Core Insights - The "2025 Second High-Performance Chip Developers Forum and Chip Thermal Management Technology Exchange Conference" will be held on May 22-23 in Beijing, focusing on domestic AI chip progress, safety, packaging technology, thermal design, and cooling techniques [1][4]. Event Overview - The forum will feature over 20 presentations and is expected to attract more than 300 industry experts [1]. - Key topics include AI chip critical technologies, packaging techniques, and efficient cooling technologies [5]. Confirmed Speakers and Topics - Tsinghua University: Cross-Scale Thermal Management of Electronic Systems [7] - ZTE Corporation: Discussion on High-Power Chip Cooling [7] - Chipmore Technology: Challenges in 3DIC Cooling and Micro-Nano Scale Heat Transfer Assessment [7] - Shanghai Birun Technology: Instant Overcurrent Protection and Dynamic Power Control for GPU Chip Stability [7] - Ansys: Topic to be confirmed [7] - Beijing Horizon Information Technology: Thermal Design and Challenges of Intelligent Driving Domain Controllers [7] - China Academy of Microelectronics: High Heat Flux Cooling Technology for High-Performance Chips [7] - Other notable companies include NVIDIA, Huada Semiconductor, and Unisoc, with topics pending confirmation [7]. Participation Details - Registration fee for attendees is 2500 RMB per person, which includes learning materials and access to a dedicated community [9]. - Options for exhibition and speaking opportunities are available, including a 30-minute presentation slot [9].