Summary of Dinglong Co., Ltd. Conference Call Company Overview - **Company**: Dinglong Co., Ltd. - **Industry**: Semiconductor materials and advanced packaging materials Key Financial Metrics - **Q3 Revenue**: 9.67 billion CNY, up 6.57% YoY [2][3] - **Net Profit**: 2.08 billion CNY, up 22% QoQ and 31.48% YoY [2][3] - **Operating Cash Flow**: 7.7 billion CNY, up 26.55% YoY [7] - **R&D Investment**: 3.89 billion CNY, up 16% YoY, accounting for 14.41% of total revenue [7] Core Product Performance - **Core Products**: CMP polishing pads, polishing liquids, cleaning liquids, and flexible display materials all grew over 50% YoY [2][9] - **Polishing Pad Revenue**: Expected to exceed 11 billion CNY this year, with a growth rate of no less than 20% next year [10] Business Development and Strategy - **High-end Wafer Photoresist and Advanced Packaging**: Currently in incubation stage, not yet profitable, but significant R&D investment ongoing [4][12] - **Production Capacity Plans**: Aiming to increase polishing pad production capacity to 50,000 units per month by Q1 2026 [5][18] - **Market Position**: Domestic polishing pad market share is close to 25%, with a projected market size of at least 40 billion CNY [21] Industry Outlook - **Semiconductor and OLED Display Growth**: Anticipated acceleration in downstream expansion by 2026, benefiting upstream material companies [9][10] - **Industry Utilization Rates**: OLED industry utilization rates are generally above 90% [10] Challenges and Risks - **Impact of Non-Product Factors**: Non-product related factors negatively impacted net profit by 1.04 billion CNY [6] - **Financial Costs**: Increased financial costs due to convertible bond issuance and rising loan interest [19][20] Future Goals - **Net Profit Target**: Management is confident in achieving a net profit target of 1 billion CNY by 2026 through structured management and market expansion [5][32] - **R&D Focus**: Continued emphasis on semiconductor materials, with a shift away from consumables [22][23] Recognition and Achievements - **National Recognition**: The flexible display business has entered the national key "little giant" category, enhancing credibility and market position [8] Investor Relations - **Communication Strategy**: Plans to enhance investor communication through video interactions and live Q&A sessions [36] This summary encapsulates the key points from Dinglong Co., Ltd.'s conference call, highlighting financial performance, product development, industry outlook, and strategic goals.

Core Viewpoint - The semiconductor business of Dinglong Co., Ltd. is driving significant profit growth, with projected net profit for the first three quarters of 2025 estimated at approximately 5.01-5.31 billion yuan, indicating a strong upward trend in profitability [1] Financial Performance - The net profit for the third quarter is expected to be around 1.9-2.2 billion yuan, reflecting a quarter-on-quarter growth of 11.73%-29.37% and a year-on-year growth of 19.89%-38.82% [1] Business Development - The company is the only domestic supplier fully mastering the core R&D technology and production process of CMP polishing pads, establishing itself as a leading domestic supplier in this field [1] - The deepening market penetration of CMP polishing liquids and cleaning liquids, along with the growth in new product orders, is expected to inject new momentum into annual sales revenue [1] - The semiconductor display materials are maintaining a high growth trend, and the high-end wafer photoresist business is progressing rapidly [1] - The semiconductor packaging PI and temporary bonding adhesives are poised for growth [1] Investment Rating - The company maintains a "buy" rating based on its strong market position and growth prospects in the semiconductor sector [1]

Core Viewpoint - Dinglong Co., Ltd. achieved a net profit attributable to shareholders of approximately 310 million yuan in the first half of 2025, representing a year-on-year increase of about 42.8% [1] - The company’s Q2 net profit attributable to shareholders was approximately 170 million yuan, showing a year-on-year growth of about 24.8% and a quarter-on-quarter increase of about 20.6% [1] Group 1: Financial Performance - The significant improvement in profitability is attributed to the rising prosperity of the semiconductor industry, with deeper penetration among downstream wafer and display panel manufacturers [1] - The scale of the company's semiconductor materials business has expanded, and the product structure continues to optimize [1] - Continuous cost reduction and efficiency improvement measures have been implemented by the company [1] Group 2: Product Development and Market Recognition - The company successfully achieved its first order for copper polishing liquid during the reporting period, and the combination of polysilicon polishing liquid and cleaning liquid has gained technical recognition and orders from major domestic logic wafer manufacturers [1] - The company has laid out seven types of packaging PI products, with two products already receiving orders from three customers [1] - The temporary bonding adhesive continues to maintain stable shipment volumes among existing customers [1]

Core Viewpoint - Dinglong Co., Ltd. is focusing on the semiconductor advanced packaging materials sector, particularly on products with low self-sufficiency, high technical difficulty, and significant future growth potential [1] Group 1: Product Focus - The company is currently developing two main types of products: semiconductor packaging PI and temporary bonding adhesives [1] - By the first half of 2025, the number of available models and customer coverage for semiconductor packaging PI is expected to increase, driving accelerated order growth [1] - The temporary bonding adhesives are maintaining stable shipment volumes with existing customers [1]

Core Viewpoint - Dinglong Co., Ltd. is focusing on the semiconductor advanced packaging materials sector, particularly on products with low self-sufficiency, high technical difficulty, and significant future growth potential [1] Group 1: Product Focus - The company is currently developing two main product categories: semiconductor packaging PI and temporary bonding adhesives [1] - By the first half of 2025, the number of available models and customer coverage for semiconductor packaging PI is expected to increase, driving accelerated order growth [1] - Temporary bonding adhesives are maintaining stable shipment volumes with existing customers [1]

Core Viewpoint - The company is actively engaging with investors regarding its semiconductor and printing consumables businesses, showcasing significant revenue growth and R&D investments in these sectors [1] Group 1: Financial Performance - In the first half of 2025, the company achieved a revenue of 1.732 billion yuan, representing a year-on-year growth of 14% [1] - The semiconductor segment generated a main business revenue of 943 million yuan, with a remarkable year-on-year increase of 48.64%, accounting for 54.75% of total revenue [1] - The printing consumables business reported a revenue of 779 million yuan [1] Group 2: Research and Development - The company invested 462 million yuan in R&D in 2024, with 250 million yuan allocated in the first half of 2025, marking a year-on-year increase of 13.92%, which is 14.41% of total revenue [1] - The company has developed a range of CMP polishing pads, including hard and soft pads, with strong supply chain management and production process improvements [1][2] Group 3: Product Development and Sales - In the first half of 2025, sales revenue from semiconductor display materials reached 271 million yuan, showing a year-on-year growth of 61.90% [3] - The company is advancing its high-end wafer photoresist business with nearly 30 products in development, over 15 samples sent, and more than 10 products in gallon sample testing [3] - The semiconductor advanced packaging materials segment is seeing accelerated order growth for semiconductor packaging PI and stable shipments of temporary bonding adhesives [3] Group 4: Intellectual Property - As of June 30, 2025, the company holds a total of 1,301 patents, including 1,052 granted patents, and continues to enhance its patent database [4]

Core Viewpoint - The report from Zhongyin Securities indicates that Dinglong Co., Ltd. achieved a net profit attributable to shareholders of 311 million yuan in the first half of 2025, representing a year-on-year increase of 42.78% [1] Financial Performance - In Q2 2025, the company realized a net profit attributable to shareholders of 170 million yuan, which is a year-on-year increase of 24.79% and a quarter-on-quarter increase of 20.61% [1] - The growth in the company's performance is primarily attributed to the sustained revenue and profit growth in the semiconductor business, as well as ongoing cost reduction and efficiency improvement efforts [1] Business Development - The new high-end wafer photoresist business is still in the investment phase, impacting the net profit attributable to shareholders by 33.76 million yuan [1] - The company has strengthened its market development efforts and resource allocation in the semiconductor business, leading to an increase in the number of product samples sent to clients, validation, and order acquisition [1] - Related expenses have increased year-on-year, which has somewhat affected the net profit level for H1 2025, but this supports further penetration of the company's semiconductor materials products in H2 2025 [1] Product Progress - The high-end wafer photoresist and advanced semiconductor packaging materials businesses are progressing smoothly [1] - In the temporary bonding adhesive segment, the company is maintaining stable shipment volumes with existing clients [1] - The outlook for the company's semiconductor business is positive, and a "buy" rating is maintained [1]

Investment Rating - The report maintains an "Accumulate" rating for the electronic industry, indicating a positive outlook for the sector over the next six months [1]. Core Insights - The advanced packaging sector is crucial for the development of domestic computing power, with significant growth expected due to rising demand for advanced packaging technologies such as CoWoS and Fan-out [4]. - The report highlights the strong performance of ASMPT in Q2, driven by robust demand in China, with a 50% year-on-year increase in TCB orders, indicating a recovery in domestic advanced packaging demand [4]. - The report suggests that domestic computing power is likely to replicate the rapid growth seen in overseas markets, particularly in AI applications, positioning advanced packaging as a foundational element for this growth [4]. Summary by Sections Industry Trends - The report notes a projected increase in the electronic industry, with a focus on advanced packaging technologies that are essential for GPU, CPU, and base station applications [4]. - The importance of domestic advanced packaging supply is emphasized, especially in light of constraints in Taiwan's advanced packaging capacity [4]. Investment Recommendations - The report recommends focusing on leading companies in advanced packaging, including Shenghe Jingwei, Changdian Technology, Tongfu Microelectronics, and Yongxi Electronics, as well as materials and equipment suppliers like Qiangli New Materials and Jingzhida [4].

Core Insights - The semiconductor sector is projected to contribute 45.54% to total revenue in 2024, with a continuous improvement in gross margin, which reached a recent high with a quarter-on-quarter increase of 0.8 percentage points in Q1 2025 [1][2]. Financial Performance - In 2024, the company achieved a revenue of 3.338 billion yuan, representing a year-on-year increase of 25.14%, with a net profit attributable to shareholders of 469 million yuan, up 185.26% year-on-year [2]. - The gross margin for 2024 was 46.88%, an increase of 9.93 percentage points year-on-year. In Q1 2025, revenue was 824 million yuan, a year-on-year increase of 16.37%, with a net profit of 135 million yuan, up 104.84% year-on-year, and a gross margin of 48.82%, marking a recent high [2][3]. Business Segment Growth - The semiconductor business segment saw a revenue of 1.52 billion yuan in 2024, a year-on-year increase of 77.40%, accounting for 45.54% of total revenue. Key contributors included: - CMP polishing pads with revenue of 716 million yuan, up 71.51% year-on-year, achieving a historical monthly sales high of 30,000 pieces in September 2024 [3]. - CMP polishing liquids and cleaning liquids with revenue of 215 million yuan, up 178.89% year-on-year [3]. - Semiconductor display materials with revenue of 402 million yuan, up 131.12% year-on-year, with increased market share for TFE-INK products [3]. R&D and New Product Development - The company invested 462 million yuan in R&D in 2024, a year-on-year increase of 21.01%, focusing on CMP polishing liquids, high-end wafer photoresists, advanced packaging materials, and new chip areas [3]. - The company has developed over 20 high-end wafer photoresists, with 12 samples sent for client verification, and 7 products entering the gallon sample stage [3]. - In semiconductor packaging, 7 products have been developed, with 6 sent for verification, and 1 product has received its first bulk order [3].

Core Insights - Dinglong Co., Ltd. reported significant growth in Q1 2025, with revenue of 824 million yuan, up 16.37% year-on-year, and a net profit of 141 million yuan, up 72.84% [1] - The company achieved a total revenue of 3.338 billion yuan in 2024, a 25.14% increase, and a net profit of 521 million yuan, up 134.54% [1] - Dinglong's profitability has notably improved, driven by breakthroughs in CMP polishing materials and display materials, alongside stable performance in printing consumables [1] Semiconductor Materials Business - In 2024, the semiconductor materials segment generated 1.52 billion yuan in revenue, a 77.40% increase, contributing significantly to overall revenue [1] - CMP polishing pad revenue reached 716 million yuan, up 71.51%, with monthly sales surpassing 30,000 pieces by September [1] - The company has expanded its production capacity for polishing pads, achieving a monthly output of approximately 40,000 pieces by Q1 2025 [1] Polishing Liquids and Cleaning Liquids - Revenue from polishing and cleaning liquids was 215 million yuan, marking a substantial increase of 178.89%, with significant orders for polysilicon and silicon nitride polishing liquids [2] Display Materials Business - The display materials segment, including YPI, PSPI, and TFE-INK, generated 402 million yuan, a 131% increase, establishing the company as a primary supplier for major domestic panel manufacturers [2] - The company has initiated production of a 1,000-ton PSPI production line and plans to complete the second phase of the YPI project by 2025 [2] Advanced Packaging and Photoresist Business - Dinglong received its first orders for semiconductor packaging PI and temporary bonding adhesive products, generating 544,000 yuan in sales [3] - The company has successfully secured orders for high-end wafer photoresist products from major domestic wafer manufacturers [2][3] Printing Consumables Business - The printing consumables segment maintained stable operations, achieving sales of 1.79 billion yuan in 2024, consistent with the previous year [4] - Sales of color toner exceeded 2,000 tons for the first time, and revenue from drum units increased year-on-year [4] Financing and Future Projects - The company has received approval for a convertible bond issuance to raise up to 910 million yuan, aimed at funding various projects including the industrialization of photoresist products [3]