹半导体跌超5%，中芯国际跌近4%，上海复旦跌逾2%。 ...

Market Overview - The Hang Seng Index closed up 0.05% at 26,847.32 points, while the Hang Seng Tech Index fell by 1.84% to 5,366.44 points [1]. Sector Performance - Coal stocks led the gains, with Yanzhou Coal Mining rising over 10% and China Shenhua Energy increasing by over 5% [1]. - Chip stocks showed weak performance, with Shanghai Fudan down over 5% and Huahong Semiconductor declining nearly 5% [1]. - The technology sector overall performed poorly, with Tencent Holdings down nearly 4% and Bilibili falling over 3% [1]. - Domestic property stocks collectively rose, with Shimao Group increasing over 14% and Sunac China rising over 8% [1]. Individual Stock Movements - Among the Hang Seng Index constituents, Xinyi Glass, China Shenhua, and China Resources Land had the highest gains [1]. - Conversely, Ctrip Group, Tencent Holdings, and NetEase saw the largest declines [1]. - In the Hang Seng Tech Index, Li Auto, Leapmotor, and Haier Smart Home showed the most significant increases [1]. - On the downside, Kingdee International, Ctrip Group, and Tongcheng Travel experienced the largest drops [1].

Group 1 - The Hong Kong stock market experienced fluctuations, with the Hang Seng Index closing at 26,847.322, a slight increase of 0.047% [1] - Real estate stocks saw significant gains, with Shimao Group rising over 14%, Sunac China up over 8%, Vanke Enterprises increasing over 6%, and Yuexiu Property up over 6% [1] - Coal stocks also performed well, with Yanzhou Coal Mining rising over 10% and China Shenhua Energy increasing over 5% [1] Group 2 - The Hang Seng Tech Index dropped by 1.844%, with major tech companies showing poor performance [3] - Tencent Holdings fell nearly 4%, Baidu Group declined nearly 3%, Xiaomi Group dropped over 1.8%, JD Group decreased over 1.6%, and Alibaba fell nearly 1% [3][4] - Semiconductor stocks were sluggish, with Fudan Shanghai falling over 5%, Hua Hong Semiconductor down nearly 5%, GigaDevice down over 3%, and SMIC down over 2% [5]

资金流入方面，科创芯片设计ETF易方达最新资金流入流出持平。拉长时间看，近5个交易日内有4日资 金净流入，合计"吸金"1.72亿元，日均净流入达3435.17万元。（数据来源：Wind） 科创芯片设计ETF易方达紧密跟踪上证科创板芯片设计主题指数，上证科创板芯片设计主题指数选取科 创板内业务涉及芯片设计领域的上市公司证券作为指数样本，以反映科创板芯片设计领域上市公司证券 的整体表现。 截至2026年2月4日 11:30，上证科创板芯片设计主题指数(950162)下跌3.84%。成分股方面涨跌互现，杰 华特领涨3.35%，国芯科技上涨1.74%，灿芯股份上涨0.89%；臻镭科技（维权）领跌9.27%，澜起科技 下跌7.93%，聚辰股份下跌7.66%。科创芯片设计ETF易方达(589030)下跌3.65%，最新报价1元。拉长时 间看，截至2026年2月3日，科创芯片设计ETF易方达近2周累计上涨3.17%，涨幅排名可比基金2/5。 （以上所列股票仅为指数成份股，无特定推荐之意） 数据显示，截至2026年1月30日，上证科创板芯片设计主题指数(950162)前十大权重股分别为澜起科 技、海光信息、芯原股份、寒武纪、 ...

Group 1 - Northern Huachuang is a leading domestic semiconductor equipment manufacturer, covering core process equipment such as etching machines, thin film deposition equipment, and cleaning machines, which are essential for memory chip manufacturing [1] - The company is expected to benefit from the growth in equipment orders driven by the expansion and technological upgrades of domestic memory manufacturers during the memory chip price increase cycle [1] - Northern Huachuang has made breakthroughs in advanced process equipment for 3D NAND and HBM, establishing a core competitive advantage in the global memory equipment market [1] Group 2 - Hua Hong Semiconductor is a leading domestic specialty process manufacturer with mature memory chip foundry capabilities, focusing on NOR Flash, eMMC, and SPI NAND [2] - The company is expected to benefit from the rising demand for memory chip foundry services as domestic memory manufacturers expand production [2] - Hua Hong's layout in automotive-grade memory chip foundry will further enhance its resilience against economic cycles [2] Group 3 - Zhongwei Company is a core supplier of etching equipment, with its 5nm etching machine already integrated into the supply chain of memory manufacturers [3] - The demand for high-end equipment is expected to grow due to the trend of upgrading memory chips to advanced processes like 3D NAND and HBM [3] - Zhongwei's layout in thin film deposition equipment enhances its service capabilities for memory manufacturers [3] Group 4 - Lanke Technology is a global leader in memory interface chips, with its products widely used in servers and PCs, holding a leading share in the DDR5 interface chip market [4] - The demand for DDR5 interface chips is expected to surge due to the explosion in AI server and high-end PC demand during the memory chip price increase cycle [4] - Lanke's breakthroughs in HBM interface chips will further open up growth opportunities [4] Group 5 - GigaDevice is a leading domestic memory chip design company, focusing on NOR Flash while also expanding into NAND Flash and DRAM [5] - The company is expected to benefit from the price increase of NOR Flash products driven by the recovery of consumer electronics and AI terminal demand [5] - GigaDevice's layout in automotive-grade memory chips will further expand its downstream application space [5] Group 6 - Shengyi Technology is a leading domestic copper-clad laminate manufacturer, with its products being core raw materials for memory chip packaging [6][7] - The growth in demand for copper-clad laminates is expected to be driven by the expansion of memory manufacturers and the increase in packaging needs during the memory chip price increase cycle [6][7] - Shengyi's breakthroughs in high-frequency and high-speed copper-clad laminates will adapt to the upgrade demands of memory chips [6][7] Group 7 - Shenzhen South Circuit is a leading domestic PCB manufacturer, with its high-end PCB products being core carriers for storage servers and modules [8] - The demand for high-end PCBs is expected to grow due to the explosion in AI server demand and the expansion of memory manufacturers during the memory chip price increase cycle [8] - Shenzhen South Circuit's layout in storage packaging substrates further enhances its position in the memory industry chain [8] Group 8 - Jiangbolong is a leading domestic storage module manufacturer, focusing on the development and manufacturing of storage modules for various applications [9] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [9] - Jiangbolong's layout in automotive-grade storage modules will further open up downstream application spaces [9] Group 9 - Xi'an Yicai is a core enterprise in semiconductor materials, focusing on silicon-based materials essential for memory chip manufacturing [10] - The demand for silicon-based materials is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [10] - Xi'an Yicai's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [10] Group 10 - Tuojing Technology is a leading domestic thin film deposition equipment manufacturer, with its PECVD and ALD equipment being core process equipment for memory chip manufacturing [11] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of 3D NAND technology during the memory chip price increase cycle [11] - Tuojing's layout in HBM-related equipment will further adapt to the upgrade demands driven by AI [11] Group 11 - Maiwei Co. is a core domestic semiconductor equipment enterprise, with its equipment already integrated into the supply chain of leading domestic memory manufacturers [12] - The growth in equipment orders is expected to be driven by the expansion of memory manufacturers and the increase in advanced packaging demand during the memory chip price increase cycle [12] - Maiwei's breakthroughs in HBM packaging equipment will adapt to the upgrade demands driven by AI [12] Group 12 - Shengmei Shanghai is a leading domestic semiconductor cleaning equipment manufacturer, with its single-wafer cleaning equipment integrated into the supply chain of leading memory manufacturers [13] - The demand for cleaning equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [13] - Shengmei's breakthroughs in 3D NAND cleaning technology will adapt to the technical iteration needs of memory chips [13] Group 13 - Changdian Technology is a leading domestic packaging and testing enterprise, covering the packaging and testing of various memory chip types [14] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [14] - Changdian's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [14] Group 14 - Changchuan Technology is a leading domestic semiconductor testing equipment manufacturer, with its testing equipment covering memory and logic chips [15] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [15] - Changchuan's breakthroughs in DDR5 and HBM testing technologies will adapt to the upgrade demands driven by AI [15] Group 15 - Baiwei Storage is a leading domestic storage chip design and module manufacturer, focusing on various storage modules for different applications [16] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [16] - Baiwei's layout in automotive-grade storage will further open up downstream application spaces [16] Group 16 - China Resources Microelectronics is a leading domestic power semiconductor and storage chip manufacturer, focusing on NOR Flash and eMMC [17] - The company is expected to benefit from the recovery in consumer electronics and industrial control demand during the memory chip price increase cycle [17] - China Resources' layout in automotive-grade storage chips will enhance its resilience against economic cycles [17] Group 17 - Tongfu Microelectronics is a core domestic packaging enterprise, covering the packaging of various memory chip types [18] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [18] - Tongfu's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [18] Group 18 - Yitang Co. is a core domestic semiconductor equipment enterprise, focusing on thin film deposition and rapid thermal processing equipment [19] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [19] - Yitang's breakthroughs in 3D NAND-related equipment will adapt to the technical iteration needs of memory chips [19] Group 19 - Jingsheng Mechanical and Electrical is a leading domestic semiconductor silicon wafer equipment manufacturer, with its equipment integrated into the supply chain of leading memory manufacturers [20] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the increase in silicon wafer demand during the memory chip price increase cycle [20] - Jingsheng's breakthroughs in 300mm large silicon wafer equipment will adapt to the advanced process needs of domestic storage [20] Group 20 - Xichuang Data is a leading domestic storage module and smart terminal manufacturer, focusing on various storage modules for different applications [21] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [21] - Xichuang's layout in automotive-grade storage will further open up downstream application spaces [21] Group 21 - Shannon Chip is a leading domestic storage chip distribution and solution provider, focusing on distribution and technical services for storage chips [22] - The growth in distribution revenue is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [22] - Shannon's layout in storage module solutions will enhance customer stickiness [22] Group 22 - Hushi Silicon Industry is a leading domestic semiconductor silicon wafer manufacturer, covering various specifications essential for memory chip manufacturing [23] - The demand for silicon wafers is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [23] - Hushi's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [23] Group 23 - Unisoc is a leading domestic security chip and storage chip manufacturer, focusing on eMMC and UFS [24] - The company is expected to benefit from the recovery in consumer electronics and the growth in security storage demand during the memory chip price increase cycle [24] - Unisoc's layout in automotive-grade storage chips will enhance its resilience against economic cycles [24] Group 24 - Fudan Microelectronics is a leading domestic FPGA and storage chip manufacturer, covering various storage chip types [25] - The growth in demand for storage products is expected to be driven by the increase in industrial control demand and the acceleration of domestic substitution during the memory chip price increase cycle [25] - Fudan's layout in automotive-grade storage chips will further open up downstream application spaces [25] Group 25 - Zhongke Feicai is a leading domestic semiconductor testing equipment manufacturer, covering testing equipment for memory and logic chips [26] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [26] - Zhongke's breakthroughs in 3D NAND testing technology will adapt to the technical iteration needs of memory chips [26] Group 26 - Huahai Qingke is a leading domestic chemical mechanical polishing (CMP) equipment manufacturer, with its CMP equipment integrated into the supply chain of leading memory manufacturers [27] - The demand for CMP equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [27] - Huahai's breakthroughs in 3D NAND polishing technology will adapt to the technical iteration needs of memory chips [27]

从资金净流入方面来看，科创芯片设计ETF易方达近4天获得连续资金净流入，最高单日获得8270.62万 元净流入，合计"吸金"1.72亿元，日均净流入达4293.96万元。（数据来源：Wind） 科创芯片设计ETF易方达紧密跟踪上证科创板芯片设计主题指数，上证科创板芯片设计主题指数选取科 创板内业务涉及芯片设计领域的上市公司证券作为指数样本，以反映科创板芯片设计领域上市公司证券 的整体表现。 截至2026年2月3日 14:46，上证科创板芯片设计主题指数(950162)强势上涨2.00%，成分股芯原股份上涨 9.70%，新相微上涨9.53%，普冉股份上涨7.53%，国芯科技，中微半导等个股跟涨。科创芯片设计ETF 易方达(589030)上涨1.27%，最新价报1.04元。拉长时间看，截至2026年2月2日，科创芯片设计ETF易方 达近2周累计上涨1.69%，涨幅排名可比基金2/4。（以上所列股票仅为指数成份股，无特定推荐之意） 流动性方面，科创芯片设计ETF易方达盘中换手12.99%，成交6315.35万元，市场交投活跃。拉长时间 看，截至2月2日，科创芯片设计ETF易方达近1年日均成交9519.00万元。 规 ...