Core Viewpoint - The article highlights the significance of the 2025 Jiufengshan Forum as a premier event in the global compound semiconductor industry, focusing on innovation and technological advancements across various sectors [2][4]. Group 1: Forum Overview - The 2025 Jiufengshan Forum will take place from April 23-25 at the Wuhan Optics Valley Convention and Exhibition Center, featuring keynote speeches and 11 parallel forums covering topics from key materials to AI-enabled EDA toolchains [2][4]. - Over 100 high-quality reports have been confirmed for the forum, with early bird ticket sales ending on March 20 [4]. Group 2: Key Themes of Parallel Forums - The forum will address cutting-edge technologies such as neuromorphic computing, two-dimensional material devices, silicon photonic quantum integration, and wide bandgap semiconductors, focusing on disruptive technologies and industry development directions [5]. - A comprehensive ecosystem will be constructed, covering the entire chain from material preparation to system integration, promoting collaborative innovation within the semiconductor industry [6]. - The integration of heterogeneous technologies will unlock multiplier effects in technological innovation, combining materials, packaging, and circuit design [7]. - The forum will showcase breakthroughs in domestic technologies, including transmission electron microscopes and compound semiconductor equipment, revealing paths to overcome technical barriers [8]. - Insights into emerging demands in sectors like 5G communication, smart driving, and quantum computing will be shared, along with semiconductor technology solutions for scenarios such as electric vehicles and data centers [9]. - The event will gather leading global companies, research institutions, and investment firms to discuss key topics such as third-generation semiconductor capacity layout and testing technology standards [10].

Core Viewpoint - The rapid development of artificial intelligence (AI) is pushing the limits of traditional computing technologies, necessitating sustainable and energy-efficient solutions for exponential scaling of parallel computing systems [1][2][30]. Group 1: Technological Advancements - The article emphasizes the importance of optimizing the entire system from software and system architecture to silicon and packaging to maximize performance, power consumption, and cost [2]. - Key technologies such as RibbonFET and PowerVia are highlighted for their potential to enhance performance and efficiency in semiconductor design [4][5]. - High NA EUV technology is noted for its ability to simplify electronic design automation (EDA) and improve yield and reliability [7][8]. Group 2: 3D Integration and Packaging - 3D Integrated Circuits (3DIC) are crucial for achieving higher computational power in smaller areas while reducing energy consumption [11]. - The need for advanced packaging techniques to enhance interconnect density and energy efficiency is discussed, with a focus on modular design environments [12][15]. - The integration of glass in packaging to scale interconnect geometries and improve power transmission efficiency is identified as a significant technological advancement [14]. Group 3: Power Delivery and Efficiency - The article discusses the increasing power demands for AI workloads and the limitations of traditional motherboard voltage regulators (MBVR) [21][22]. - Fully Integrated Voltage Regulators (FIVR) are proposed as a solution to improve power conversion efficiency by bringing voltage regulation closer to the chip [23][24]. - The potential of pairing high-voltage switch-capacitor voltage regulators with low-voltage integrated voltage regulators for enhanced power density and efficiency is explored [24]. Group 4: Software and Ecosystem Collaboration - Software is deemed a critical component of the innovation matrix, requiring collaboration within the open-source ecosystem to enhance security and streamline processes [25]. - The need for industry-wide collaboration to develop next-generation advanced computing systems is emphasized, ensuring alignment with market demands and sustainability [28]. Group 5: Industry Challenges and Opportunities - The article outlines the challenges faced in achieving exponential performance improvements for AI, including power, connectivity, and cost issues [30]. - It calls for innovative approaches across various domains, including process technology, 3DIC system design, and power delivery, to meet the industry's computational demands [30].

Core Viewpoint - The ongoing US-China chip trade war has led to a significant increase in China's research output in next-generation chip manufacturing, surpassing that of the US by more than double, indicating a potential shift in technological capabilities in the near future [2][4][5]. Research Output Comparison - From 2018 to 2023, China produced 34% of the global research papers on chip design and manufacturing, while the US and Europe contributed only 15% and 18%, respectively [10]. - In terms of high-citation papers, 50% of the top 10% most cited articles in this field were authored by Chinese researchers, compared to 22% from the US and 17% from Europe [5][10]. Emerging Technologies - China's research focus includes neuromorphic computing and optoelectronic computing, which are considered post-Moore's Law technologies and are less affected by current export restrictions [2][6]. - The research indicates that if these emerging technologies are commercialized, they could significantly enhance China's position in the global chip market, making it difficult for the US to maintain its competitive edge through export controls [7][8]. Impact of US Export Controls - Since October 2022, the US has imposed restrictions on the sale of advanced chips and manufacturing equipment to China, aiming to limit China's ability to produce cutting-edge chips [6][3]. - Despite these restrictions, China's research output continues to grow, with significant contributions from leading institutions such as the Chinese Academy of Sciences and Tsinghua University [11][13]. Research Trends and Hotspots - The overall growth in chip research from 2018 to 2023 was 8%, which is slower compared to more popular fields like artificial intelligence [9]. - The research hotspots identified include neuromorphic computing and photonics, reflecting a shift towards innovative semiconductor technologies that address the limitations of traditional chip manufacturing [15][16].

Core Viewpoint - China is leading in foundational research for next-generation computing, raising concerns that U.S. export controls may become ineffective if these research results are commercialized [1][4]. Group 1: Research Output - From 2018 to 2023, China published 160,852 semiconductor-related papers, more than double the U.S. output of 71,688 papers [1]. - China's semiconductor research papers grew by 41% during this period, significantly outpacing India (26%), the U.S. (17%), and South Korea (6%) [1]. - In terms of impactful research, China authored 23,520 papers in the top 10% of citations, nearly half of the total, compared to the U.S. with 10,300 papers [2]. Group 2: Institutional Strength - Among the top 10 institutions publishing semiconductor research from 2018 to 2023, 9 are Chinese [2]. - The report from the Korea Institute of Science and Technology Evaluation and Planning indicates that South Korea's semiconductor technology capabilities are rated lower than China's across various fields [3]. Group 3: Future Implications - U.S. export controls on advanced semiconductors and manufacturing equipment may struggle to contain China's growth as it shifts focus to new semiconductor architectures [4]. - New fields such as neuromorphic computing and optical computing are identified as key growth areas for China's semiconductor research [4]. - Analysts predict that if China successfully commercializes next-generation semiconductor technologies, it could not only catch up to but potentially surpass the U.S. [5].