Core Viewpoint - The semiconductor underfill market is experiencing significant growth driven by the increasing demand for high reliability and miniaturization in electronic products, particularly in sectors like consumer electronics, automotive electronics, and industrial control systems [5][10][14]. Group 1: Product Definition and Scope - Semiconductor underfill is a critical material used in the packaging process, filling the gap between chips and substrates to enhance reliability under thermal and mechanical stress [4]. - The primary functions of underfill include thermal management, structural strength enhancement, and improved mechanical performance of the packaging [4]. Group 2: Industry Background and Development History - The underfill industry began in the late 1980s, evolving from basic epoxy materials to advanced formulations that address the challenges of modern semiconductor packaging [6][7]. - The market has matured significantly since the mid-2000s, with a notable expansion in applications due to the rise of smartphones and wearable devices [7]. Group 3: Current Industry Status - The demand for underfill materials is primarily driven by consumer electronics, automotive electronics, and industrial control systems, with a notable shift towards high-performance and environmentally friendly materials [10][11]. - The industry is characterized by a complex competitive landscape, with international firms dominating high-end markets while local companies are gradually increasing their market share [18][19]. Group 4: Development Trends - Future trends indicate a focus on high-performance, environmentally friendly, and intelligent materials, with significant growth potential in emerging markets such as automotive electronics and 5G communication [11][12]. - Innovations in materials and processes, including low CTE and high thermal conductivity materials, are expected to meet the stringent requirements of next-generation applications [19][20]. Group 5: Market Size and Growth Forecast - The global semiconductor underfill market is projected to grow at a CAGR of 10.48%, reaching USD 721 million by 2024 and exceeding USD 1.443 billion by 2031, with China expected to account for 24.72% of the global market share by 2031 [14][17]. Group 6: Regional Market Dynamics - The Asia-Pacific region, particularly China, is becoming a major growth driver, contributing 29.28% of global consumption by 2024, while high-end markets remain dominated by international players [17]. Group 7: Competitive Landscape and Challenges - The market is marked by a dichotomy of high-end monopolies and mid-to-low-end competition, with leading firms maintaining a technological edge through continuous R&D investments [18]. - Geopolitical factors and supply chain security are increasingly influencing competition, necessitating local firms to innovate and adapt to maintain market access [21].

Investment Rating - The report maintains an investment rating of "Outperform the Market" for the new materials industry [7]. Core Insights - The new materials sector underperformed the CSI 300 index in November 2025, with a decline of 4.03% compared to the CSI 300's decline of 2.70%, resulting in a 1.33 percentage point lag [7][11]. - The sector's trading volume was 22,734.18 billion yuan, reflecting a 6.55% decrease from the previous month [7]. - The semiconductor materials segment continues to show growth, with global semiconductor sales reaching $69.47 billion in September 2025, marking a 25.1% year-on-year increase [42][43]. - The report highlights significant growth in the export volume and value of industrial diamonds in October, with exports amounting to 1.39 million tons and a value of $19.7 million, representing a 16.91% year-on-year increase [51]. Summary by Sections 1. Industry Performance Review - The new materials index's performance in November was weaker than the CSI 300, with a decline of 4.03% [11]. - Most stocks in the new materials sector experienced declines, with 113 out of 170 stocks falling [18]. - The sector's valuation decreased, with the new materials index's PE ratio at 28.96, down 6.81% from the previous month [22]. 2. Key Industry Data Tracking - In October, the CPI turned from decline to growth, increasing by 0.2% year-on-year, while the PPI's decline narrowed to 2.1% [30][31]. - Basic metal prices showed mixed results in November, with copper down 0.81% and tin up 3.54% [37]. - The global semiconductor market continues to grow, with a 25.1% year-on-year increase in sales [42]. - The export of superhard materials showed a significant increase in October, with a notable rise in export value [51]. 3. Industry Dynamics - The report notes the issuance of an action plan for the upgrade of the non-ferrous metal industry in Henan Province [1]. - The establishment of a diamond wafer factory by Diamond Foundry is highlighted as a significant development in the new materials sector [1].

Group 1 - The core viewpoint is that glass is transitioning from a niche material to a strategic material in the semiconductor industry, with applications expected to grow nearly threefold by 2030 [1][2][5] - Glass is becoming a core material for both temporary and permanent functions in semiconductor manufacturing, with carrier wafers being the largest revenue source [2][5] - The demand for glass is projected to grow at a compound annual growth rate (CAGR) of 10.2% from 2025 to 2030, driven by the increasing complexity of packaging processes transitioning from 2D to 3D [2][5] Group 2 - By 2030, glass material revenue is expected to grow at a CAGR of 9.8%, solidifying its position as a mainstream semiconductor processing platform [5] - The most dynamic sector for glass is the CIS field, which is anticipated to account for two-thirds of total glass revenue by 2025, driven by high demand in smartphone and automotive imaging applications [5] - The memory segment is projected to have the highest growth potential, with a CAGR of 33% from 2025 to 2030, particularly in HBM applications [5][6] Group 3 - The glass supply chain is expected to evolve similarly to the IC substrate industry by 2030, characterized by regional redundancy and detailed specification requirements [9] - Major companies like AGC, PlanOptik, Corning, and Schott are projected to account for about 90% of global revenue by 2025, indicating high market concentration [9] - The transition in the glass supply chain will provide competitive advantages to companies that master capacity and reuse strategies [9] Group 4 - Glass substrates are being developed to replace traditional PCB materials, enhancing power efficiency and thermal resistance, with significant advantages in reducing warpage [10] - South Korean companies, including Samsung, SK, and LG, are actively pursuing the commercialization of glass substrates to expand their market presence in next-generation semiconductor applications [10]

Core Viewpoint - Toray Industries has developed a high-performance polyimide material for semiconductor back-end processes, which is set to be mass-produced by 2028, addressing both technical and environmental requirements [2][3]. Group 1: Material Development - Toray's new temporary bonding material is suitable for semiconductor wafers with a thickness of 30 micrometers or less and is free from harmful substances like perfluoroalkyl and N-methylpyrrolidone [2]. - The material boasts an elastic modulus 2.5 times that of traditional products and a total thickness variation of ≤1.0 micrometer, solving issues related to deformation and uneven pressure during back grinding [2]. - The applications of this material span across AI semiconductors, NAND flash memory, and power semiconductors, aligning with the needs of next-generation vertical stacking technologies [2]. Group 2: Industry Trends - The semiconductor industry is transitioning towards advanced manufacturing technologies such as 3D integration and heterogeneous integration, necessitating thinner wafers [3]. - Advanced packaging technologies require wafer thickness reductions to 50 micrometers or even below 20 micrometers [3]. Group 3: Temporary Bonding Materials - The core function of temporary bonding materials is to provide mechanical support during the processing of ultra-thin wafers (≤50μm) to prevent warping and cracking [4]. - Various types of temporary bonding materials include epoxy-based, wax-based, silicone-based, and polyimide-based, with polyimide being the most promising due to its excellent thermal stability and mechanical strength [8]. - Polyimide-based temporary bonding adhesives can be categorized into thermal release, laser release, and chemical release types, each suited for different applications [8]. Group 4: Market Dynamics - The global market for polyimide-based temporary bonding adhesives is dominated by international giants like JSR, Brewer Science, and Dow DuPont, while domestic players are accelerating breakthroughs [9]. - The temporary bonding adhesive market is projected to grow from $236 million in 2024 to $402 million by 2031, with a CAGR of 8.0%, significantly outpacing the overall temporary bonding materials market [11]. - The Chinese market is expected to grow from 450 million RMB in 2024 to 1.26 billion RMB by 2030, with a CAGR of 20.3%, driven by the acceleration of domestic semiconductor advanced packaging [11].

证券日报网讯 TCL科技11月27日在互动平台回答投资者提问时表示，公司聚焦以半导体显示、新能源 光伏和半导体材料为核心的先进制造业，锚定领先战略，强化经营韧性，追求可持续的高质量发展。公 司坚持以科技为引领，以创新为驱动，助力企业核心竞争力提升和产业的转型升级。公司高度重视前瞻 性技术投入及应用，以关键战略技术、材料技术、装备技术和器件工艺技术为支撑，驱动企业更快发 展。目前公司各业务经营稳健，具体业务情况请参阅公司在指定信息披露媒体发布的定期报告及临时公 告。 （编辑 姚尧） ...

Group 1 - Guangdong Province is implementing the "Quality Leap County" initiative to promote quality innovation practices in county-level cities, with 35 quality strong counties (districts, towns) established, achieving coverage of 21 cities above the prefecture level [1][5] - The Guangdong Quality Conference recognized TCL Technology Group and KUKA Robotics (Guangdong) for their contributions to quality management, with TCL focusing on integrating excellence performance models into its core business and KUKA establishing a major robotics production base in South China [2][3] - Guangdong has built a comprehensive quality infrastructure, including 86 national quality inspection centers and 73 one-stop service platforms, aiding 128,000 small and micro enterprises in addressing quality development challenges [3][5] Group 2 - The province has achieved "five national firsts" in the number of operating entities, including private and foreign-invested enterprises, and has actively promoted the "Bay Area Standards" to enhance quality mechanisms in the Greater Bay Area [3][5] - The province's quality strong county initiative is part of the "Quality Strong Province Construction Outline," with a focus on establishing a collaborative policy framework among provincial, municipal, and county levels [5][6] - Dongguan's Chang'an Town has developed a strategy to become a "Quality Strong Town," aiming for a GDP of 1050.7 billion yuan in 2024 and fostering over 170,000 business entities [6]

Core Viewpoint - Tianyu Semiconductor, a manufacturer of silicon carbide epitaxial wafers based in Dongguan, Guangdong, is set to launch its IPO from November 27 to December 2, 2025, with plans to list on the Hong Kong Stock Exchange on December 5, 2025, under the sponsorship of CITIC Securities [3][4]. Group 1: IPO Details - The total number of shares offered is 30,070,500 H-shares, with 3,007,050 shares available for public sale and 27,063,450 shares for international placement [4][5]. - The offer price is set at HKD 58.00 per share, with an estimated total fundraising amount of approximately HKD 1.744 billion [4][5]. - The IPO will adopt Mechanism B, with an initial public offering allocation ratio of 10% and no reallocation mechanism [5][4]. Group 2: Use of Proceeds - The net proceeds from the IPO are expected to be around HKD 1.671 billion, with approximately 62.5% allocated for capacity expansion, 15.1% for R&D and innovation, 10.8% for strategic investments or acquisitions, 2.1% for global sales and marketing, and 9.5% for working capital and general corporate purposes [8]. Group 3: Shareholder Structure - Post-IPO, the controlling shareholders will include Mr. Li Xiguang and Ms. Su Qin, holding approximately 53.8954% of the shares, with other notable investors including Huawei's Hubble Technology and BYD [9][8]. - The shareholder structure indicates a diverse range of investors, with public shareholders holding 7.6463% of the shares [9][10]. Group 4: Company Background - Established in 2009, Tianyu Semiconductor is a leading supplier of third-generation silicon carbide semiconductor materials and ranks first in China's silicon carbide epitaxial wafer industry by revenue and sales volume, with market shares of 30.6% and 32.5% respectively [10]. - The company is one of the first in China to achieve mass production of 4-inch, 6-inch, and 8-inch silicon carbide epitaxial wafers, with an annual capacity of approximately 420,000 wafers as of May 31, 2025 [10].

以下文章来源于DT半导体 ，作者DT半导体 DT半导体 . 聚焦于半导体材料行业的最新动态 12月9-11日 ，由DT新材料主办的 第九届国际碳材料大会暨产业展览会（Carbontech 2025） 将 在上海新国际博览中心隆重举办，同期举办的Carbontech2025金刚石年会， 已邀请国内外知名专家和企 业莅临交流，欢迎报名。 欢迎扫码报名参会， 免费参观。 近期，全球半导体产业迎来了一个值得关注的重要信号 —— 美国人造钻石企业 Diamond Foundry （DF）宣布，其位于西班牙特鲁希略的合成金刚石晶圆厂获得西班牙政府以及欧盟批准，将大规模生产用 于芯片制造的半导体级单晶金刚石 （single-crystal diamond, SCD）衬底 。 西班牙政府通过国家半导 体支持计划出资 7.53 亿欧元（约合 8.68 亿美元） ，DF 自身也承诺在未来几年追加投资，这一举措标 志着"金刚石——从珠宝到芯片基底"的转型迈入工业化、商业化新阶段。 为什么这个项目值得业内关注？ 众所周知，目前绝大多数半导体器件依赖硅（Si）作为衬底材料——但硅的热导率相 对有限，这成为高功 率、高密度芯片（如 AI ...

Group 1 - Japan's economy is under unprecedented pressure due to China's countermeasures, including the suspension of certain Japanese food imports and beef negotiations, exacerbating an already sluggish economic situation [1][4] - The offshore exchange rate of the US dollar to Japanese yen has surpassed 1:157, indicating a potential breach of the critical 160 mark, reflecting growing market panic [1] - Japanese companies like Tokyo Electron and Shin-Etsu Chemical derive over 20% of their revenue from China, with some key components having a dependency rate as high as 40%, highlighting the risks of economic sanctions [6] Group 2 - The idea of replicating the successful strategy against South Korea by restricting semiconductor materials to pressure China is fundamentally flawed, as China's semiconductor industry has developed a robust alternative system [4] - China's domestic market for semiconductor materials is projected to reach 120 billion yuan by 2024, with a domestic supply rate increasing from under 15% in 2020 to 25% [4] - The interdependence between Japan and China in the context of economic globalization means that any economic sanctions could backfire, potentially leading to a crisis for Japan [6][8] Group 3 - The current political and economic tensions between Japan and China necessitate a reevaluation of their relationship, with a focus on dialogue and cooperation as a potential path forward [8] - Open communication and mutually beneficial strategies are essential to avoid further economic damage and to seek a win-win situation for both nations [8]

Group 1: Chemical & New Materials Industry Strategy - The chemical industry is expected to reach a turning point due to valuation and profit bottoming out, driven by anti-involution policies and resource supply contraction, with demand gradually recovering [4][5] - As of November 20, 2025, the chemical sector has seen a 37% increase, with the basic chemical sector's net profit for Q1-Q3 2025 reaching 116 billion yuan, a year-on-year increase of 7.45% [4] - The demand side is supported by the Federal Reserve restarting the interest rate cut cycle and stabilizing global political situations, while domestic exports and the automotive sector bolster demand [4][5] Group 2: Resource Supply and Demand Dynamics - Potash prices are expected to rise in 2026, with the industry maintaining a tight supply-demand balance from 2026 to 2028 [5] - The phosphoric chemical sector is facing capacity constraints, with projected demand for phosphoric acid from 2025 to 2027 being 42.33 million tons, 43.26 million tons, and 43.88 million tons respectively [5] - The refrigerant sector is experiencing supply restrictions due to quota limitations, leading to a steady increase in market conditions for second and third-generation refrigerants [5] Group 3: Investment Recommendations - Recommended companies in the potash sector include Dongfang Iron Tower, Yaqi International, and Salt Lake Co [6] - In the phosphoric chemical sector, recommended companies include Chuanheng Co, Yuntu Holdings, and Xingfa Group [6] - The organic silicon industry is expected to see a supply-demand balance improve in 2026, with companies like Dongyue Silicon Material and Xingfa Group being highlighted [6] Group 4: AI and Semiconductor Demand - The demand for high-performance new materials is driven by the explosion in AI and semiconductor needs, with electronic resins and fillers seeing rapid growth [6] - The semiconductor materials sector is focusing on domestic supply chain security, emphasizing the importance of local production [6] - The cooling liquid market is expected to grow due to increasing server power demands, with immersion cooling becoming a significant future direction [6] Group 5: Company Performance - Kuaishou-W - Kuaishou-W reported Q3 2025 revenue of 35.554 billion yuan, a year-on-year increase of 14%, with net profit reaching 4.488 billion yuan, up 37% year-on-year [15][16] - The average daily active users (DAU) for Kuaishou in Q3 2025 was 416 million, reflecting a 2.1% year-on-year growth [15] - The company is actively commercializing its AI business, with AI revenue exceeding 300 million yuan in Q3 2025, contributing to a 4%-5% increase in online marketing revenue [16][17]