临时键合胶

Search documents
鼎龙股份:临时键合胶在已有客户持续稳定规模出货中
Ge Long Hui· 2025-09-03 13:02
格隆汇9月3日丨鼎龙股份(300054.SZ)在投资者关系中表示,在半导体先进封装材料领域,公司围绕半 导体先进封装上游几款自主化程度低、技术难度高、未来增量空间较大的材料产品进行布局,目前主要 有半导体封装PI、临时键合胶两类产品。2025年上半年度,半导体封装PI在售型号数量及覆盖客户数量 进一步增加,推动订单增长持续加速;临时键合胶在已有客户持续稳定规模出货中。 ...
鼎龙股份(300054.SZ):临时键合胶在已有客户持续稳定规模出货中
Ge Long Hui· 2025-09-03 12:11
格隆汇9月3日丨鼎龙股份(300054.SZ)在投资者关系中表示,在半导体先进封装材料领域,公司围绕半 导体先进封装上游几款自主化程度低、技术难度高、未来增量空间较大的材料产品进行布局,目前主要 有半导体封装PI、临时键合胶两类产品。2025年上半年度,半导体封装PI在售型号数量及覆盖客户数量 进一步增加,推动订单增长持续加速;临时键合胶在已有客户持续稳定规模出货中。 ...
调研速递|湖北鼎龙控股接受海通富基金等10家机构调研 半导体业务成关注焦点
Xin Lang Zheng Quan· 2025-09-03 12:01
9月3日下午2点至3点,湖北鼎龙控股股份有限公司在公司9楼会议室接待了海通富基金、财达证券、长 江证券等10家机构及投资者的调研。董事会秘书杨平彩女士参与接待,并与投资者就公司半导体业务、 打印复印通用耗材业务的经营及其他投资者关心的问题进行深入交流。 公司多款半导体材料产品已在国内主流企业实现批量销售与稳定供应,赢得客户信任。 在专利方面,截至2025年6月30日,公司已获授及在申请中的专利共1,301项,其中授权专利1,052项, 2025年上半年持续完善专利数据库建设。 声明:市场有风险,投资需谨慎。 本文为AI大模型基于第三方数据库自动发布,任何在本文出现的信 息(包括但不限于个股、评论、预测、图表、指标、理论、任何形式的表述等)均只作为参考,不构成 个人投资建议。受限于第三方数据库质量等问题,我们无法对数据的真实性及完整性进行分辨或核验, 因此本文内容可能出现不准确、不完整、误导性的内容或信息,具体以公司公告为准。如有疑问,请联 系biz@staff.sina.com.cn。 对于CMP抛光垫产品,其类型覆盖硬垫、软垫,应用节点不断扩展,具备定制化开发能力,供应链管 控强,生产工艺进步,CMP环节一 ...
研报掘金丨中银证券:维持鼎龙股份“买入”评级,看好公司半导体业务有序推进
Ge Long Hui A P P· 2025-08-26 08:05
Core Viewpoint - The report from Zhongyin Securities indicates that Dinglong Co., Ltd. achieved a net profit attributable to shareholders of 311 million yuan in the first half of 2025, representing a year-on-year increase of 42.78% [1] Financial Performance - In Q2 2025, the company realized a net profit attributable to shareholders of 170 million yuan, which is a year-on-year increase of 24.79% and a quarter-on-quarter increase of 20.61% [1] - The growth in the company's performance is primarily attributed to the sustained revenue and profit growth in the semiconductor business, as well as ongoing cost reduction and efficiency improvement efforts [1] Business Development - The new high-end wafer photoresist business is still in the investment phase, impacting the net profit attributable to shareholders by 33.76 million yuan [1] - The company has strengthened its market development efforts and resource allocation in the semiconductor business, leading to an increase in the number of product samples sent to clients, validation, and order acquisition [1] - Related expenses have increased year-on-year, which has somewhat affected the net profit level for H1 2025, but this supports further penetration of the company's semiconductor materials products in H2 2025 [1] Product Progress - The high-end wafer photoresist and advanced semiconductor packaging materials businesses are progressing smoothly [1] - In the temporary bonding adhesive segment, the company is maintaining stable shipment volumes with existing clients [1] - The outlook for the company's semiconductor business is positive, and a "buy" rating is maintained [1]
电子行业点评报告:先进封装砥砺前行,铸国产算力之基
Soochow Securities· 2025-07-26 15:12
Investment Rating - The report maintains an "Accumulate" rating for the electronic industry, indicating a positive outlook for the sector over the next six months [1]. Core Insights - The advanced packaging sector is crucial for the development of domestic computing power, with significant growth expected due to rising demand for advanced packaging technologies such as CoWoS and Fan-out [4]. - The report highlights the strong performance of ASMPT in Q2, driven by robust demand in China, with a 50% year-on-year increase in TCB orders, indicating a recovery in domestic advanced packaging demand [4]. - The report suggests that domestic computing power is likely to replicate the rapid growth seen in overseas markets, particularly in AI applications, positioning advanced packaging as a foundational element for this growth [4]. Summary by Sections Industry Trends - The report notes a projected increase in the electronic industry, with a focus on advanced packaging technologies that are essential for GPU, CPU, and base station applications [4]. - The importance of domestic advanced packaging supply is emphasized, especially in light of constraints in Taiwan's advanced packaging capacity [4]. Investment Recommendations - The report recommends focusing on leading companies in advanced packaging, including Shenghe Jingwei, Changdian Technology, Tongfu Microelectronics, and Yongxi Electronics, as well as materials and equipment suppliers like Qiangli New Materials and Jingzhida [4].
鼎龙股份(300054)2024年年报及2025年一季报点评:泛半导体业务快速成长 盈利能力高增
Xin Lang Cai Jing· 2025-05-08 10:44
Core Insights - The semiconductor sector is projected to contribute 45.54% to total revenue in 2024, with a continuous improvement in gross margin, which reached a recent high with a quarter-on-quarter increase of 0.8 percentage points in Q1 2025 [1][2]. Financial Performance - In 2024, the company achieved a revenue of 3.338 billion yuan, representing a year-on-year increase of 25.14%, with a net profit attributable to shareholders of 469 million yuan, up 185.26% year-on-year [2]. - The gross margin for 2024 was 46.88%, an increase of 9.93 percentage points year-on-year. In Q1 2025, revenue was 824 million yuan, a year-on-year increase of 16.37%, with a net profit of 135 million yuan, up 104.84% year-on-year, and a gross margin of 48.82%, marking a recent high [2][3]. Business Segment Growth - The semiconductor business segment saw a revenue of 1.52 billion yuan in 2024, a year-on-year increase of 77.40%, accounting for 45.54% of total revenue. Key contributors included: - CMP polishing pads with revenue of 716 million yuan, up 71.51% year-on-year, achieving a historical monthly sales high of 30,000 pieces in September 2024 [3]. - CMP polishing liquids and cleaning liquids with revenue of 215 million yuan, up 178.89% year-on-year [3]. - Semiconductor display materials with revenue of 402 million yuan, up 131.12% year-on-year, with increased market share for TFE-INK products [3]. R&D and New Product Development - The company invested 462 million yuan in R&D in 2024, a year-on-year increase of 21.01%, focusing on CMP polishing liquids, high-end wafer photoresists, advanced packaging materials, and new chip areas [3]. - The company has developed over 20 high-end wafer photoresists, with 12 samples sent for client verification, and 7 products entering the gallon sample stage [3]. - In semiconductor packaging, 7 products have been developed, with 6 sent for verification, and 1 product has received its first bulk order [3].
大涨192%!鼎龙股份,抛光液获千万级订单,无氟PSPI正在送样
Sou Hu Cai Jing· 2025-04-29 16:26
Core Insights - Dinglong Co., Ltd. reported significant growth in Q1 2025, with revenue of 824 million yuan, up 16.37% year-on-year, and a net profit of 141 million yuan, up 72.84% [1] - The company achieved a total revenue of 3.338 billion yuan in 2024, a 25.14% increase, and a net profit of 521 million yuan, up 134.54% [1] - Dinglong's profitability has notably improved, driven by breakthroughs in CMP polishing materials and display materials, alongside stable performance in printing consumables [1] Semiconductor Materials Business - In 2024, the semiconductor materials segment generated 1.52 billion yuan in revenue, a 77.40% increase, contributing significantly to overall revenue [1] - CMP polishing pad revenue reached 716 million yuan, up 71.51%, with monthly sales surpassing 30,000 pieces by September [1] - The company has expanded its production capacity for polishing pads, achieving a monthly output of approximately 40,000 pieces by Q1 2025 [1] Polishing Liquids and Cleaning Liquids - Revenue from polishing and cleaning liquids was 215 million yuan, marking a substantial increase of 178.89%, with significant orders for polysilicon and silicon nitride polishing liquids [2] Display Materials Business - The display materials segment, including YPI, PSPI, and TFE-INK, generated 402 million yuan, a 131% increase, establishing the company as a primary supplier for major domestic panel manufacturers [2] - The company has initiated production of a 1,000-ton PSPI production line and plans to complete the second phase of the YPI project by 2025 [2] Advanced Packaging and Photoresist Business - Dinglong received its first orders for semiconductor packaging PI and temporary bonding adhesive products, generating 544,000 yuan in sales [3] - The company has successfully secured orders for high-end wafer photoresist products from major domestic wafer manufacturers [2][3] Printing Consumables Business - The printing consumables segment maintained stable operations, achieving sales of 1.79 billion yuan in 2024, consistent with the previous year [4] - Sales of color toner exceeded 2,000 tons for the first time, and revenue from drum units increased year-on-year [4] Financing and Future Projects - The company has received approval for a convertible bond issuance to raise up to 910 million yuan, aimed at funding various projects including the industrialization of photoresist products [3]
半导体业务驱动 鼎龙股份2024年实现营收净利双增长
Zheng Quan Shi Bao Wang· 2025-04-28 14:25
Group 1 - The core viewpoint of the articles highlights the significant growth in Dinglong Co., Ltd.'s revenue and net profit for the year 2024, driven primarily by its semiconductor materials business [1] - The company achieved an operating income of 3.338 billion yuan in 2024, representing a year-on-year increase of 25.14%, and a net profit attributable to shareholders of 521 million yuan, up 134.54% [1] - In Q4 2024, the company reported an operating income of 912 million yuan, with a year-on-year growth of 14.76%, and a net profit of 144 million yuan, reflecting a substantial increase of 215.57% [1] Group 2 - The semiconductor segment, including semiconductor materials and integrated circuit chip design and application, has become a key driver of the company's performance, generating 1.52 billion yuan in revenue, a year-on-year increase of 77.40% [1] - CMP polishing pad sales reached 716 million yuan in 2024, marking a growth of 71.51%, with record monthly sales of over 20,000 and 30,000 units achieved in May and September respectively [2] - The CMP polishing liquid and cleaning liquid business generated 215 million yuan in revenue, up 178.89%, while the semiconductor display materials segment achieved 402 million yuan, reflecting a growth of 131.12% [2] Group 3 - In the high-end wafer photoresist sector, the company secured orders from major domestic wafer manufacturers for its immersion ArF and KrF photoresist products, with 12 out of 20 developed products undergoing client validation [2] - The company has also entered the advanced packaging materials market, obtaining its first orders for semiconductor packaging PI and temporary bonding adhesive, generating sales of 544,000 yuan [3] - Recent changes in tariff policies and international trade dynamics may enhance domestic semiconductor industry self-sufficiency, potentially benefiting the company by expanding its customer base and market share [3]