【事件/资讯】 7、由上海微电子分拆，上海芯上微装科技股份有限公司亮相2025湾区半导体产业生态博览会，以宣传资料形式，展示其新型化合物半导体光刻机、激光退 火设备、晶圆先进封装量检测设备、晶圆先进封装光刻机以及键合设备方案。 8、华为正式发布以AI-Centric全面升级的AI WAN解决方案，通过重新定义体验感知、重新定义算网极限、重新定义安全韧性、重新定义运维模式，助力运 营商有效突破增长瓶颈、开拓新的市场空间。 【机构解读】 1、近期科技权重股进入调整，这是强势股补跌现象，是市场平台整理期进入后期的特征之一。那么随着震荡期进入末端，在强势股补跌的同时，中小盘有 望率先企稳。因此，10月份可把握科技中小盘的震荡布局期，根据景气和催化剂，潜在方向有：包含软件和硬件的AI应用、国产算力的扩散等。 2、海外算力产业链高景气度依旧，并未受到DeepSeek和贸易摩擦的冲击，反而相关产业链的基本面共振更强。国内方面，后续伴随着DeepSeekR2/V4等以 及包括Agent、多模态方面相关进展，AI行业以及围绕AIDC产业链的将持续高景气。 截至2025年10月16日 09:50，上证科创板人工智能指数上涨0.0 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容 来源：综合自网络 。 近日，双方宣布已达成最终协议，将以全股票形式进行合并。根据Axcelis和Veeco截至2025年9月30 日的收盘价以及截至2025年6月30日的未偿债务，合并后公司的企业价值预计约为44亿美元。 Axcelis 和 Veeco 合并后将成为一家领先的半导体设备公司，服务于互补、多元化且不断扩展的终端 市场。合并后的公司将拥有极具吸引力的运营状况、强大的研发创新引擎和更丰富的产品组合，并有 机会实现成本和收入协同效应。按 2024 财年的预测，合并后公司的收入为 17 亿美元，非公认会计 准则毛利率为 44%，调整后息税折旧摊销前利润 (EBITDA) 为 3.87 亿美元。这些预测数据并未反映 合并后的预期协同效应。 根据协议条款，Veeco 股东每持有一股 Veeco 股票将获得 0.3575 股 Axcelis 股票。交易完成后， Axcelis 股东预计将持有合并后公司约 58% 的股份，Veeco 股东预计将持有合并后公司约 42% 的股 份（按完全稀释后计算）。合并协议已获得两家公司董事会的一致批准。 Axce ...

Core Viewpoint - The article discusses the rapid growth and technological advancements in the HBM (High Bandwidth Memory) market, particularly focusing on the TCB (Thermal Compression Bonding) equipment that is crucial for HBM production. The demand for HBM is driven by the surge in AI applications and high-performance computing, with significant market players like SK Hynix and Micron investing heavily in TCB technology to enhance their production capabilities [2][4][21]. Summary by Sections HBM Market Dynamics - HBM is becoming one of the hottest products in the semiconductor industry due to the increasing demand from AI and high-performance computing sectors. SK Hynix holds a dominant 70% market share in HBM, benefiting significantly from this trend [2]. - The TCB bonding machine is pivotal in determining the upper limits of the HBM supply chain, prompting major players like SK Hynix and Micron to increase their investments in this technology [2][4]. TCB Technology Overview - TCB technology addresses challenges faced by traditional flip-chip bonding methods, particularly as interconnect densities increase and spacing decreases. TCB allows for localized heating, reducing thermal stress and improving interconnect quality [3][4]. - TCB processes operate at temperatures between 150ºC and 300ºC, with pressures ranging from 10 to 200 MPa, allowing for higher contact densities compared to traditional methods [4]. Market Leaders and Competition - The TCB bonding machine market is currently dominated by six key players, with Hanmi Semiconductor leading in market share. Hanmi has seen a 639% increase in operating profit, reaching 255.4 billion KRW, largely due to its partnership with SK Hynix [7][8]. - Hanmi Semiconductor has diversified its client base beyond SK Hynix, securing significant orders from Micron, indicating a potential reduction in reliance on a single customer [8][9]. Emerging Competitors - Hanwha SemiTech, a newer player in the market, has begun supplying TCB machines to SK Hynix, raising concerns for Hanmi Semiconductor regarding competition and potential patent disputes [10][11]. - ASMPT from Singapore is also gaining traction, with SK Hynix reportedly testing their TCB machines for advanced HBM products, highlighting the competitive landscape [12][13]. Technological Innovations - The article notes the introduction of new bonding technologies, such as non-conductive film (NCF) and MR-MUF, which are being adopted by major manufacturers to enhance production efficiency and thermal conductivity [5][6]. - The shift towards TCB technology is expected to drive the market size from 461 million USD in 2024 to 1.5 billion USD by 2027, indicating a significant growth trajectory [5]. Future Outlook - The article concludes that while Hanmi Semiconductor currently dominates the TCB market, the competitive landscape is evolving with new entrants and technological advancements. The future of the HBM market will largely depend on the strategic choices made by leading companies like SK Hynix [21][29].

Core Insights - The profits of South Korean wafer fabrication equipment manufacturers significantly increased last year, driven by high bandwidth memory (HBM) and advanced packaging technologies [1] Group 1: Revenue Growth - Hanmi Semiconductor reported the highest year-on-year revenue growth at 638.15%, followed by Techwing at 631.25%, and Zeus at 592.96% [1] - The revenue of Hanmi Semiconductor reached 558.9 billion KRW, with an operating profit of 255.4 billion KRW [1] Group 2: Key Suppliers and Clients - Hanmi Semiconductor is the primary supplier of thermal compression (TC) bonders for HBM production to SK Hynix, the largest HBM supplier globally [2] - Techwing's revenue was 185.5 billion KRW, with an operating profit of 23.4 billion KRW, serving major clients like SK Hynix, Kioxia, and Micron [2] - Zeus generated revenue of 490.8 billion KRW, with an operating income of 49.2 billion KRW, supplying TSV cleaning machines to Samsung and SK Hynix [3] Group 3: Market Dynamics - Jusung Engineering's revenue was 409.4 billion KRW, with 85% coming from China, indicating a strong demand in the Chinese market despite potential risks from the US-China trade war [3] - DIT reported revenue of 116.7 billion KRW, with 59% of its income derived from laser solutions, primarily serving SK Hynix [3] Group 4: New Developments - Auros Technology's revenue was 61.4 billion KRW, and it began supplying overlay measurement equipment to Kioxia in mid-2024 [4]