Group 1 - TSMC is expected to produce Apple's A19 processor using 2nm technology in the second half of this year, while competitors Samsung and Intel are facing challenges in yield and progress, respectively [1] - Japan's 2nm technology has reportedly entered trial production and is expected to achieve mass production by next year, positioning Japan to compete directly with TSMC in chip manufacturing [3] - Japan established a chip company, Rapidus, in 2022 with support from major Japanese firms and the government, aiming to revitalize its semiconductor industry, which once held a significant global market share [3] Group 2 - The decline of Japan's semiconductor industry was accelerated by U.S. policies, leading to a loss of market dominance, with companies like Elpida falling behind [5] - The U.S. is seeking to diversify its chip supply sources, as TSMC currently produces 70% of advanced chips for American companies, and TSMC is raising prices for its upcoming 2nm technology by 50% [5] - Japan's Rapidus aims to revitalize its semiconductor sector, aligning with U.S. interests to create competition against TSMC [7] Group 3 - Japan's rapid advancement in 2nm technology is supported by IBM's technological expertise, which has historically played a significant role in chip manufacturing [7] - Japan has acquired advanced 2nm EUV lithography machines from ASML, becoming the third company after Intel and Samsung to do so, enhancing its production capabilities [7] - TSMC aims to maximize the value of its first-generation EUV lithography machines while Japan focuses on quickly achieving mass production of 2nm technology, leveraging its advantages in chip materials [9]

Core Viewpoint - Samsung Electronics is preparing to restore its competitiveness in the next generation of foundry services by completing the foundational design of its second-generation 2nm (SF2P) process and initiating customer outreach activities [1][2]. Group 1: SF2P Process Development - The SF2P process is set for mass production next year, with a 12% performance improvement, 25% reduction in power consumption, and 8% decrease in chip area compared to the first-generation 2nm process (SF2) planned for production in the second half of this year [2]. - Samsung has begun promoting the SF2P process to external customers as the necessary foundational preparations, including the Process Design Kit (PDK), have been completed [2]. - The PDK for SF2P is currently at version 0.9, with the 1.0 version expected to be completed next month, which will allow for formal distribution to external clients [2]. Group 2: Client Engagement and AI Chiplet Platform - Samsung and its design service partners have started advancing customer order projects related to the SF2P process, with expectations that most clients interested in 2nm chip design this year will adopt the SF2P process [3]. - The AI CPU Chiplet platform, developed in collaboration with ADTechnology, Arm, and Rebellions, has confirmed the use of the SF2P process [3][4]. - The project integrates Rebellions' AI chip "REBEL" with a CPU chiplet designed by ADTechnology, utilizing Arm's Neoverse Compute Subsystems V3 architecture and produced through Samsung's 2nm process [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自businesskorea 。 三星电子正在加速美国尖端晶圆代工厂的量产准备工作，继近期重启此前一直拖延的基础设施建设 后，据悉已开始为明年初首次引入量产设施做准备。 据业界消息人士23日透露，三星电子正在讨论最早于明年1月或2月向美国泰勒代工厂引入2纳米 （nm）工艺量产设施的计划。 三星电子Taylor Foundry Fab是2021年做出投资决定的新工厂，最初目标是量产4nm工艺，但考虑 到市场情况，将重点放在了2nm工艺上。 然而，三星电子已多次推迟泰勒代工厂的全面竣工和量产线的建立。这是因为人们担心，在2nm工 艺需求尚未得到保障的情况下，先发制人的投资将导致巨大的成本损失。 不过，三星电子已于今年第二季度重启泰勒工厂的洁净室装修工程。洁净室是控制生产线内污染和 湿度的基础设施，只有在洁净室建成后，才能引入各种辅助设施和制造设备。洁净室的竣工日期为 今年年底。 由于这是第一条量产线，预计短期投资规模较小。然而，随着三星电子正在为下一代晶圆代工的量 产做准备，业界对此的期待也日益高涨。 未来工厂运营的关键在于获得大客户。三星电子的2纳米工艺（ ...

Core Viewpoint - Intel is striving to become a global leader in wafer foundry services, focusing on its 18A process technology as a core part of its strategy amid increasing competition in the 2nm chip market [1][2]. Group 1: Investment and Financial Performance - Over the past four years, Intel has invested more than $90 billion in capital expenditures to expand its wafer foundry business and close the gap with TSMC and Samsung [1]. - Intel's wafer foundry division incurred a loss of nearly $13 billion last year, and the company's stock price has dropped nearly 50% since its peak in 2024 [1]. Group 2: Technological Advancements - Intel's new 18A process, currently in risk production, is expected to enhance performance and energy efficiency through innovations like RibbonFET transistors and PowerVia backside power delivery [2]. - The transition to smaller process nodes, such as 2nm, is costly and complex, with initial yields typically low [1]. Group 3: Competitive Landscape - TSMC holds over two-thirds of the global wafer foundry market share and is expected to maintain a significant lead in 2nm technology, with plans to start mass production in the second half of 2025 [3]. - TSMC's 2nm process is projected to improve performance by 10% to 15% and reduce power consumption by up to 30% compared to the 3nm node, with a current yield rate of 60% [3]. - In contrast, Intel's yield for the 18A process is estimated to be only 20% to 30%, while Samsung's competing technology has a yield of 40% [3]. Group 4: Customer Dynamics - TSMC has a large and loyal customer base, including major clients like Apple and AMD, who have committed to using its 2nm technology [4]. - Intel is diversifying its strategy by considering TSMC as an alternative supplier for its upcoming Nova Lake desktop processors, expected to launch in 2026 [4]. Group 5: Challenges Ahead - Despite claims that the 18A process will offer higher performance and lower power consumption compared to TSMC's nodes, Intel faces challenges in density and cost advantages [5]. - Intel has experienced delays in launching new nodes, with some external customers withdrawing after initial trial production, leading to lower-than-expected demand [5].

该修订于4月30日公布，是泰勒市历时一个月、旨在减少与芯片工厂相关的规划审查和检查开支的 一部分。原先可达2500万美元的返还激励现已被削减至最多900万美元，且这一金额还取决于三星 是否在2026年底前达到设备安装门槛。 泰勒市将这一门槛称为"确保三星在明年底前开始引入设备、启动芯片制造的保证"。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自韩国中央日报 。 由于三星电子耗资370亿美元的半导体制造项目建设进度滞后，加上全球芯片供应过剩削弱了早期 的乐观预期，德克萨斯州泰勒市在最新修订中削减了对该项目的财政激励。 这一变化也反映出特朗普再次就任总统后，美国政策基调发生了转变。特朗普政府推动削减对外国 芯片制造商的补贴，这也是其更广泛保护主义议程的一部分。 在芯片行业之外，特朗普政府也正向三星和苹果施压，要求它们将生产转移至美国，否则将面临从 6月底起实施的25%关税。这对目前一半以上智能手机产自越南的三星来说构成重大挑战。 在修订条款中，泰勒市还要求三星在2026年前完成总建筑面积为600万平方英尺的厂房建设，并在 2028年前再新增100万平方英尺，合计达到700万平方英尺。这一此前未曾列明 ...

据业内人士29日透露，三星电子代工3纳米制程的良率目前徘徊在50%左右。考虑到三星电子宣布 量产已进入第三年，如此长时间的低良率状态实属罕见。相比之下，台积电据称已确保其3纳米制 程的良率超过90%，从而稳定了生产效率。尽管台积电的生产成本较高，但在芯片可靠性和性能方 面，台积电被认为是一个稳定的选择。 目前，苹果、高通、NVIDIA 和联发科均采用台积电第三代 3 纳米 (N3P) 工艺。据悉，这些厂商 将从 2026 年开始过渡到 2 纳米工艺。谷歌还计划通过 Tensor G5 缩小与竞争对手的片上系统 (SoC) 在性能和能效方面的差距，该芯片将采用台积电第二代 3 纳米工艺生产。 问题在于，那些曾与三星洽谈先进制程生产的公司，越来越多地在测试阶段发现问题，并转而选择 台 积 电 。 一 位 半 导 体 业 内 人 士 指 出 ： " 晶 圆 代 工 行 业 最 重 要 的 是 与 客 户 的 信 任 关 系 。 " 他 补 充 道："三星电子因良率问题在高端制程上遇到困难，这引发了人们对其晶圆代工业务的质疑，而且 需要很长时间才能恢复。" 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 目前量产的半导体标准最尖端工程3纳米市场由台积电率先实现收益率稳定化，独占主要顾客。据 市场调查企业Counterpoint Research透露，台积电的3纳米工程在批量生产后，时隔5个季度，最 近开工率首次达到了100%。Counterpoint Research预测："台积电的2纳米工程将在量产后时隔4 个季度达到完全开工率。" 来源：内容来自东亚日报 ，谢谢 。 三星电子2022年6月在世界上首次宣布批量生产3纳米工程，但在改善收率和吸引大型客户方面一 直面临困难。相关业界预测，将于今年7月在美国纽约公开的"Galaxy Z Fold·Flip 7"将首次搭载三 星电子3纳米工艺基础的"Exynos 2500"。 不过，三星电子在收益率相对稳定的工程中，正在确保顾客。彭博社当地时间19日报道称，三星 电子获得了将于下月上市的任天堂"Switch 2"的8纳米工艺基础主半导体供应合同。这是超越现有 开关的半导体供应商台积电取得的成果。彭博社报道说："这是三星与台积电竞争的重要胜利。" 据悉，台积电在美中矛盾全面爆发后在中国市场停滞不前，此后，三星电子开始扩大当地 ...

每日晨报 2025 年 5 月 13 日 交银国际研究 今日焦点 | 台积电 | | TSM US | | --- | --- | --- | | 先进制程优势在扩大，首予买入 | | 评级: 买入 | | 收盘价: 美元 176.52 目标价: | 美元 225.00 | 潜在涨幅: +27.5% | | 王大卫, PhD, CFA | Dawei.wang@bocomgroup.com | | 产品周期与供需周期均利于业绩稳定增长。从产品周期角度看，我们认 为台积电新产品单价打破之前上市后逐渐下滑的趋势，公司对于半导体 设计厂商客户的议价能力或在增强，3 纳米工艺芯片或不会在 2 纳米上 市前后降价。 从全球先进制程的供需关系看，我们认为之前以智能手机为主导的先进 制程需求正转化为手机和高性能计算需求竞争供给的格局。我们认为全 球先进制程芯片或进入一个长于之前周期的上行周期，而作为全球高端 智能手机芯片和人工智能加速芯片的主要甚至唯一供应商，台积电或进 一步受益。 进入 2 纳米时代技术优势或继续扩大。我们认为台积电在先进制程和先 进封装技术上的优势或在扩大。我们认为 2 纳米工艺相对之前的 3 纳米 工 ...

据四位知情人士透露，台积电已向美国芯片设计公司英伟达、AMD和博通提出，考虑入股一家合 资企业，该企业将负责运营英特尔的工厂。 这些谈判目前仍处于早期阶段。知情人士表示，谈判是在美国总统特朗普政府要求台积电帮助扭转 这家陷入困境的美国工业巨头的情况下展开的。由于谈判尚未公开，消息人士均要求匿名。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自路透社，谢谢。 根据该提议，这家台湾芯片制造巨头将负责英特尔代工业务的运营，该业务专门为客户制造定制化 芯片，但台积电不会持有超过50%的股份，消息人士称。此外，据其中一位消息人士和另一位独立 消息人士透露，高通也收到了台积电的入股邀约。 英特尔、台积电、英伟达、AMD 和高通均拒绝置评。白宫和博通未回应置评请求。 此交易涉及的是这家美国芯片制造巨头的未来，其股价在过去一年中已下跌超过50%。 英特尔在 2024 年报告了 188 亿美元的净亏损，这是自 1986 年以来的首次亏损，主要受大规模资 产减值影响。截至 12 月 31 日，该公司提交的文件显示，代工部门的厂房和设备账面价值为 1080 亿美元。 消息人士称，特朗普希望重振英特尔的业务，并推动美国的 ...