建滔积层板(01888)发布公告，公司董事于2025年12月17日行使优先购股权获发行合共75万股股份。 ...

智通财经APP讯，建滔积层板(01888)发布公告，公司董事于2025年12月17日行使优先购股权获发行合共 75万股股份。 ...

公司董事于2025年12月17日行使优先购股权(根据公司2017年 5月29日采纳的优先购股权计划授予)获发 行50万股份 格隆汇12月17日丨建滔积层板(01888.HK)公布，公司董事于2025年12月17日行使优先购股权(根据公司 2017年5月29日采纳的优先购股权计划授予)获发行25万股份。 ...

FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別： 股票 狀態： 新提交 第 2 頁 共 6 頁 v 1.3.0 公司名稱： 建滔積層板控股有限公司 呈交日期： 2025年12月17日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司（「香港聯交所」）證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露，必須填妥第一章節 。 | 第一章節 | | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | 於香港聯交所上市 | 是 | | | | 證券代號 (如上市) | 01888 | 說明 | | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | | | | 已發行股份（不包括庫存股份）變動 | | 庫存股份變動 | 每股 ...

展望2026年，中信建投研究需要关注货币和财政回归之后全球经济走向。接力金银的下一个大宗品种， 应该是铜。 铜矿系列有色金属港股： 来自花旗集团(Citigroup Inc.)的矿业分析师们表示，大宗商品贸易领军者嘉能可(Glencore Plc)是他们对 2026年的首选股票标的，并预计近期涨势强劲的该股在未来12个月该股将上涨约15%，主要因为该公司 正努力提升铜产量。 在Oddo BHF看来，全球矿业巨头力拓集团(Rio Tinto Group)在铜业务方面拥有"非常有吸引力的发展路 线图"，并且随着其位于几内亚(Guinea)的西芒杜(Simandou)大型项目逐步爬坡，力拓应能扩大铁矿石产 量。 Oddo矿业分析师Maxime Kogge表示，他对明年矿业股票仍然持看多态度，但也警告称，亚洲经济如果 显著放缓可能会破坏市场情绪。"铜主题，在2026年应仍将是一个积极的驱动因素，也是最值得投资的 积极方向之一。"这位资深分析师表示。"其他的金属或许投资风险会更大一些。" 中信建投研报认为，上周金银表现强势，其他风险资产偏弱。2025年大类资产，金银代表的贵金属一骑 绝尘。 2025年贵金属行情可分三段 ...

Industry Overview - The global PCB market is undergoing structural changes, with growth shifting from traditional consumer electronics to high-performance computing and automotive electronics. The market size is expected to reach $75 billion by 2024, with a compound annual growth rate (CAGR) of 3.6% from 2020 to 2024. By 2029, the market size is projected to reach $96.8 billion, with a CAGR of 5.2% from 2024 to 2029 [1] - Data communications is the fastest-growing segment, with the market size expected to increase from $21.8 billion in 2024 to $32.7 billion in 2029, reflecting a CAGR of 8.4%, significantly outpacing the overall industry growth. This growth is primarily driven by upgrades in general server platforms and surging demand for AI servers [1] Company Insights - CITIC Securities reports that the demand for orthogonal backplanes and Cowop process upgrades will make PCBs more similar to semiconductors, leading to a steady increase in value. Companies like Amazon, META, and Google have weaker in-house chip design capabilities compared to NVIDIA, resulting in higher material requirements for PCBs. The continuous upgrade of PCBs driven by short-distance data transmission demands will enhance the upstream supply chain, particularly in copper-clad laminates transitioning from M6/M7 to M8/M9 [2] - The PCB industry is experiencing a surge in demand for AI-driven products, leading to upgrades in high aspect ratio and multi-blind buried hole designs. This trend is boosting the demand for AI PCB electroplating copper powder consumables, resulting in both volume and price increases that are rapidly enhancing industry profits. The industry is expected to enter a prosperous cycle due to short-term capacity constraints [2] Stock Market Activity - Kintor Technology (01888) has raised product prices multiple times this year due to cost pressures and demand benefits. The company reports high capacity utilization rates and has made price adjustments for various copper-clad laminate products [3] - Kintor Group (00148) is focusing on the entire PCB supply chain, investing in a copper-clad laminate R&D center and developing high-frequency and high-speed products for AI server GPU motherboards. The group plans to establish an AI PCB production line in Guangdong with an investment of approximately 800 to 1,000 million RMB, indicating a saturated order situation and optimistic outlook for the first half of next year [3] - Dongshan Precision (002384) has submitted an application to the Hong Kong Stock Exchange and is recognized as the world's largest PCB supplier for edge AI devices [4] - Huadian Co., Ltd. (002463) has also submitted an application to the Hong Kong Stock Exchange and ranks first globally in PCB revenue within the data center sector [5]

Group 1: PCB Market Overview - The global PCB market is experiencing structural changes, with growth shifting from traditional consumer electronics to high-performance computing and automotive electronics [1] - The market size is projected to reach $75 billion by 2024, with a compound annual growth rate (CAGR) of 3.6% from 2020 to 2024 [1] - By 2029, the market size is expected to grow to $96.8 billion, with a CAGR of 5.2% from 2024 to 2029 [1] - Data communication is the fastest-growing segment, with the market size anticipated to increase from $21.8 billion in 2024 to $32.7 billion in 2029, reflecting a CAGR of 8.4% [1] Group 2: Industry Trends and Innovations - The demand for orthogonal backplanes and Cowop process upgrades is leading to PCB becoming more similar to semiconductors, resulting in a steady increase in value [2] - Companies like Amazon, META, and Google are facing challenges in chip design capabilities compared to NVIDIA, leading to higher requirements for PCBs and materials [2] - The continuous upgrade of PCBs driven by short-distance data transmission requirements is prompting upstream industry upgrades, including the transition of copper-clad laminates from M6/M7 to M8/M9 [2] - Domestic PCB companies are increasing their global market share, driving the localization of upstream supply chains, including high-end resins, fiberglass cloth, and copper foil [2] Group 3: Company Developments - Kintor Laminates (01888) has raised product prices multiple times this year due to cost pressures and demand benefits, with high capacity utilization reported [3] - Kintor Group (00148) is focusing on the entire PCB supply chain, investing approximately 800 to 1,000 million RMB to establish an AI circuit board production line in Guangdong [3] - East Mountain Precision has submitted an application to the Hong Kong Stock Exchange, recognized as the largest PCB supplier for edge AI devices globally [4] - Huadian Co., Ltd. has also submitted an application to the Hong Kong Stock Exchange, leading in PCB revenue within the data center sector globally [5]

Group 1 - The core viewpoint of the news highlights the price increase of copper-clad laminate products due to rising copper prices and tight supply of glass fabric, with specific increases of 5% for CEM-1/22F/V0/HB products and 10% for FR-4 and PP products [1] - The current high raw material prices and high operating rates of downstream PCB manufacturers suggest that the trend of price adjustments for copper-clad laminate products is likely to continue [1] - The growth potential is expected to increase significantly next year as new platform products from the GPU and ASIC camps begin to adopt M8.5+ materials, which will enhance the value of copper-clad laminate products [1] Group 2 - The HKPCA Show 2025 is set to take place on December 3 at the Shenzhen International Convention and Exhibition Center, where Kingboard Laminates will showcase high-end solutions that align with the demands of AI and automotive electronics [1] - Kingboard Laminates will prominently feature innovative solutions covering AI servers, IC substrates, and automotive electronics, all backed by clear technical support and market validation [1]

Core Viewpoint - The stock price of Jiantao Laminates (01888) has increased by over 4%, currently at HKD 12.37, with a trading volume of HKD 180 million, driven by price hikes in copper-clad laminate products due to rising copper prices and tight supply of glass fabric [1] Price Adjustments - Following an 8% price increase by Taiwan's Nanya Plastics for all copper-clad laminate products in November, Jiantao Laminates has announced a new round of price increases this week [1] - CEM-1/22F/V0/HB products have seen a price increase of 5%, while FR-4 and PP products have increased by 10% [1] Market Conditions - Raw material prices remain high, and downstream PCB manufacturers are operating at high capacity, indicating that the trend of price adjustments for copper-clad laminate products is likely to continue [1] - The growth potential is significant as new platform products in the GPU and ASIC sectors are expected to adopt M8.5+ materials next year, which could substantially enhance the value of copper-clad laminate products [1] Industry Events - The 2025 International Electronic Circuit (HKPCA Show) is set to begin on December 3 at the Shenzhen International Convention and Exhibition Center, where Jiantao Laminates will showcase its high-end solutions [1] - The company’s offerings are aligned with the demands of high-end applications such as AI and automotive electronics, featuring core products that have clear technical support and market validation [1]

Core Viewpoint - The stock price of Jiantao Laminates (01888) has increased by over 4%, currently at HKD 12.37, driven by price hikes in copper-clad laminate products due to rising copper prices and tight supply of glass fabric [1] Price Adjustments - Jiantao Laminates has announced a new round of price increases for its products, with CEM-1/22F/V0/HB products rising by 5% and FR-4, PP products increasing by 10% [1] - The price adjustments are influenced by high raw material costs and strong operational rates among downstream PCB manufacturers, indicating a potential continuation of the price increase trend [1] Growth Potential - The value of copper-clad laminate products is expected to significantly increase next year as new platform products in the GPU and ASIC sectors begin to adopt M8.5+ materials [1] - Companies that benefit from the price increase of copper-clad laminates and possess high-end product reserves are recommended for attention [1] Industry Events - Jiantao Laminates is showcasing its high-end solutions at the 2025 International Electronic Circuit (HKPCA Show) in Shenzhen, aligning with the demands of AI and automotive electronics [1] - The core product matrix presented at the exhibition is supported by clear technological backing and market validation [1]