消息面上，近日，恩智浦正式确认将关闭其位于美国亚利桑那州钱德勒的"Echo"晶圆厂，该厂定于2027 年第一季度生产最后一批晶圆后谢幕，台积电在2025年7月做出逐步退出GaN代工业务的决定，将在 2027年中前完全停止GaN代工服务。 英诺赛科(02577)尾盘涨近15%，截至发稿，涨14.39%，报77.5港元，成交额7.29亿港元。 值得注意的是，英伟达近期宣布了包括CoreWeave、甲骨文在内的十余家合作伙伴，旨在为800伏直流 电源架构和单机柜功率密度达到1兆瓦(MW)的超高密度计算环境做准备。早在今年8月，英诺赛科已作 为唯一中国芯片企业，跻身英伟达800V直流电源架构合作伙伴名录，为其AI数据中心提供全链路氮化 镓解决方案，助力单机柜功率密度突破300kW。 ...

温馨提示 ： 点击下方图片，查看运营团队最新（12月）原创报告（共260页） 说明： 欢迎约稿、刊例合作、行业交流 ， 行业交流记得先加入 "机器人头条"知识星球 ，后添加（ 微信号：lietou100w ）微 正文： 审厂、定点、新工艺，T链们"缩圈"和"扩圈"同时进行，核心标的及走向越发明朗，静待发包！ 小编昨日文章 特斯拉Optimus量产前夕，产业链公司"缩圈"逻辑 有详细解读Optimus产业链公司" 缩圈 "逻辑， 核心观点是核心T链标的逐渐减少，越到最后越接近决赛圈（获得T定点或量产订单），后续也会是资本关注重 点；同时，提到"缩圈"和"扩圈"同时进行，今日重点聊一下" 扩圈 "逻辑。 先简单说一下T链们本周走势，前两天大幅下行、第三天超跌反弹、第四天继续下行、第五天微弱反弹，整体来 说比预期中要好； 小编从上周四就在星球内提到注意避险，核心逻辑是：现阶段仍旧是炒预期阶段，除了T链定 点外，官方层面利好很少； 缺乏"爆炸"利好催化， 11月21日以来本波反弹，更多体现在核心利好标上，并迎来 较大涨幅，已远超预期。 这也是为什么特斯拉本波审厂第一站XJ之后，审厂资讯正式断层，再无确定性消息发酵，其 ...

Core Viewpoint - TSMC is exiting the GaN foundry business and restructuring its wafer fabs to optimize operations and reduce costs, while focusing on advanced packaging and internal development of EUV mask protection films [2][4][6]. Group 1: TSMC's Strategic Moves - TSMC will close its 6-inch GaN foundry in Hsinchu Science Park within two years and integrate its three 8-inch fabs to address labor shortages and improve asset utilization [2]. - The 6-inch fab will be repurposed for CoPoS advanced packaging, while the 8-inch fabs will focus on internal production of EUV mask protection films to reduce reliance on ASML and its supply chain [4]. - TSMC's investment in advanced process nodes has been significant over the past decade, but the high costs associated with EUV technology are prompting a shift in strategy to enhance yield and cost efficiency [4]. Group 2: Importance of Mask Protection Films - EUV technology requires new mask and protection film methods, as traditional organic films lack the necessary transparency and stability for EUV processes [5]. - TSMC's proprietary protection films are expected to optimize workflows, improve yields, expand capacity, and reduce costs, thereby enhancing profitability and maintaining its competitive edge [5]. - The transition to in-house mask protection film development is crucial for TSMC as it moves towards 2nm processes and expands CoWoS packaging technology [5]. Group 3: Market Dynamics and Competition - The exit from the GaN sector highlights intense price competition from Chinese competitors in the third-generation semiconductor market [6]. - Global IDM manufacturers, including Texas Instruments and Infineon, are also expanding their internal GaN capacities, indicating a growing focus on this technology [6].

Core Insights - The article discusses significant developments in the semiconductor industry, highlighting investments, policy changes, and market trends that could impact future growth and competition in the sector. Group 1: Investment and Policy Initiatives - Shenzhen has established a semiconductor and integrated circuit investment fund with a total scale of 5 billion yuan to support the optimization and quality improvement of the industry chain [5] - Shanghai has implemented joint support policies for key industrial chains, including integrated circuits and aerospace, to accelerate the cultivation of these sectors [5] - Hong Kong has approved the construction of its first 8-inch silicon carbide wafer factory, marking a significant step in semiconductor manufacturing [5] Group 2: Market Trends and Projections - South Korea's semiconductor exports increased by 11.6% year-on-year in June, reaching a record high of $14.97 billion [7] - The U.S. Senate has passed a tax bill that could increase tax credits for semiconductor companies building new factories from 25% to 35% [8] - By 2030, mainland China is projected to surpass Taiwan and become the largest semiconductor wafer foundry center globally, capturing 30% of the total installed capacity [8] Group 3: Company Developments - TSMC is reportedly planning to cease production on its GaN production line to focus on advanced packaging [6] - Samsung's semiconductor division is expected to report a 39% drop in operating profit for Q2 due to delays in supplying advanced memory chips to Nvidia [11] - The bankruptcy review application for the advanced packaging equipment company, Paixin Semiconductor, has been filed, indicating financial distress [9][10] Group 4: Technology and Innovation - Tokyo University has developed a new gallium-doped indium oxide crystal material that could replace silicon, enhancing performance in AI and big data applications [19] - The upcoming LPDDR6 memory is set to be mass-produced by Samsung in late 2025, with Qualcomm as the first adopter [19] Group 5: Market Analysis - TrendForce reports that the price of 16Gb DDR4 DRAM chips continues to rise, while PC-grade DRAM prices are losing momentum [16] - CFM forecasts that LPDDR4X prices will increase by over 20% in Q3 2025, while LPDDR5X prices will see slight increases [17]