内容概要：激光热处理设备是一种利用高能量激光束对材料表面进行快速加热和冷却，从而改变其表面 性能的先进加工技术。随着半导体制造工艺持续迭代，激光热处理设备逐渐成为先进半导体制造的必要 投资。目前，中国热处理设备市场，激光工艺技术路径渗透率达到16.01%，低于全球的平均水平 25.89%，我国热处理设备市场发展空间较大。2024年中国热处理半导体设备市场规模已达14.87亿美 元，较2023年增长26.14%。随着半导体制造工艺持续迭代，激光热处理设备逐渐成为先进半导体制造 的必要投资。近年来，中国激光热处理设备市场规模稳定增长。2024年中国激光热处理设备市场规模约 15.19亿美元，预计2025年约为17.28亿美元，2030年有望达到32.96亿元。 上市企业：应用材料[AMAT] 相关企业：华卓精科、上海微电子、莱普科技、维易科、住友重工、迪恩士、 DigitalImagingTechnology,Inc.（DIT）、伊欧激光（EOTechnics） 关键词：激光热处理设备行业政策、激光热处理设备行业产业链、激光热处理设备市场规模、激光热处 理设备市场竞争格局、激光热处理设备行业发展趋势 一、激光热处 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 半导体激光设备概述 激光凭借高能量密度、非接触加工以及对材料适应性强等优势，被广泛应用于消费电子、汽车制 造、新能源和半导体产业链等领域。随着半导体制造和封装工艺的发展，激光设备在半导体行业中 发挥越来越重要的作用。近年来，随着下游行业对轻量化、精密化和智能化需求的不断增加，半导 体激光加工设备正加快迭代升级。从传统的二极管泵浦到光纤耦合、超快激光技术，设备在功率稳 定性、加工精度和能耗表现上均显著提升。与此同时，国产厂商也在技术突破和成本控制方面不断 追赶，逐步缩小与国际领先企业的差距。可以预见，未来半导体激光设备将不仅是单一制造环节的 工具，而是成为驱动制造业转型升级的重要引擎。在新兴产业快速发展的背景下，其市场需求有望 持续扩大，带动产业链迎来新的增长机遇。 目前根据应用原理和应用工艺环节的不同，可将半导体激光设备分为应用于前道制程的激光退火设 备、激光材料改性设备和应用于硅片和后道制程的激光打标设备、激光划片设备、解键合设备和修 边（Trimming）设备等。 1.1 激光退火设备 半导体激光退火设备是一种半导体制造工艺中的关键设备，主要用于对半导体晶圆进行退 ...

Group 1: Overview of Semiconductor Laser Equipment - Laser technology is widely used in consumer electronics, automotive manufacturing, new energy, and semiconductor industries due to its high energy density and adaptability to materials [2] - The demand for semiconductor laser processing equipment is expected to grow as industries seek lightweight, precise, and intelligent solutions [2] - Domestic manufacturers are making technological breakthroughs and improving cost control, gradually closing the gap with international leaders [2] Group 2: Types of Semiconductor Laser Equipment - Semiconductor laser annealing equipment is crucial for repairing lattice damage in semiconductor wafers and enhancing device performance [3] - Laser material modification equipment alters the surface structure and properties of materials, with applications in 3D NAND chip manufacturing [4] - Laser scribing equipment is used to cut semiconductor chips from wafers, impacting packaging quality and production costs [7] - Laser debonding equipment enables low-stress separation processes without chemicals, crucial for advanced packaging applications [8] - Laser marking equipment is utilized for labeling silicon wafers and chips, facilitating tracking and identification [9] - Other laser processing equipment includes laser trimming, glue removal, and laser drilling, which are essential in various semiconductor manufacturing stages [10] Group 3: Semiconductor Market Situation - The global semiconductor market is projected to reach $627.2 billion in 2024, driven by AI computing demand and recovering memory chip prices [14] - The semiconductor manufacturing equipment market is expected to grow to $125.5 billion by 2025, with significant contributions from advanced logic and memory applications [16] - China's semiconductor market is anticipated to reach $186.5 billion in 2024, accounting for 31.9% of the global market, driven by domestic demand and policy support [21] Group 4: Domestic Semiconductor Equipment Market - The domestic semiconductor equipment market is expected to grow significantly, with a projected market size of approximately 289.9 billion yuan by 2025 [23] - The demand for laser equipment in wafer manufacturing is expected to rise due to the expansion of domestic production lines and the adoption of advanced processes [40] - The growth of AI applications is driving the demand for advanced packaging equipment in China, with the packaging equipment market expected to reach 17.396 billion yuan by 2025 [29] Group 5: Key Domestic Companies - LaiPu Technology focuses on semiconductor laser equipment and has a market share of 16% in laser thermal processing equipment, with over 90% in advanced 3D NAND and DRAM laser equipment [56] - Huagong Laser specializes in laser intelligent equipment and has developed solutions covering the entire semiconductor manufacturing process [57] - Shanghai Microelectronics is emerging in the laser annealing equipment market, particularly in ultra-thin silicon wafer applications [58] - Dazhong Laser has a strong presence in various semiconductor segments, including traditional packaging and advanced processes [59] - Beijing Huazhuo Precision Technology is recognized for its high-quality laser annealing equipment and precision control technology [60]