作为国内智能卡行业领军企业，澄天伟业已实现从芯片应用研发、模块封测、智能卡产销研到终端应用 全产业链覆盖，成为业内首家一站式服务商。报告期内，毛率较高的智能卡一站式服务订单占比提升。 此外，公司持续深化与四大运营商的战略合作，依托在功能集成、数据安全、增值服务等方面的优势， 寻求突破传统智能卡业务瓶颈，积极拓展超级SIM卡创新应用场景。 当前，全球智能卡市场迎来结构性增长机遇，东南亚、中东、非洲等地区具备较大增长潜力。作为国内 智能卡企业中较早实现全球布局的公司，澄天伟业具有成熟的海外市场管理与交付经验，与国际头部企 业建立合作关系。 依托于在数字信息安全领域多年行业沉淀，澄天伟业进一步实施"延伸产业链、拓展新领域"的发展战 略，半导体封装材料与数字能源热管理业务成为新的增长动力。 本报讯 （记者王镜茹）8月26日晚，深圳市澄天伟业科技股份有限公司（以下简称"澄天伟业"）披露 2025年上半年业绩。上半年公司在智能卡业务保持稳健增长的同时，积极拓展半导体封装材料、数字与 能源热管理等新兴领域，展现出良好的创新活力和战略推进能力。 报告期内，澄天伟业营业收入2.10亿元，同比增长32.91%；归属于上市公司股东 ...

报告显示，澄天伟业实现从芯片应用研发、模块封测、智能卡产销研到终端应用全产业链覆盖。报告期 内，毛利率较高的智能卡一站式服务订单占比提升。公司表示，全球智能卡市场迎来结构性增长机遇， 东南亚、中东、非洲等地区具备较大增长潜力。作为国内智能卡企业中较早实现全球布局的公司，澄天 伟业具有成熟的海外市场管理与交付经验，与国际头部企业如THALES、IDEMIA建立长期合作关系， 产品外销长期占比超过60%。 依托于在数字信息安全领域多年行业沉淀，澄天伟业实施"延伸产业链、拓展新领域"的发展战略，半导 体封装材料与数字能源热管理业务成为新的增长动力。报告中提到，今年上半年，公司半导体封装材料 订单同比增长145.28%。公司已完成铜针式散热底板的技术研发与产线建设，产品结构正从单管类器件 封装，向满足新能源汽车、充电桩、AI等高需求的IGBT与SiC功率模块封装材料升级，顺应行业高性 能、高可靠性趋势。此外，在数字与能源热管理板块，公司自主研发的液冷板在结构一体化、导热效率 和耐压性能方面具备竞争优势，相关产品主要面向AI服务器、高性能计算等高散热需求场景，已通过 多轮技术验证，并获得部分客户的样品测试认证。 中证报 ...

8月26日晚间，澄天伟业（300689.SZ）披露2025年半年度报告，业绩表现亮眼。公司在智能卡业务保持 稳健增长的同时，积极拓展半导体封装材料、数字与能源热管理等新兴领域，展现出良好的创新活力和 战略推进能力。 业绩实现跨越增长，盈利水平显著提升 报告期内，澄天伟业营业收入达2.10亿元，同比增长32.91%；归属于上市公司股东的净利润为1087.64 万元，同比大幅上升562.05%；扣非后净利润也实现扭亏为盈，同比增长387.93%，多项指标增速明 显。业绩增长主要得益于产品结构持续优化与销售规模扩大。 2025年上半年，公司半导体封装材料订单同比增长145.28%。 具备较强竞争优势，结合当前市场需求持 续旺盛及客户的高度认可，将持续为公司经营业绩提供重要支撑。 另外，公司已完成铜针式散热底板的技术研发与产线建设，产品结构正从单管类器件封装，向满足新能 源汽车、充电桩、AI等高需求的IGBT与SiC功率模块封装材料升级，顺应行业高性能、高可靠性趋势。 在数字与能源热管理板块，公司自主研发的液冷板突破传统冷板式套件的物理限制，在结构一体化、导 热效率和耐压性能方面具备竞争优势，与传统工艺相比，产品生产 ...

8月26日晚间，澄天伟业（300689）(300689.SZ)披露2025年半年度报告，业绩表现亮眼。公司在智能卡 业务保持稳健增长的同时，积极拓展半导体封装材料、数字与能源热管理等新兴领域，展现出良好的创 新活力和战略推进能力。 业绩实现跨越增长，盈利水平显著提升 报告期内，澄天伟业营业收入达2.10亿元，同比增长32.91%；归属于上市公司股东的净利润为1087.64 万元，同比大幅上升562.05%；扣非后净利润也实现扭亏为盈，同比增长387.93%，多项指标增速明 显。业绩增长主要得益于产品结构持续优化与销售规模扩大。 智能卡基本盘稳固，全产业链优势显著 作为国内智能卡行业领军企业，澄天伟业已实现从芯片应用研发、模块封测、智能卡产销研到终端应用 全产业链覆盖，成为业内首家一站式服务商，报告期内，毛利率较高的智能卡一站式服务订单占比提 升。此外，公司持续深化与四大运营商的战略合作，依托在功能集成、数据安全、增值服务等方面的优 势，寻求突破传统智能卡业务瓶颈，积极拓展超级SIM卡创新应用场景。 当前，全球智能卡市场迎来结构性增长机遇，东南亚、中东、非洲等地区具备较大增长潜力。作为国内 智能卡企业中较早实现 ...

8月26日晚间，澄天伟业（300689）（300689.SZ）披露2025年半年度报告，业绩表现亮眼。公司在智能 卡业务保持稳健增长的同时，积极拓展半导体封装材料、数字与能源热管理等新兴领域，展现出良好的 创新活力和战略推进能力。 业绩实现跨越增长，盈利水平显著提升 报告期内，澄天伟业营业收入达2.10亿元，同比增长32.91%；归属于上市公司股东的净利润为1087.64 万元，同比大幅上升562.05%；扣非后净利润也实现扭亏为盈，同比增长387.93%，多项指标增速明 显。业绩增长主要得益于产品结构持续优化与销售规模扩大。 智能卡基本盘稳固，全产业链优势显著 作为国内智能卡行业领军企业，澄天伟业已实现从芯片应用研发、模块封测、智能卡产销研到终端应用 全产业链覆盖，成为业内首家一站式服务商，报告期内，毛率较高的智能卡一站式服务订单占比提升。 此外，公司持续深化与四大运营商的战略合作，依托在功能集成、数据安全、增值服务等方面的优势， 寻求突破传统智能卡业务瓶颈，积极拓展超级SIM卡创新应用场景。 2025年上半年，公司半导体封装材料订单同比增长145.28%，具备较强竞争优势，结合当前市场需求持 续旺盛及客户 ...

Group 1: Company Overview and R&D Investment - The company positions technological innovation as its core competitiveness, maintaining a certain proportion of investment in basic research and core technologies based on business development needs [1] - R&D investment has shown a declining trend over the past three years, with future allocations to be dynamically optimized based on market feedback, technological advancements, and financial conditions [1][2] Group 2: Semiconductor Business - The semiconductor product capacity utilization rate is currently low, with revenue primarily dependent on smart card business; future plans include increasing capacity utilization and revenue from semiconductor packaging materials [2] - In 2024, semiconductor and packaging materials are expected to account for approximately 10% of total revenue, with significant revenue growth anticipated in Q1 2025 [2] Group 3: Profitability and Market Strategy - Different semiconductor products exhibit varying gross profit margins, with lead frames around 20% and copper bases reaching 20%-30% [2] - The company aims to promote high-performance products like copper needle-type heat dissipation bases to leading power module clients, adjusting order volumes based on client project timelines [2] Group 4: Smart Safety and Super SIM Card Business - The smart safety business focuses on digital information security, targeting transportation safety applications with multiple patents and a high industry entry barrier [3] - The super SIM card business leverages long-term experience in smart cards, showing advantages in speed, convenience, and system integration, with stable partnerships established with major domestic operators [4][5] Group 5: Liquid Cooling Technology - The liquid cooling products utilize self-developed high-performance manufacturing processes, showing advantages in structure integration, thermal conductivity, and pressure resistance [5] - The company is preparing for mass production of liquid cooling products, with market demand driven by AI servers and high-performance computing [6][7] Group 6: Future Plans and Market Position - The company plans to continue optimizing product structure based on market demand, focusing on semiconductor packaging materials, digital and energy thermal management, and smart safety technologies for new growth points [10] - Future liquid cooling business will explore chip-level thermal management solutions, aiming for deep applications in high-performance computing and advanced packaging [9][10] Group 7: Risk Management - The company acknowledges potential technical, market, and application validation risks in new business and product development, emphasizing the importance of timely information disclosure in compliance with legal regulations [10]

Group 1: Business Growth and Innovation - The company is focusing on semiconductor packaging materials, specifically lead frames and copper pin heat sink substrates, to enhance material performance and reduce packaging costs, targeting applications in power devices and third-generation semiconductors [1][2][15]. - The development of modular and customized liquid cooling solutions is underway, aimed at AI servers and high-density data centers, currently in the R&D verification stage [1][2][6]. - The company is expanding its smart security business, with ongoing R&D and testing for products like smart security checks and protective barriers [1][2][15]. Group 2: Financial Performance - In 2024, the company reported a revenue of 360.19 million CNY, a decrease of 8.65% year-on-year, while net profit attributable to shareholders increased by 29.77% to 11.57 million CNY [3][5][11]. - Revenue from lead frame products surged by 467.80% in 2024, with a further increase of 236.78% in Q1 2025 [2][4][11]. - The smart card business, a core revenue source, saw a decline of 12.62% in revenue, while semiconductor product revenue dropped by 91.99% [3][4][11]. Group 3: Market Trends and Risks - The lead frame market is experiencing robust growth, driven by demand in electric vehicle control systems and high-performance power modules [2][3][4]. - The company acknowledges risks in new product development, including technical, market, and application validation risks, urging investors to make informed decisions [2][6][15]. - The shift towards high-end specifications in lead frames is evident, with increasing customer demands for high thermal conductivity and low thermal resistance [2][3][4]. Group 4: Strategic Planning and Future Directions - The company aims to diversify its revenue streams by investing in semiconductor packaging materials, digital and energy thermal management, and innovative applications for super SIM cards [1][2][15][20]. - Future growth points are identified in the semiconductor packaging sector, with a focus on self-designed and mass-produced products covering various power module needs [1][2][15]. - The company plans to maintain a balance between traditional smart card business and emerging sectors, ensuring stable growth while fostering new business opportunities [1][15][20].