本周(2026/1/12-1/18)SW电子行业指数(+3.77%)，涨跌幅排名2/31位，沪深300指数(-0.57%)。SW一级行 业指数涨跌幅前五分别为：计算机(+3.82%)，电子(+3.77%)，有色金属(+3.03%)，传媒(+2.04%)，机械 设备(+1.91%)，涨跌幅后五分别为:国防军工(-4.92%)，房地产(-3.52%)，农林牧渔(-3.27%)，煤炭 (-3.11%)，银行(-3.03%)。本周SW电子三级行业指数涨跌幅前三分别是：集成电路封测(+14.47%)，半导 体设备(+9.31%)，集成电路制造(+8.68%)，涨跌幅后三分别是：LED(-0.10%)，印制电路板(+0.22%)，分 立器件(+0.80%)。 本周SW电子行业涨跌幅排名前五的股票分别是：臻镭科技(+48.18%)，珂玛科技（301611） (+42.68%)，可川科技（603052）(+41.14%)，普冉股份(+39.75%)，和林微纳(+39.39%)。涨跌幅排名后 五的股票分别是：得润电子(-15.88%)，思泉新材（301489）(-9.74%)，安克创新（300866）(-7.16%)， 睿能科 ...

Market Review - The overseas AI chip index decreased by 1.5% this week, while MPS and TSMC increased by 2.4% and 1.3% respectively. AMD and Marvell saw declines of 9.1% and 6.9% [1] - The domestic AI chip index rose by 7.8%, with companies like Cambricon, Loongson Technology, Aojie Technology, Zhaoyi Innovation, Changdian Technology, and Tongfu Microelectronics all experiencing gains of over 10%. Haiguang Information, Rockchip, and Hengxuan Technology had increases of 9.9%, 5.1%, and 3.8% respectively [1] - The Nvidia mapping index fell by 0.3%, while Magvint increased by 12%. Shenyu Co., Wolong Nuclear Materials, and Zhaolong Interconnect all had gains exceeding 5%, whereas companies like Changxin Bochuang, Invid, and Huitian Technology saw declines of over 4% [1] - The server ODM index dropped by 3.0%, with Gigabyte and Wiwynn experiencing declines of over 5%. Quanta, Supermicro, Foxconn, and Wistron had relatively smaller decreases [1] - The storage chip index increased by 12.1%, with Puran and Hengshuo seeing gains of 39.7% and 28.3% respectively. Zhaoyi Innovation, Beijing Junzheng, Lianyun Technology, Jiangbolong, Baiwei Storage, Shannon Chip, and Jucheng Technology all had increases exceeding 10%, while Dongxin Technology was the only company to experience a decline [1] - The power semiconductor index rose by 5.7%, while the A-share fruit chain index increased by 1% and the Hong Kong Apple index fell by 3.5% [1] Industry Data - Global electric vehicle sales are expected to reach 20.985 million units by 2025, representing a year-on-year increase of approximately 22%. This figure is projected to rise to 24.166 million units in 2026, with a year-on-year growth of about 15% [2] - Global smartwatch shipments are anticipated to grow by 7% by the end of 2025, returning to a growth trajectory after a decline in 2024 [2] - The shipment volume of foldable smartphone panels is expected to achieve a year-on-year growth of 46% in 2026, driven primarily by Apple's procurement of panels for its first foldable iPhone [2] Major Events - The Trump administration has recently relaxed restrictions on the export of NVIDIA H200 chips to China, with the Chinese government planning to allow certain users to import this AI chip as early as the first quarter of 2026 [3] - Micron plans to build up to four wafer fabs in New York, potentially receiving over $25 billion in federal subsidies for the construction of the first two fabs, with the first expected to be operational by 2030 and the second by 2033 [3] - After 2026, high-end GPU platforms such as Blackwell and Vera Rubin will be introduced, making rack-level power limits a critical challenge for the industry [3]

Market Overview - The overseas AI chip index decreased by 1.5% this week, while MPS and TSMC increased by 2.4% and 1.3% respectively. AMD and Marvell saw declines of 9.1% and 6.9% [1][2] - The domestic AI chip index rose by 7.8% this week, with companies like Cambricon, Loongson Technology, Aojie Technology, Zhaoyi Innovation, Changdian Technology, and Tongfu Microelectronics all experiencing gains of over 10%. Haiguang Information, Rockchip, and Hengxuan Technology had increases of 9.9%, 5.1%, and 3.8% respectively [1][2] Industry Data - Global electric vehicle sales are projected to reach 20.985 million units by 2025, representing a year-on-year increase of approximately 22%, with expectations to rise to 24.166 million units in 2026, a 15% increase [3] - Global smartwatch shipments are expected to grow by 7% year-on-year by the end of 2025, recovering from a decline in 2024 [3] - The shipment volume of foldable smartphone panels is anticipated to achieve a 46% year-on-year growth in 2026, driven by Apple's procurement for its first foldable iPhone [3] Major Events - The Trump administration has relaxed export controls on NVIDIA H200 chips to China, with the Chinese government planning to allow certain users to import this AI chip as early as Q1 2026 [4] - Micron plans to build up to four wafer fabs in New York, potentially receiving over $25 billion in federal subsidies for the first two fabs, with the first expected to be operational by 2030 and the second by 2033 [4] - After 2026, high-end GPU platforms such as Blackwell and Vera Rubin will be introduced, with rack-level power supply limits becoming a critical challenge for the industry [4]

Key Points - Segment Yongping is reportedly leading a restructuring of car manufacturing involving OPPO and vivo, but Zhontai has denied any current collaboration [4][5] - The US has placed DJI on a controlled list, prompting responses from both the Chinese government and DJI, emphasizing the need for fair market conditions [6][7] - Kuaishou's live streaming feature faced a cyber attack, resulting in a market value loss of over 10 billion HKD, but services have gradually resumed [8][10] - ByteDance has secured exclusive AI cloud cooperation for the Spring Festival Gala, indicating a significant marketing investment [10][11] - JD.com has confirmed the recovery of operations after a theft incident in France, where over 50,000 electronic devices were stolen [12][13] - Weichai has seen a high turnover of CEOs, with the latest CEO stating that the changes are due to internal pressures rather than dismissals [18][19] - BYD's sales in Europe surged by 235% year-on-year in November, while Tesla's sales dropped by over 34% [37][38] - Apple is restructuring its AI team to enhance the Siri experience for the upcoming iPhone 17, focusing on a more integrated approach [34][35] - Qualcomm's CEO announced a significant transformation in smartphone computing architecture expected to be revealed in 2026 [45]