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生益科技:伟华电子拟参与公司本次可交债项下的第一期发行
Mei Ri Jing Ji Xin Wen· 2026-01-05 12:33
(记者 曾健辉) 每经头条(nbdtoutiao)——秒光!1499元飞天茅台上线即空,i茅台App冲上苹果购物榜第一,10万用 户已下单!经销商同价做回馈,1000箱很快卖完 每经AI快讯,生益科技1月5日晚间发布公告称,广东生益科技股份有限公司持股5%以上股东伟华电子 有限公司拟参与公司本次可交债项下的第一期发行,拟参与认购本期发行的金额不超过人民币5亿元, 最终获配金额根据发行结果确定、以本期发行簿记管理人的书面通知为准。 ...
生益科技(600183) - 生益科技关于业绩补偿款支付的进展公告
2026-01-05 11:45
由于绿晟环保未能实现 3 年累计 1.57 亿元的业绩承诺,根据《股权转让协议》的业绩 承诺及补偿条款,业绩承诺期(2020-2022 年度)实际业绩完成情况计算的万容科技需支付 的现金业绩补偿金额是 69,309,768.46 元。因受环保行业环境的影响,万容科技应收账款金 额较高,现金流量仅能满足其正常经营周转使用,无富余资金全额支付业绩补偿款,截至 2024 年底,万容科技累计支付 1,100 万元业绩补偿款。 2025 年 3 月,公司与万容科技就业绩补偿余额 58,309,768.46 元偿还事项,签订《生 益资本与万容科技关于绿晟环保之股权转让协议之补充协议》(以下简称"《补充协议》"), 万容科技承诺,将于 2027 年 12 月 31 日之前偿还本补充协议项下的业绩补偿余额,其中: 2025 年 12 月 31 日前偿还 20,000,000 元,2026 年 12 月 31 日前偿还 20,000,000 元,2027 年 12 月 31 日前偿还剩余 18,309,768.46 元。 上述具体内容详见公司于 2023 年 3 月 29 日、2024 年 4 月 27 日、2025 年 3 ...
生益科技:2026年1月5日召开董事会会议
Mei Ri Jing Ji Xin Wen· 2026-01-05 11:39
Group 1 - The company Shengyi Technology announced that its 11th Board of Directors held a meeting on January 5, 2026, via communication voting [1] - The meeting reviewed the proposal regarding the associated company Wei Hua Electronics Co., Ltd. participating in the company's exchangeable bond issuance and related transactions [1]
生益科技:伟华电子拟不超5亿元参与公司可交换公司债券发行
Ge Long Hui· 2026-01-05 11:34
格隆汇1月5日丨生益科技(600183.SH)公布,持股5%以上股东伟华电子有限公司(以下简称"伟华电 子")拟参与公司本次可交债项下的第一期发行("本期发行"),拟参与认购本期发行的金额不超过人 民币5亿元,最终获配金额根据发行结果确定、以本期发行簿记管理人的书面通知为准。 ...
生益科技(600183) - 生益科技关于关联公司伟华电子有限公司拟参与公司可交换公司债券发行暨关联交易的公告
2026-01-05 11:32
股票简称:生益科技 股票代码:600183 公告编号:2026—004 广东生益科技股份有限公司 关于关联公司伟华电子有限公司拟参与公司可交换公司债券 发行暨关联交易的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: 广东生益科技股份有限公司(以下简称"公司"或"生益科技")持股 5%以上股东伟 华电子有限公司(以下简称"伟华电子")拟参与公司本次可交债项下的第一期发行("本期 发行"),拟参与认购本期发行的金额不超过人民币 5 亿元,最终获配金额根据发行结果确定、 以本期发行簿记管理人的书面通知为准。 根据《上海证券交易所股票上市规则》及《上海证券交易所上市公司自律监管指引 第 5 号——交易与关联交易》等规定,伟华电子构成公司关联方,本次交易为关联交易。 本次交易未达到《上市公司重大资产重组管理办法》规定的相关标准,不构成重大 资产重组。 本次交易事项已经公司董事会审议通过,关联交易金额或与同一关联方过去 12 个月 累计的交易金额均未达到公司最近一期经审计的净资产绝对值 5%以上,无需提交公司股东 会 ...
生益科技(600183.SH):伟华电子拟不超5亿元参与公司可交换公司债券发行
Ge Long Hui A P P· 2026-01-05 11:31
格隆汇1月5日丨生益科技(600183.SH)公布,持股5%以上股东伟华电子有限公司(以下简称"伟华电 子")拟参与公司本次可交债项下的第一期发行("本期发行"),拟参与认购本期发行的金额不超过人 民币5亿元,最终获配金额根据发行结果确定、以本期发行簿记管理人的书面通知为准。 ...
生益科技(600183) - 生益科技第十一届董事会第十二次会议决议公告
2026-01-05 11:30
股票简称:生益科技 股票代码:600183 公告编号:2026—003 广东生益科技股份有限公司 第十一届董事会第十二次会议决议公告 一、董事会会议召开情况 广东生益科技股份有限公司(以下简称"公司")第十一届董事会第十二次会议于 2026 年 1 月 5 日以通讯表决方式召开。2025 年 12 月 30 日,公司以邮件方式向董事及高级管理 人员发出本次董事会会议通知和会议资料。本次会议应参加董事 12 人,实际参加董事 12 人,符合《公司法》及《公司章程》的规定。 二、董事会会议审议情况 (一)审议通过《关于关联公司伟华电子有限公司拟参与公司可交换公司债券发行暨 关联交易的议案》 同意关联公司伟华电子有限公司拟参与公司可交换公司债券发行,认购金额不超过人民 币 5 亿元,最终获配金额根据发行结果确定、以本期发行簿记管理人的书面通知为准,其他 发行要素按公司本期发行披露的募集说明书和发行公告约定和/或簿记建档结果为准。 上述议案事前经公司第十一届董事会独立董事专门会议 2026 年第一次会议审议通过, 独立董事认为:关联公司伟华电子有限公司拟参与公司可交换公司债券的发行,体现股东对 公司发展的大力支持。本 ...
生益科技拟45亿元投建高性能覆铜板项目,加码核心材料布局
Ju Chao Zi Xun· 2026-01-05 10:04
Core Viewpoint - Shengyi Technology has signed an investment intention agreement to invest approximately 4.5 billion yuan in a high-performance copper-clad laminate project, reinforcing its position as a leading supplier in the electronic information industry [2] Group 1: Project Details - The project will be located in Dongguan Songshan Lake High-tech Industrial Development Zone, covering an area of about 298 acres with a usage period of 50 years [2] - The project will be developed in phases and funded through the company's own or self-raised funds, having already passed company meeting reviews [2] Group 2: Company Position and Market Impact - Shengyi Technology has established itself as a global leader in the copper-clad laminate sector, with products widely used in telecommunications, automotive electronics, and artificial intelligence [2] - The completion of this project is expected to enhance the company's production capacity and technological advantages in high-performance copper-clad laminates, thereby increasing its core competitiveness and market share [2]
第一创业晨会纪要-20260105
Macro Economic Group - The manufacturing PMI for December in China is 50.1%, an increase of 0.9 percentage points from the previous month, indicating a recovery in manufacturing activity [4] - The production index rose to 51.7%, up 1.7 percentage points, while new orders increased to 50.8%, reflecting improved domestic demand [4] - The non-manufacturing PMI for December is 50.2%, indicating a shift from contraction to expansion, with the construction sector showing significant growth at 52.8% [6] Industry Comprehensive Group - Blue Arrow Aerospace's IPO on the Sci-Tech Innovation Board has been accepted, aiming to raise 7.5 billion yuan, which is expected to positively impact the aerospace and military-related stocks [8] - The State Council's solid waste management action plan is anticipated to enhance the garbage treatment industry, particularly benefiting the construction waste sector and promoting prefabricated building development [8] - Shengyi Technology announced a project investment of approximately 4.5 billion yuan for high-performance copper-clad laminates, driven by demand from AI, cloud computing, and 6G communications [9] Advanced Manufacturing Group - The National Energy Administration released a new guideline for distributed power access, which is expected to facilitate a more refined development of distributed photovoltaics, benefiting leading companies with advanced technology and smart capabilities [11] Consumer Group - During the New Year holiday, domestic tourism saw 142 million trips and total spending of 84.789 billion yuan, reflecting a year-on-year increase of 5.2% and 6.3% respectively, indicating a robust recovery in the tourism sector [13] - The policy emphasis on enhancing tourism quality and expanding cultural tourism supply is expected to further benefit the cultural service and tourism sectors [13]
拟投资45亿元扩产,1700亿生益科技加码高性能覆铜板
Core Viewpoint - Shengyi Technology has signed an investment intention agreement with the Dongguan Songshan Lake High-tech Industrial Development Zone Management Committee to invest approximately 4.5 billion RMB in a high-performance copper-clad laminate project, responding to the strong global demand for high-performance materials in advanced technologies such as AI and 6G [1][2] Group 1: Investment and Project Details - The project will cover an area of approximately 198,667.66 square meters with a usage period of 50 years, funded by the company's own or self-raised funds [1] - This strategic investment is aimed at supporting key technologies in AI, cloud computing, 6G communication, and smart automotive electronics [1] Group 2: Market Demand and Growth - TrendForce forecasts that global capital expenditure for the eight major CSPs will grow by 40% to over 600 billion USD by 2026, driving demand for high-end PCB materials and technological upgrades in the supply chain [1] - The global shipment of AI servers is expected to increase by 20.9%, leading to higher requirements for AI hardware products [1] Group 3: Company Performance and R&D Investment - Shengyi Technology plans to increase its R&D expenditure to 1.157 billion RMB in 2024, a year-on-year increase of 37.57%, with further increases in the first half of 2025 [2] - The company’s core business, copper-clad laminates, accounts for over 60% of its revenue, with sales of 76.2753 million square meters in the first half of 2025, up 8.82% year-on-year [2] - Shengyi Technology ranks second globally in rigid copper-clad laminate sales with a market share of 13.7% [2] Group 4: Financial Performance - For the first three quarters of 2025, Shengyi Technology reported revenue of 20.614 billion RMB, a year-on-year increase of 39.80%, and a net profit attributable to shareholders of 2.443 billion RMB, up 78.04% [2] - In the third quarter alone, the company achieved revenue of 7.934 billion RMB, a 55.10% increase year-on-year, and a net profit of 1.017 billion RMB, reflecting a 131.18% growth, both setting historical records [2]