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【数字经济周报】TI低功耗Bluetooth? 6.0无线MCU通过Bluetooth SIG认证:数字经济动态事件速览第36期(2025.10.18-2025.10.24)-20251026
Semiconductor Sector Dynamics - TI's low-power Bluetooth® 6.0 wireless MCU has received Bluetooth SIG certification, marking it as the industry's first automotive-grade product series to achieve this milestone[5] - Jiangbolong has launched the industry's first integrated packaging mSSD, enhancing SSD application flexibility and user experience[7] - United Microelectronics Corporation (UMC) has introduced a 55nm BCD platform aimed at improving power efficiency and system integration for next-generation mobile devices and automotive applications[11] Automotive Electronics Sector Dynamics - LoBot has partnered with Swiss PostBus to launch the autonomous driving service "AmiGo" in Switzerland, with initial fleet testing planned for December 2025[14] - Pony.ai and BAIC New Energy have rolled out the 300th unit of the Alpha T5 Robotaxi, showcasing significant advancements in autonomous driving technology[16] - General Motors plans to introduce a "hands-free" autonomous driving system in the Cadillac Escalade IQ by 2028, utilizing a multi-sensor approach for enhanced safety[19] AI Sector Dynamics - Baichuan has released the M2 Plus medical model, significantly reducing the hallucination rate compared to general models, achieving a credibility level comparable to experienced clinicians[21] - RoboSense and ASENSING have formed a strategic partnership to develop multi-modal sensor fusion solutions for robotics, enhancing performance in complex environments[24] - Shengshu Technology has announced the open access of the Vidu Q2 API, enabling high-quality video content creation with emotional expressiveness for advertising and e-commerce[28] Metaverse Sector Dynamics - Samsung has officially launched the Galaxy XR headset, optimized for multi-modal AI, marking a significant step in its XR strategy[32] - Amazon is developing AI smart glasses for delivery drivers to enhance route planning and risk identification, improving service quality[35] - Unity has announced full support for Android XR development in Unity 6, facilitating the creation of immersive applications for the Galaxy XR headset[37] Risk Warnings - There are risks related to market competition in semiconductor, automotive electronics, AI, and metaverse sectors due to rapid growth and increased investment[38] - Potential technological advancements may not meet expectations, impacting overall sector development[39] - Market demand growth may fall short of expectations, affecting the expansion of emerging sectors[40]
计算机行业周报:国产化主线明晰:芯片与半导体产业迎来“热潮”-20251025
HUAXI Securities· 2025-10-25 13:54
Investment Rating - The industry rating is "Recommended" [3] Core Insights - The domestic chip and semiconductor industry is entering a new "explosion period" driven by external pressures and internal innovation, with significant breakthroughs in domestic chip and storage sectors [16][21][40] - A wave of semiconductor project implementations is expected across the country by October 2025, as the industry collectively pushes for self-sufficiency in response to external challenges [17][51] - The 20th Central Committee of the Communist Party of China emphasizes the creation of a new high-tech industry in the next decade, focusing on strategic emerging industries and future technologies [18][56] Summary by Sections 1. Domestic Chip and Storage Sector - Micron's decision to stop supplying server chips to Chinese data centers is expected to cause short-term supply chain fluctuations but will accelerate the domestic substitution process in the long run [16][21] - The global storage chip market is entering a "super cycle," with multiple manufacturers raising prices, potentially leading to further price increases [16][22] - Domestic breakthroughs include the launch of the first fully domestic general-purpose GPU, the Xiyun C600, and the introduction of the integrated packaging mSSD by Jiangbolong, marking a shift from traditional PCB design to chip-level integration [16][30][40] 2. Semiconductor Project Implementation - A collective push for self-sufficiency in the semiconductor industry is underway, with various projects set to launch across the country by October 2025 [17][51] - Key projects include a vertically integrated production line for laser radar in Dezhou, a large silicon wafer project in Zhengzhou, and a MEMS sensor production line in Bengbu [41][44][50] - The urgency for establishing a self-controlled semiconductor supply chain is driven by geopolitical pressures and the need for stable supply of critical chips and materials [17][51] 3. Future High-Tech Industry Development - The 20th Central Committee's meeting highlighted plans to cultivate strategic emerging industries such as new energy and materials, and to lay out future industries like quantum technology and biomanufacturing [18][54] - The focus will be on enhancing technological innovation as a core element of new productive forces, with a commitment to deepening the integration of technology and industry [18][56] - The government aims to increase high-quality technological supply and support the construction of a modern industrial system through strategic initiatives [18][56] 4. Investment Recommendations - Beneficiary companies in the semiconductor sector include North China Innovation, Zhongwei Company, and SMIC [19] - In the chip sector, recommended companies include Cambricon, Haiguang Information, and Longxin Zhongke [19] - For storage, companies such as Demingli, Kaipu Cloud, and Jiangbolong are highlighted as potential investment opportunities [19]
江波龙:集成封装mSSD已完成开发、测试 目前处于量产爬坡阶段
Xin Lang Cai Jing· 2025-10-20 07:36
Core Viewpoint - Jiangbolong has successfully developed and tested the integrated packaging mSSD, which is currently in the ramp-up phase for mass production [1] Group 1: Product Development - The integrated packaging mSSD (Micro SSD) has completed its development and testing phases [1] - The company has applied for relevant domestic and international technology patents for the mSSD [1] Group 2: Technical Features - The mSSD integrates controller chips, storage chips (Die), passive components (resistors, capacitors, etc.), and various functional integrated circuits into a single package [1] - This integration allows for electrical connections, physical protection, and thermal management among the components [1] Group 3: Production Status - The mSSD is currently in the ramp-up stage for mass production [1]