图源：Pixabay 马斯克提到，AI4 (HW 4.0) 已被特斯拉的数据中心用于 AI 训练工作负载，AI5 与 AI6 两代芯片间的间 隔将不到 1 年。 【来源：IT之家】 1 月 29 日消息，埃隆 · 马斯克在特斯拉 2025Q4 财报电话会议上表示，芯片产能很可能会成为限制特斯 拉未来中期（3~4 年）增长的瓶颈，其从台积电、三星电子、美光等芯片供应商处获得的数据显示外部 产能不足以满足需求。 这意味着特斯拉很有必要建设一座自有的 TerraFab 超大型晶圆厂。这座设想中的晶圆厂将整合逻辑制 程、存储半导体、先进封装等多个相对独立的环节，实现先进芯片制造全流程集成，有利于特斯拉抵御 各类外界风险。 ...

Core Viewpoint - Intel's investment in Ohio for two advanced chip factories is part of its strategy to build a world-class foundry service, but the project has faced delays and skepticism regarding its viability and customer acquisition [1][2]. Group 1: Intel's Chip Manufacturing Plans - Intel announced a $28 billion investment to build two advanced chip factories in Ohio, with initial production planned for 2025, but has faced multiple delays due to challenges in securing external customers [1]. - The first Ohio factory is now expected to start production in 2030, and the success of Intel's 14A process node is contingent on acquiring a significant number of external clients [1][2]. - Intel's 18A process node is currently in production in Arizona, but initial yields have been problematic, although recent reports indicate yields have improved to over 60% [1][2]. Group 2: Progress and Future Prospects - Recent hiring announcements related to the Ohio factory construction suggest that progress may be accelerating, which could indicate a renewed commitment to the 14A process [2]. - Intel's CEO expressed confidence in the 14A process, stating that significant advancements in yield and intellectual property are expected, which may help attract external customers [2]. - The potential for Intel's 14A chips to be used by clients like Apple in 2029 could enhance the likelihood of success for this process node [3]. Group 3: Competitive Landscape - The ongoing shortage of advanced manufacturing capacity at TSMC may provide Intel with an opportunity to attract customers seeking alternative suppliers [3]. - Analysts suggest that while Intel's 18A process may not directly challenge TSMC's leadership, it could position Intel to surpass Samsung and become the second-largest foundry [6][7]. - Companies like Qualcomm and AMD are reportedly considering Samsung as a primary alternative for foundry services, indicating a shift in the competitive landscape [5][6].

Core Viewpoint - United Microelectronics Corporation (UMC) is exploring the feasibility of entering advanced chip production, specifically targeting 6nm technology, to enhance its growth potential in a market dominated by TSMC, Samsung, and Intel [1][2]. Group 1: Company Strategy and Developments - UMC is assessing future growth drivers, including the potential production of 6nm chips suitable for advanced connectivity applications and AI accelerators [1]. - The company is considering expanding its collaboration with Intel in 12nm chip production, potentially incorporating 6nm technology into this partnership [1][2]. - UMC's CFO indicated that substantial progress in advanced manufacturing technology will depend on partnerships to alleviate financial burdens [2]. Group 2: Market Position and Competition - UMC is currently the fourth largest chip foundry globally, with a market share of 4.7%, following TSMC, Samsung, and SMIC [3][4]. - As of Q1 2025, UMC's revenue decreased by 5.8%, reflecting competitive pressures from local Chinese manufacturers and the rise of SMIC, which has overtaken UMC to become the third largest foundry [2][3]. - The global foundry market is highly concentrated, with the top five companies accounting for 90.2% of the market share [3]. Group 3: Financial Considerations and Challenges - Entering the 6nm production space may require significant capital investment, estimated at around $5 billion, which poses a challenge for UMC [7]. - UMC's capital expenditure for the current year is projected to be $1.8 billion, significantly lower than SMIC's ongoing expenditure of over $7 billion [7]. - The company is exploring a "light asset" model to share the financial burden of new technology investments with partners [7]. Group 4: Industry Trends and Future Outlook - By 2030, mainland China is expected to lead global semiconductor foundry capacity, potentially holding 30% of the market, which adds competitive pressure on UMC [5]. - The demand for mature semiconductor products is rebounding slower than expected, prompting UMC to seek new growth opportunities [7]. - The transition to advanced chip production is complicated by the need for cutting-edge equipment, such as EUV lithography machines, which are costly and may impact production quality if older technologies are used [8].