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深圳市发改委主任:2025湾区半导体芯片展,将于10月15日至17日在深圳福田会展中心举办!新凯来将带来惊喜
Ge Long Hui· 2025-10-10 06:26
【免责声明】本文仅代表作者本人观点,与和讯网无关。和讯网站对文中陈述、观点判断保持中立,不对所包含内容 的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考,并请自行承担全部责任。邮箱: news_center@staff.hexun.com 格隆汇10月10日|据一财,以"芯启未来,智创生态"为主题的2025湾区半导体芯片展(湾芯展),将于10 月15日至17日在深圳福田会展中心举办。深圳市相关官员公开确认,本土半导体企业新凯来将参展,并 会"给大家带来惊喜"。发布会上,深圳市发展改革委员会主任郭子平提到,近年来,深圳涌现出一批在 业界具有广泛影响力的创新企业和产品。今年3月,新凯来在上海的半导体设备展上大放异彩。本届湾 芯展中,请大家继续拭目以待。"新凯来包含了几个子公司,每个子公司都将在这次展会中带来意想不 到的惊喜。"郭子平说。 (责任编辑:宋政 HN002) ...
AI、光子与高速互联:Tower 2025全球技术研讨会重磅来袭
半导体行业观察· 2025-09-13 02:48
Core Viewpoint - Tower Semiconductor announces the launch of the 2025 Global Technology Symposium (TGS), focusing on key market trends in AI, high-speed interconnects, and other rapidly evolving fields, showcasing its capabilities in high-performance interconnects, energy-efficient architectures, and advanced imaging solutions [1]. Event Highlights - The TGS will take place in Shanghai, China on September 16, 2025, and in Santa Clara, California, USA on November 18, 2025 [1]. - Registration for the TGS in China is now open [1][3]. Agenda Overview - The event will feature a keynote speech by Tower's CEO, Russell Ellwanger, discussing the company's future vision and commitment to driving customer business growth through collaboration [4]. - Expert-led technical discussions will focus on Tower's industry-leading solutions in silicon photonics, silicon germanium, RF SOI, power management, image sensors, and advanced display technologies [4]. - A guest panel with global technology leaders will provide insights on AI innovations and breakthroughs in optical communications [4]. - Opportunities for networking with Tower executives, industry experts, and peers to foster collaboration for the next wave of semiconductor innovation [4]. Detailed Session Topics - Keynote by Russell Ellwanger [5]. - Invited talk by Eoptolink on AI high-speed interconnects [5]. - Discussion on market megatrends and Tower's technology solutions in RF mobile, infrastructure, power, and sensors [5]. - Presentation on Tower's design enablement services [6]. - Overview of power management technologies for system efficiency and integration [6]. - Insights into OLEDoS displays and next-generation image sensor technologies [6]. - Foundry technologies for high-speed data transfer applications, including Tower's silicon photonics and RF SOI technologies [6]. Venue Information - The event will be held at the Aloft Hotel in Zhangjiang, Shanghai [9].
美国芯片,凭啥领先?
半导体行业观察· 2025-06-30 01:52
Core Viewpoint - The article emphasizes the critical importance of the United States maintaining its leadership in the semiconductor technology sector for economic and national security reasons. It highlights the need for increased federal investment in semiconductor research and development to address competitive gaps and ensure innovation in key industries such as AI, high-performance computing, and defense [1][2][3]. Group 1: Federal Investment and Research Projects - The CHIPS R&D projects represent a significant investment of $540 billion aimed at enhancing domestic semiconductor manufacturing capacity and innovation [3]. - The federal government, through the Semiconductor Research Office (CRDO), is implementing a comprehensive strategy to ensure cutting-edge semiconductor technologies are developed and manufactured in the U.S. [2][3]. - The CRDO projects are designed to democratize access to innovation assets, which would otherwise be unattainable without public funding [2][3]. Group 2: Importance of Semiconductor Research - Ongoing semiconductor research projects are expected to address innovation challenges and drive advancements across the computing stack [5]. - The National Advanced Packaging Manufacturing Program (NAPMP) has allocated $300 million for its first R&D funding project, focusing on materials and substrates [18]. - The NAPMP aims to strengthen domestic semiconductor advanced testing, assembly, and packaging capabilities [17]. Group 3: Advanced Packaging Technology - Advanced packaging technology is crucial for enhancing the performance of AI and high-performance computing chips, allowing for more efficient designs and manufacturing processes [15][17]. - The U.S. currently holds only 4% of the global packaging supply chain, highlighting the need for strategic development in this area [17]. - The NAPMP is coordinating with other initiatives to invest in semiconductor and AI ecosystems, emphasizing the importance of advanced packaging innovation [17]. Group 4: Collaboration and Innovation - The NSTC aims to establish long-term R&D resources for the U.S. semiconductor ecosystem, facilitating collaboration among industry players, startups, and academia [22][23]. - The NSTC is developing three major facilities to support large-scale commercialization and prototyping efforts, including the EUV Accelerator and Design Collaboration Facility [48][52]. - The SMART USA initiative focuses on advancing digital twin technology to optimize semiconductor manufacturing processes and reduce costs significantly [30][33]. Group 5: Measurement and Precision - The CHIPS metrology project is investing in enhancing the industry's ability to perform critical measurements for process verification and failure analysis [36]. - Accurate measurement capabilities are essential for maintaining high standards in semiconductor manufacturing, especially as feature sizes decrease [36]. Group 6: Future Directions - The article concludes that the ongoing federal research projects must adapt to evolving innovation landscapes to maintain U.S. competitiveness in the semiconductor sector [38][39]. - Continuous collaboration with industry partners is essential to ensure these projects fulfill their promise of driving semiconductor innovation in the U.S. [40].
两大半导体设备巨头,再次投资印度
半导体芯闻· 2025-06-20 10:02
Core Viewpoint - Applied Materials plans to establish a semiconductor manufacturing equipment R&D center in Bangalore, India, with an expected investment of over $2 billion [1][2]. Group 1: Applied Materials Initiatives - The R&D center, named "Semiconductor Manufacturing Innovation Center (ICSM)," aims to attract over $2 billion in investments and create high-tech opportunities while accelerating semiconductor innovation [1][2]. - The facility will involve an investment of $400 million over the next four years and is expected to create 1,500 jobs [2]. - The center will collaborate with top academic institutions like the Indian Institutes of Technology (IITs) to address high-value semiconductor challenges and foster innovation [2]. Group 2: Lam Research Developments - Lam Research will establish two units in Karnataka: an advanced R&D lab with an investment of ₹67.9 billion and a semiconductor silicon component manufacturing plant with an investment of ₹91.1 billion, creating 1,400 jobs [1][2]. Group 3: Other Semiconductor Projects - Bharat Semi Systems plans to build an integrated design manufacturing (IDM) semiconductor factory in Mysore with a total investment of ₹23.42 billion, focusing on silicon carbide and gallium nitride semiconductors, expected to create over 620 jobs [4].