Core Insights - Elon Musk agrees with TSMC's concerns about chip oversupply, predicting that the limiting factor for the AI industry will shift from chip manufacturing to the ability to power and operate these chips, with key bottlenecks in power supply, transformer configuration, and cooling system deployment [1][3] Group 1: AI Infrastructure Challenges - Musk emphasizes that deploying AI chips involves more than just transporting GPUs to power plants; it requires addressing three core issues: gigawatt-level power supply, high-voltage power conversion, and efficient cooling systems [2] - The data center industry is undergoing a critical transition from air cooling to liquid cooling, which carries significant risks, such as potential losses of up to $1 billion if cooling systems fail [2] Group 2: Power Supply vs. Chip Production - Musk predicts that by Q3 2026, the core bottleneck will transition from chip manufacturing to the capability to operate these chips, as AI chip production is expanding exponentially while the supporting power infrastructure is only growing linearly [3] - The disparity between the rapid increase in chip output and the slow growth of power supply means that many high-performance AI chips may remain unused due to inadequate power conversion and cooling systems [3]

2026.01.07 本文字数：2556，阅读时长大约5分钟 作者 |第一财经 刘佳 当地时间1月6日，拉斯维加斯夜幕降临，在世界上最大的球形建筑Sphere里，英伟达CEO黄仁勋、英特 尔CEO陈立武、AMD CEO苏姿丰、高通CEO安蒙相继登场。 在芯片行业竞争日趋激烈、技术路线与生态之争持续升级的背景下，这四家芯片巨头中既有合作伙伴， 也有彼此最直接的竞争者。尽管它们同处AI叙事框架，却鲜少出现在同一舞台。 这一次将四大巨头共同推至舞台中央的，是联想。在CES 2026期间举行的联想全球创新科技大会 （Tech World）上，芯片四巨头齐聚，也清晰地勾勒出一个正在重塑中的产业逻辑：当AI从训练走向推 理、从云端走向本地与边缘，成为枢纽的，不再只是单一芯片厂商，而是能够整合多元算力、打通智能 硬件场景落地的系统级玩家。 黄仁勋：重塑10万亿美元产业 黄仁勋是当晚最先点燃现场气氛的嘉宾。 几天前，他刚刚与联想集团董事长杨元庆碰面，二人立下新年合作目标——未来三年内，将双方的业务 合作规模扩大至原来的四倍。 过去三十年里，联想与英伟达的合作涵盖了从个人电脑、工作站到高性能计算、GPU 服务器、机器人 等。 ...

Core Viewpoint - The article highlights the collaboration and competition among major chip manufacturers, including NVIDIA, Intel, AMD, and Qualcomm, during the Lenovo Tech World event, emphasizing the shift in the AI landscape from training to inference and the need for integrated systems that can leverage diverse computing power [3][4]. Group 1: Collaboration and New Opportunities - NVIDIA's CEO Jensen Huang and Lenovo's Chairman Yang Yuanqing aim to quadruple their business collaboration over the next three years, reflecting a long-standing partnership that has evolved through various technological shifts [5][6]. - The collaboration focuses on the "Lenovo AI Cloud Super Factory," which aims to standardize AI infrastructure, transforming highly customized AI deployments into industrialized solutions [6][8]. - This partnership is expected to help cloud service providers reduce the "time to first token" for AI deployment and scale up to support trillion-parameter models [8]. Group 2: Competitive Landscape - AMD's CEO Lisa Su introduced the Helios rack-level AI platform, positioning it as a challenge to NVIDIA's GPU-centric approach, emphasizing the need for robust system-level infrastructure to support larger models and higher throughput [10][11]. - Intel's new CEO Pat Gelsinger announced the Aura Edition AI PC, showcasing a shift from traditional PCs to AI-enhanced computing experiences, indicating a blend of legacy computing with new AI paradigms [11]. - Qualcomm's CEO Cristiano Amon focused on AI-native endpoints, highlighting the evolution of wearable devices into "personal intelligent companions," which aligns with Lenovo's strengths in ecosystem and global channels [12]. Group 3: Industry Trends and Insights - The article notes that the market for wearable devices is expected to exceed one billion units, indicating significant growth potential in this segment [13]. - The collaboration among the four chip giants illustrates a new industry consensus that the true value of AI lies not in having the most powerful chip, but in the ability to transform computing power into usable capabilities for businesses and users [13].

【1月7日连板股分析：连板股晋级率近四成 芯片产业链全线走强】今日共80股涨停，连板股总数23 只，其中三连板及以上个股16只，上一交易日共43只连板股，连板股晋级率37.20%（不含ST股、退市 股）。个股方面，全市场超3100只个股下跌。人气股嘉美包装、国晟科技（维权）停牌核查，市场短线 情绪有所降温。高位连板股分歧加剧，昨4连板南兴股份跌超8%，昨日3连板农心科技跌停，昨日3连板 索菱股份炸板跳水最终收跌3.41%，而雷科防务、友邦吊顶、城建发展虽然晋级，但盘中均开板放量换 手。板块方面，芯片产业链全线走强，光刻胶、半导体设备、存储芯片方向领涨，盈新发展（维权）2 连板，国风新材3天2板，华融化学、恒坤新材、高盟新材、南大光电等20CM涨停；商业航天概念探底 回升，鲁信创投9天7板，雷科防务6连板，城建发展4连板，金风科技8天4板，消息面上，SpaceX在星 舰基地建造了超大型总装车间Gigabay,加速星舰的生产,目标是每年1000艘星舰的产能。 转自：智通财经 ...

可以清楚地看到，在CES的舞台上，从上游芯片、显示到终端PC、家电以及智能硬件，AI技术正从"云 侧智能"全面走向"端侧融合"，不再仅仅被视作一项附加功能，而是成为重构人机交互逻辑的基础架 构。致敬未知创始人吴德周对作者指出，这说明整个行业已从早期的"技术展示期"，迈入以真实用户场 景为中心的"价值落地期"。 值得一提的是，CES既是科技巨头们炫技比拼的竞速场，也是众多创业者"破冰"和打破商业思维认知局 限的实践课。尤其是对于中国企业来说，作为出海的关键一站，需要将算法、技术转换为看得见的硬 件，需要学会AI时代的加减法，将繁杂归于AI，把优雅和从容留给人类。 作为全球领先的财经科技信息服务平台、科技生态服务商和CES多年持续的官方合作媒体机构，钛媒体 集团今年也以唯一进驻LVCC Central Hall（19227号展位）的中国媒体身份，占据核心C位，邀请不同领 域最具代表性的中国创新力量来到Media Stage，以一线视角，共同呈现全球科技创新的最新走向。 物理AI的"ChatGPT时刻"，英伟达们的"野心"不藏了 一年前，英伟达CEO黄仁勋化身美队，提前点燃了CES的第一把火。今年的CES，黄仁勋虽 ...

韩国股市周三上冲下洗，收盘小幅上涨，创下收盘纪录新高，原因是芯片制造商因人工智能乐观情绪而 上涨，现代汽车领涨汽车制造商。 受市场猜测现代汽车或将与英伟达深化合作的影响，该公司股价大涨。Kiwoom Securities分析师Shin Yoon-chul表示，现代汽车在拉斯维加斯消费电子展上宣布的工厂拟部署Atlas人形机器人计划，不足以 完全解释此次股价大涨。他指出，现代汽车计划到2028年实现约3万台机器人的产能，且此次展出的阿 特拉斯产品仅为静态模型。不过Shin Yoon-chul称，在现代汽车集团会长郑义宣与英伟达首席执行官黄 仁勋于消费电子展期间会面后，投资者对双方合作的预期已有所升温，认为合作可能突破单纯的芯片供 应关系。 MACD金叉信号形成，这些股涨势不错！ 韩国综合股价指上涨0.57%，报4551.06点，创历史最高收盘纪录。该指数连续第四个交易日上涨。 三星电子周四将公布第四季度财报。 现代汽车大涨 13.8%，创下历史最高水平，也是自 2021 年 1 月以来的最大单日涨幅，原因是市场预期 将与美国芯片制造商英伟达开展更深入的合作 。起亚汽车上涨5.55%。外资在KOSPI买超 12， ...

Core Viewpoint - The article discusses the anticipated memory chip supply shortage and its impact on the electronics industry, highlighting Samsung's position and outlook in the face of rising production costs and potential price adjustments for consumers [3][4]. Group 1: Memory Chip Supply and Pricing - Samsung Electronics predicts that the shortage of memory chips will drive up prices across the electronics industry, affecting even its consumer products [3]. - The global marketing president of Samsung, Wonjin Lee, stated that semiconductor supply issues will impact everyone, and while the company hopes to avoid passing costs onto consumers, price adjustments may become necessary [3]. - Counterpoint Research forecasts a 50% increase in memory component prices until the second quarter of this year [4]. Group 2: Market Dynamics and Competitor Positioning - The demand for high-bandwidth memory driven by the AI data center construction boom has led to unprecedented demand, pushing Samsung and SK Hynix stock prices to new highs [4]. - Competitors reliant on external memory supply are at a disadvantage compared to Samsung, which has a more favorable position due to its production capabilities [4]. - Companies like Dell and Xiaomi have warned of potential price increases, while Lenovo began stockpiling memory chips last year [4]. Group 3: Future Outlook - Samsung's outlook for 2026 is optimistic, with expectations that consumer upgrades in the mobile sector will be driven by new AI technologies [4].

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 来源：聪明投资者 昨天CES2026主舞台上，英伟达创始人、CEO黄仁勋穿着标志性皮衣演绎他的2026年"炸场秀"，也给全 球科技与资本市场递出了一份未来产业路线图。 主题演讲之后的24小时内，他与分析师以及媒体平台进行了许多轮问答，围绕Rubin新平台、机器人与 物理AI、能源瓶颈、中国市场、存储（HBM）供应、Groq 团队合作、以及马斯克和自动驾驶等热点， 给出了更深入的回应。 当然，最炸场的是黄仁勋带来的核心判断：机器人行业，正在接近类似ChatGPT之于大模型的临界时 刻。 黄仁勋认为，当生成式视频模型已经可以理解并生成复杂动作，那么"驱动机器人完成动作"的生成模 型，在底层能力上已经非常接近成熟。这意味着一个新的技术拐点，正逐步从实验室走向现实世界，也 让所谓"物理AI"首次开始具备产业化的可见性。 他说，未来两三年，能看到重大突破。 与此同时，新推出的Rubin平台把训练效率提升4倍、token成本降低10倍，再一次把"算力即产能"的逻 辑推到极致。 黄仁勋仍反复强调开放生态，英伟达继续同时与 OpenAI、xAI、Goo ...

Core Insights - The gathering of the four major chip giants—NVIDIA, Intel, AMD, and Qualcomm—at the Lenovo Tech World during CES 2026 highlights the evolving dynamics of the semiconductor industry, where collaboration and competition coexist in the AI narrative [1] - The focus is shifting from individual chip manufacturers to system-level players that can integrate diverse computing power and facilitate the deployment of intelligent hardware solutions [1] Group 1: Industry Transformation - Jensen Huang, CEO of NVIDIA, emphasized the significance of AI as a foundational architecture akin to operating systems, marking a new platform shift in computing [4] - The IT industry has invested approximately $10 to $15 trillion over the past thirty years, necessitating a complete overhaul to adapt to AI applications [5] - Huang and Lenovo's CEO, Yang Yuanqing, announced a new collaboration plan to create a "Lenovo AI Cloud Super Factory," aiming to standardize AI infrastructure and transition from highly customized deployments to industrialized solutions [5][7] Group 2: Competitive Landscape - AMD's CEO, Lisa Su, introduced the Helios rack-level AI platform, positioning it as a direct challenge to NVIDIA's GPU-centric approach, highlighting the need for robust system-level infrastructure to support larger models and higher throughput [8] - Intel's new CEO, Pat Gelsinger, showcased the Aura Edition AI PC, which integrates the latest Intel processors, indicating a shift from traditional PCs to data centers and cloud computing [9][10] - Qualcomm's focus on AI-native endpoints, particularly in wearable devices, reflects a broader trend towards personal intelligent companions that require low power consumption and continuous connectivity [10] Group 3: Collaborative Ecosystem - The collaboration among the four chip giants illustrates a new industry consensus that the true value of AI lies not in possessing the most powerful chip but in transforming computing power into usable capabilities for enterprises and users [11] - Lenovo's role as a "system integrator" and "scene amplifier" is crucial in this collaborative ecosystem, as it bridges the various offerings from NVIDIA, AMD, Intel, and Qualcomm [11] - The wearable device market is projected to exceed one billion units, showcasing the potential for growth in AI-driven consumer technology [11]

Core Viewpoint - The mHC architecture is expected to introduce a new paradigm in AI chip design by combining manifold constraints with engineering optimization, addressing the mismatch between computing power and bandwidth [1] Group 1: mHC Architecture - The mHC architecture promotes the logic of "software actively adapting to hardware bottlenecks," driving the industry towards a "efficiency-first" approach in hardware-software collaboration [1] - Through optimizations like kernel fusion and selective recomputation, mHC significantly reduces bandwidth requirements, allowing chip design to move away from solely pursuing high-bandwidth HBM memory [1] - The manifold constraint logic of mHC may foster innovation in dedicated computing units for chips, breaking the current monopoly of "general computing units" in AI chips and advancing towards a "general + dedicated" heterogeneous architecture [1] Group 2: Performance and Market Impact - The mHC architecture, as released by DeepSeek, demonstrates stable performance and high scalability in large-scale model training, indicating a potential direction for the next generation of infrastructure [1] - The framework is expected to reignite academic interest in macro-architecture design and deepen the understanding of how topological structures influence optimization and representation learning, potentially breaking current limitations [1] Group 3: ETF and Market Representation - The Guotai AI ETF (159388) tracks the ChiNext AI Index (970070), which has a daily price fluctuation limit of 20% [1] - This index selects listed companies involved in AI technology and related applications from the ChiNext market, covering various segments from hardware manufacturing to software development, reflecting the overall performance of AI-related listed companies in the ChiNext market [1]