CoWoP

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X @郭明錤 (Ming-Chi Kuo)
郭明錤 (Ming-Chi Kuo)· 2025-08-01 01:32
CoWoP has recently taken the spotlight in the AI server industry. While it is a promising technology that merits ongoing attention, it also comes with significant uncertainties and challenges surrounding mass production and commercialization. Much has already been written online about its technical advantages and manufacturing hurdles. Here, I offer two additional perspectives for consideration:1. A Comparison with Apple’s SLP Adoption TimelineAccording to Zhen Ding's annual report, it appears that Apple be ...
X @郭明錤 (Ming-Chi Kuo)
郭明錤 (Ming-Chi Kuo)· 2025-08-01 01:32
CoWoP是近期AI伺服器產業的焦點,這是好技術並值得持續關注,但也不能忽略量產/商業化的高度不確定性與挑戰。網路上已經有很多關於技術優勢與製造挑戰的分析,我從另外兩個角度來分析:1. 首先是用Apple的例子來對比根據臻鼎的年報,可推論Apple至少從2013年就開始投入SLP研發,至2017年才開始量產並用於新款iPhone (X、8與8 Plus)。這四年內,Apple、材料商、製造商、與設備商合作,共同解決研發與量產問題,這不只是單一技術開發,而是整個產業生態升級。現在的PCB產業技術當然遠勝十年前,但Nvidia對技術與供應鏈的掌控能力不見得勝過10年前那時的Apple,且CoWoP要導入SLP的挑戰也遠勝iPhone案例 (粗略看,前者是後者約萬倍的系統功耗、一半以下的線寬線距、3倍以上的層數、百倍的面積)。在沒有具體的實際測試結果前,CoWoP要在2028年量產並用於Rubin Ultra是很樂觀的預期。2. CoWoP與CoPoS同時量產與商業化的挑戰艱鉅台積電有另一個次世代封裝技術CoPoS,也預計在2028後量產。CoWoP在理論上可以改善傳輸效率並簡化供應鏈,但CoPoS要解決的是很實際 ...
200亿美元市场缺口待补! BTK抑制剂或点燃MS赛道,下半年迎来关键节点!这些公司有望抢占MS出海先机
第一财经· 2025-07-31 02:17
Group 1: Multiple Sclerosis (MS) Market Opportunity - The global market for Multiple Sclerosis (MS) is estimated to have a gap of $20 billion, with BTK inhibitors potentially igniting the MS treatment sector, particularly in the second half of the year [2][3] - The existing market for MS treatments is primarily focused on Relapsing MS (RMS), while BTK inhibitors are expected to address the unmet needs in Progressive MS (PMS) [3][5] - Key companies expected to benefit from this market opportunity include specific listed firms, with significant data readouts anticipated in the second half of 2025 [3][6] Group 2: PCB Technology Revolution - A new process in printed circuit boards (PCBs) is anticipated to trigger a technological revolution, with a notable increase in demand for SLP (Substrate-like PCB) and a rise in requirements for laser equipment [7][8] - SLP technology is expected to closely resemble IC substrates, with significant performance improvements anticipated as CoWoP (Chip-on-Wafer-on-Panel) technology becomes more commercialized [7][8] - Companies with leading positions in SLP technology and those supplying advanced laser writing and drilling equipment are expected to benefit significantly from these developments [7][8]