Core Viewpoint - The company showcased innovative AI technologies at the 2025 World Artificial Intelligence Conference, including the "Infinite Scanning" technology for high-definition imaging and upgraded AI authentication technology to address information security challenges in the digital age [1][2]. Group 1: Infinite Scanning Technology - The "Infinite Scanning" technology addresses challenges in high-definition recording of large cultural relics, overcoming issues such as incomplete images and distortion, which traditional image stitching tools struggle to resolve [1]. - This technology allows users to capture large images, such as a 3.85m by 1.71m replica of "Kunyu Wanguo Quantu," by simply moving their smartphones, with AI automatically optimizing and stitching the images into a complete high-definition picture [1][2]. - AI can intelligently identify elements within the image, providing viewers with insights into historical perceptions of the world over 400 years ago [1]. Group 2: AI Authentication Technology - The upgraded AI authentication technology offers millisecond-level detection of multi-modal information, addressing issues like financial fraud and misinformation exacerbated by AI-generated content [2]. - The company employs incremental learning strategies to develop multi-layered detection solutions for video tampering, achieving over 90% accuracy in identifying images generated by mainstream models [2]. - This technology is designed to withstand attacks by analyzing visual features and perspective relationships, ensuring rapid and precise identification of manipulated content [2]. Group 3: Future Applications - The company emphasizes the importance of applying technological innovations in real-world scenarios, aiming to enhance the positive value of AI technologies in cultural heritage preservation and digital security [3].

Group 1 - The company, Chengtian Weiye (300689), has announced an increase in investment in digital and energy thermal management as well as smart security fields, based on developments in smart cards, semiconductors, and digital information security [1] - The company will fulfill its information disclosure obligations in a timely manner if there are significant advancements in these areas [1] - The company acknowledges that there are risks associated with the commercialization and industrialization of new technologies and products due to factors such as macroeconomic conditions, industry policies, and market environment changes [1]

Group 1: Company Overview and R&D Investment - The company positions technological innovation as its core competitiveness, maintaining a certain proportion of investment in basic research and core technologies based on business development needs [1] - R&D investment has shown a declining trend over the past three years, with future allocations to be dynamically optimized based on market feedback, technological advancements, and financial conditions [1][2] Group 2: Semiconductor Business - The semiconductor product capacity utilization rate is currently low, with revenue primarily dependent on smart card business; future plans include increasing capacity utilization and revenue from semiconductor packaging materials [2] - In 2024, semiconductor and packaging materials are expected to account for approximately 10% of total revenue, with significant revenue growth anticipated in Q1 2025 [2] Group 3: Profitability and Market Strategy - Different semiconductor products exhibit varying gross profit margins, with lead frames around 20% and copper bases reaching 20%-30% [2] - The company aims to promote high-performance products like copper needle-type heat dissipation bases to leading power module clients, adjusting order volumes based on client project timelines [2] Group 4: Smart Safety and Super SIM Card Business - The smart safety business focuses on digital information security, targeting transportation safety applications with multiple patents and a high industry entry barrier [3] - The super SIM card business leverages long-term experience in smart cards, showing advantages in speed, convenience, and system integration, with stable partnerships established with major domestic operators [4][5] Group 5: Liquid Cooling Technology - The liquid cooling products utilize self-developed high-performance manufacturing processes, showing advantages in structure integration, thermal conductivity, and pressure resistance [5] - The company is preparing for mass production of liquid cooling products, with market demand driven by AI servers and high-performance computing [6][7] Group 6: Future Plans and Market Position - The company plans to continue optimizing product structure based on market demand, focusing on semiconductor packaging materials, digital and energy thermal management, and smart safety technologies for new growth points [10] - Future liquid cooling business will explore chip-level thermal management solutions, aiming for deep applications in high-performance computing and advanced packaging [9][10] Group 7: Risk Management - The company acknowledges potential technical, market, and application validation risks in new business and product development, emphasizing the importance of timely information disclosure in compliance with legal regulations [10]