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曦华科技,递交IPO招股书,拟赴香港上市,农银国际独家保荐 | 18C特专科技公司
Xin Lang Cai Jing· 2025-12-04 06:18
来源:瑞恩资本RyanbenCapital 2025年12月2日,来自广东深圳南山区的深圳曦华科技股份有限公司Shenzhen CVA Innovation Co., Ltd. (简称曦华科技)在港交所递交招股书,拟在香港主板挂牌上市。 曦华科技招股书链接: https://www1.hkexnews.hk/app/sehk/2025/107931/documents/sehk25120302622_c.pdf 主要业务 曦华科技,成立于2018年,作为一家端侧AI芯片与解决方案提供商,以无晶圆厂业务模式营运,公司 的产品基于MCU及ASIC架构,集成端侧AI算法以实现本地数据处理及智能决策,产品及解决方案主要 应用于消费电子、汽车行业以及具身智能等新兴市场,已获多家主流汽车OEM及全球知名消费电子品 牌采用。 根据弗若斯特沙利文报告,曦华科技研发了全球首款ASIC架构的scaler,即AI Scaler,目前已成为全球 龙头产品。于2024年按出货量计,曦华科技在全球scaler行业中排名第二及在ASIC scaler 行业中排名第 一。公司最新一代的车规级TMCU保持了在智能感控规格性能领域的全球领先地位 ...
黑芝麻智能高开逾3% 拟斥资4亿至5.5亿元收购端侧AI芯片公司
Zhi Tong Cai Jing· 2025-12-04 01:32
Core Viewpoint - Black Sesame Intelligence (000716) announced plans to acquire Guangdong Zhuhai-based AI chip company Yizhi Electronics for an estimated total consideration of RMB 400 million to 550 million, with the transaction expected to be completed in Q1 2026 [1] Group 1: Acquisition Details - The acquisition will be executed through equity purchase and capital injection [1] - Following the completion of the acquisition, Yizhi Electronics' financial performance will be consolidated into Black Sesame's financial statements [1] - The expected completion date for the transaction is the first quarter of 2026 [1] Group 2: Yizhi Electronics Overview - Yizhi Electronics specializes in the independent research and development of edge/endpoint AI SoC chips [1] - The company has established a complete technological closed loop from underlying IP to upper-layer algorithms [1] - Yizhi Electronics has developed three major product series: SA, SH, and SV, which are applicable in various fields including smart security, intelligent automotive (such as ADAS/DMS), and consumer electronics [1]
港股异动 | 黑芝麻智能(02533)高开逾3% 拟斥资4亿至5.5亿元收购端侧AI芯片公司
智通财经网· 2025-12-04 01:27
公开资料显示,亿智电子是一家专注于边缘侧/端侧AI SoC芯片自主研发的系统方案供应商,其核心竞 争力在于构建了从底层IP到上层算法的完整技术闭环。该公司已形成SA、SH、SV三大产品系列,其应 用精准覆盖智能安防、智能车载(如ADAS/DMS)及消费电子等广泛领域。 智通财经APP获悉,黑芝麻智能(02533)高开逾3%,截至发稿,涨3.4%,报20.1港元,成交额215.87万港 元。 消息面上,黑芝麻智能宣布,拟通过股权收购及注资方式收购广东珠海端侧AI芯片公司亿智电子,预 期总代价约人民币4亿元至5.5亿元。收购完成后,亿智电子财务业绩将并入公司报表。预期交易将于 2026年第一季度完成。 ...
曦华科技递表港交所 农银国际为独家保荐人
Zheng Quan Shi Bao Wang· 2025-12-04 00:48
Core Viewpoint - Xihua Technology has submitted a listing application to the Hong Kong Stock Exchange, with Agricultural Bank of China International as the sole sponsor [1] Company Overview - Xihua Technology is a provider of edge AI chips and solutions, with main products including smart display chips (such as AIScaler and STDI) and smart sensing control chips and solutions (such as TMCU, general-purpose MCU, touch chips, and smart cockpit solutions) [1] - The company's products have been adopted by several major automotive OEMs and globally recognized consumer electronics brands, addressing market demands in consumer electronics, automotive, and embodied intelligence [1] Market Position - According to a Frost & Sullivan report, Xihua Technology has developed the world's first ASIC architecture AIScaler, mastering key technologies such as visual lossless compression, image quality enhancement, and high-speed interface transmission [1] - The AIScaler has become a leading product globally, with an estimated shipment of approximately 37 million units in 2024 [1] - In 2024, Xihua Technology ranks second globally in the scaler industry and first in the ASIC scaler industry [1] - The latest generation automotive-grade TMCU maintains a leading position globally in the smart sensing control performance sector [1]
曦华科技递表港交所
Zhi Tong Cai Jing· 2025-12-04 00:40
据港交所12月3日披露,深圳曦华科技股份有限公司(简称:曦华科技)递表港交所主板,农银国际为其独家保荐人。 招股书显示,曦华科技是一家端侧AI芯片与解决方案提供商。公司的智能显示芯片及解决方案主要有AIScaler及STDI芯片;而智能感控芯片及解决方案主要 有TMCU、通用MCU、触控芯片及智能座舱解决方案。公司的产品已获多家主流汽车OEM及全球知名消费电子品牌采用,已量产的芯片产品组合可以满足 客户在消费电子、汽车行业及具身智能等新兴市场的不同需求。 根据弗若斯特沙利文报告,曦华科技研发了全球首款ASIC架构的scaler,即AIScaler,在视觉无损压缩、画质增强及高速接口传输方面掌握关键技术。从智 能手机屏应用市场战略性切入,公司AIScaler的市场份额快速增长,目前已成为全球龙头产品。于2024年,曦华科技的AIScaler出货量约为3,700万颗。 根据弗若斯特沙利文报告,于2024年,按出货量计,曦华科技在全球scaler行业中排名第二及在ASICscaler行业中排名第一。根据同一资料来源,曦华科技最 新一代的车规级TMCU保持了在智能感控规格性能领域的全球领先地位。 ...
新股消息 | 曦华科技递表港交所
智通财经网· 2025-12-03 23:35
智通财经APP获悉,据港交所12月3日披露,深圳曦华科技股份有限公司(简称:曦华科技)递表港交所主板,农银国际为其独家保荐人。 招股书显示,曦华科技是一家端侧AI芯片与解决方案提供商。公司的智能显示芯片及解决方案主要有AIScaler及STDI芯片;而智能感控芯片及解决方案主要 有TMCU、通用MCU、触控芯片及智能座舱解决方案。公司的产品已获多家主流汽车OEM及全球知名消费电子品牌采用,已量产的芯片产品组合可以满足 客户在消费电子、汽车行业及具身智能等新兴市场的不同需求。 根据弗若斯特沙利文报告,曦华科技研发了全球首款ASIC架构的scaler,即AIScaler,在视觉无损压缩、画质增强及高速接口传输方面掌握关键技术。从智 能手机屏应用市场战略性切入,公司AIScaler的市场份额快速增长,目前已成为全球龙头产品。于2024年,曦华科技的AIScaler出货量约为3,700万颗。 根据弗若斯特沙利文报告,于2024年,按出货量计,曦华科技在全球scaler行业中排名第二及在ASICscaler行业中排名第一。根据同一资料来源,曦华科技最 新一代的车规级TMCU保持了在智能感控规格性能领域的全球领先地位。 ...
深圳曦华科技股份有限公司(H0193) - 申请版本(第一次呈交)
2025-12-02 16:00
香港聯合交易所有限公司及證券及期貨事務監察委員會對本申請版本的內容概不負責,對其準 確性或完整性亦不發表任何聲明,並明確表示概不就因本申請版本全部或任何部分內容而產生 或依賴該等內容而引致的任何損失承擔任何責任。 SHENZHEN CVA INNOVATION CO., LTD.* 深圳曦華科技股份有限公司 (於中華人民共和國註冊成立的股份有限公司) 的申請版本 警 告 本申請版本乃根據香港聯合交易所有限公司(「聯交所」)及證券及期貨事務監察委員會(「證監會」) 的要求而刊發,僅用作提供資料予香港公眾人士。 本 申 請 版 本 為 草 擬 本,其 內 所 載 資 料 並 不 完 整,亦 可 能 會 作 出 重 大 變 動。 閣 下 閱 覽 本 文 件, 即代表 閣 下 知 悉、接 納 並 向 深 圳 曦 華 科 技 股 份 有 限 公 司(「本公司」,連 同 其 附 屬 公 司 統 稱「本 集 團」)、其獨家保薦人、整體協調人、顧問及包銷團成員表示同意: 於本公司招股章程根據香港法例第32章公司(清盤及雜項條文)條例送呈香港公司註冊處處長登 記前,不會向香港公眾人士提出要約或邀請。倘於適當時候向香港公眾人士提 ...
机器人板块震荡调整,机器人ETF易方达(159530)逆势获7500万份净申购
Sou Hu Cai Jing· 2025-12-02 11:22
Group 1 - The core indices related to robotics, smart electric vehicles, consumer electronics, and IoT have experienced declines, with the National Robotics Industry Index down by 2.0% and the China Securities Smart Electric Vehicle Index down by 1.0% [1] - Despite the overall market decline, there has been a significant inflow into ETFs, with the E Fund Robotics ETF (159530) seeing a net subscription of 75 million units throughout the day [1] - Huatai Securities expresses optimism regarding the growth momentum of edge AI chips, citing that competition in smart vehicles may lead to advanced intelligent driving becoming a standard feature, thereby increasing demand for mid-to-high computing power chips [1] Group 2 - The future penetration of robots into various sectors such as home, healthcare, industry, commerce, and education is expected to drive long-term demand for AI chips in robotics [1] - The index performance shows a slight decrease of 0.3% with a rolling price-to-earnings ratio of 32.2 times and a valuation increase of 44.4% since its release [5]
台积电拟增建三座2nm晶圆厂,半导体产业ETF(159582)盘中一度涨超1.5%
Xin Lang Cai Jing· 2025-11-25 06:53
Group 1 - The semiconductor industry index rose by 0.23% as of November 25, 2025, with notable increases in individual stocks such as ShenGong Co. (up 13.18%) and ChangChuan Technology (up 3.55%) [1] - The semiconductor industry ETF (159582) increased by 0.15%, with a latest price of 2.01 yuan, and has seen a cumulative rise of 11.85% over the past three months [1] - TSMC plans to build three additional 2nm fabs in Taiwan to meet the surging demand for AI chips, with an estimated total investment of 900 billion NTD [1] Group 2 - Tianfeng Securities highlights that edge AI chips are evolving towards "high energy efficiency architecture + scenario-based customization + global ecosystem," with advancements in in-memory computing and software toolchains [2] - The semiconductor industry ETF closely tracks the CSI Semiconductor Industry Index, which includes up to 40 companies involved in semiconductor materials, equipment, and applications [2] - As of October 31, 2025, the top ten weighted stocks in the CSI Semiconductor Industry Index accounted for 78.04% of the index, including companies like Zhongwei Company and North Huachuang [2]
蜂助手(301382):Q3利润同比高增 定增注入成长动力
Xin Lang Cai Jing· 2025-10-31 00:41
Core Insights - The company reported a significant increase in revenue and profit for the first three quarters of 2025, with total revenue reaching 1.551 billion yuan, a year-on-year growth of 41.64%, and a net profit attributable to shareholders of 134 million yuan, up 46.65% [1] - The third quarter alone saw a remarkable revenue of 568 million yuan, representing a 57.57% increase year-on-year, and a net profit of 56.6887 million yuan, which is a staggering 195.42% growth compared to the same period last year [1] - The company is actively investing in new projects, including a capital increase plan to raise 984 million yuan for cloud terminal computing centers, IoT terminal upgrades, and the development of SoC chips, which are expected to enhance its core competitiveness and market share [2] Financial Performance - For the first three quarters of 2025, the company achieved a gross profit margin recovery, with a gross margin of 21.30% in Q3, an increase of 2.93 percentage points year-on-year [1] - The company effectively controlled its expense ratios, with sales, management, and R&D expense ratios at 2.08%, 1.80%, and 3.74%, respectively, showing a decrease of 0.66, 0.56, and an increase of 0.31 percentage points year-on-year [1] - The operating cash flow significantly improved due to better management of accounts receivable and a reduction in credit impairment losses [1] Strategic Initiatives - The company plans to invest in a cloud terminal computing center, which has already initiated the construction of approximately 700 cabinets, significantly reducing computing costs compared to leasing [2] - The IoT upgrade project aims to create an "edge intelligence + cloud computing" architecture, applicable to smart speakers and other terminals, facilitating a strategic shift towards an intelligent service ecosystem [2] - The development of SoC chips through in-house R&D is intended to empower AI terminal manufacturers by providing comprehensive solutions in computing power, algorithms, and services [2] Investment Outlook - The company forecasts revenue growth for 2025 to 2027, estimating revenues of 2.011 billion yuan, 2.564 billion yuan, and 3.188 billion yuan, respectively, with net profits projected at 202 million yuan, 274 million yuan, and 344 million yuan [3] - The investment rating is maintained at "Buy" based on the anticipated growth trajectory and strategic initiatives [3]