Investment Rating - The report indicates a positive investment outlook for the optoelectronic device industry, driven by technological advancements and increasing demand across various sectors [1]. Core Insights - The optoelectronic device industry is experiencing a transformation due to technological upgrades and demand surges, positioning China to play a more central role in the global market [1]. - The industry is supported by government policies aimed at fostering innovation and industrialization, highlighting its strategic importance [5][6]. - The production capacity of optoelectronic devices in China is projected to exceed 20,000 billion units by 2025, reflecting a significant growth trajectory [9]. - Active optical devices account for approximately 83% of the optical communication system market, underscoring their critical role [11]. - The market for optical chips is expected to grow to approximately 15.914 billion yuan in 2025, driven by domestic replacements and technological advancements [13]. - The laser market is projected to reach 152.8 billion yuan in 2025, indicating robust growth [21]. Summary by Sections Industry Definition and Classification - Optoelectronic devices facilitate the conversion between optical and electrical signals and are categorized based on their functions and structures [3]. Industry Development Policies - The Chinese government has integrated the optoelectronic device industry into its strategic emerging industries, promoting technological innovation and industrialization through various policies [5][6][7]. Current Industry Status - The production of optoelectronic devices in China is expected to reach 18,479.7 billion units in 2024, marking a year-on-year growth of 28.51% [9]. - The optical communication device market is a core segment, with significant growth anticipated in optical chips and modules due to domestic technological advancements [13][15]. Key Enterprises - Notable companies in the industry include Sanan Optoelectronics, Huagong Technology, and Zhongji Xuchuang, which are leading in various segments such as LED, laser technology, and optical communication modules [30][31][38]. Future Industry Outlook - The industry is poised for growth driven by supportive government policies, technological innovations, and expanding application scenarios across telecommunications, consumer electronics, and medical fields [50][51][52].

Core Viewpoint - Co-packaged optics (CPO) technology is emerging as a promising solution to enhance bandwidth and energy efficiency in data centers, particularly for applications involving generative AI and large language models. However, manufacturing challenges remain, particularly in fiber-to-photonics integrated circuit (PIC) alignment, thermal management, and optical testing strategies [1][20]. Group 1: CPO Technology and Benefits - CPO enables network switches to route signals at speeds of terabits per second while significantly improving bandwidth and reducing power consumption required for AI model training [1][20]. - The technology achieves a bandwidth density of 1 Tbps/mm, optimizing rack space in increasingly crowded data centers [1][6]. - CPO can reduce power consumption associated with high-speed data transmission from approximately 15 pJ/bit to around 5 pJ/bit, with expectations to drop below 1 pJ/bit [6][7]. Group 2: Manufacturing Challenges - Key challenges in CPO manufacturing include achieving precise alignment between fiber and PIC, which is critical for effective optical signal coupling [8]. - The most common passive alignment method is the V-groove technique, which connects the fiber directly to the PIC to minimize loss [8][9]. - Efficient coupling between standard single-mode fibers and silicon waveguides is complicated due to significant differences in size and refractive index, leading to potential light loss [8][9]. Group 3: Thermal Management - CPO systems are sensitive to temperature fluctuations caused by high-power devices like GPUs and ASICs, which can affect the performance of photonic devices [11][12]. - A temperature change of just 1°C can lead to approximately 0.1nm wavelength shift in most photonic systems, necessitating careful thermal management strategies [11][12]. - Advanced thermal interface materials and monitoring circuits are deployed to maintain PIC temperature within predefined ranges [11][13]. Group 4: Reliability Design - Ensuring reliability in CPO systems is crucial, especially with multi-chip integration, requiring known good die (KGD) testing and optical testing solutions [14][16]. - High reliability designs incorporate redundancy, such as backup lasers, to maintain operation in case of component failure [15][16]. - Integrated monitoring and self-correcting features are being developed to detect performance degradation and facilitate quick recovery [15][16]. Group 5: Integration Techniques - Both 2.5D and 3D packaging methods are utilized in CPO, with 2.5D placing electronic ICs and PICs side by side on a silicon interposer [17][18]. - 3D integration allows for optimal manufacturing processes for each chip type, enhancing performance while increasing complexity and cost [18][19]. - The integration of optical features with traditional CMOS processes is becoming more compatible, facilitating advancements in CPO technology [17][18].