Summary of Conference Call Notes Industry Overview - The focus is on the CCL (Copper Clad Laminate) sector, which is experiencing significant price elasticity and is expected to benefit from the growth of AI applications, leading to new highs in the market [1][1]. Key Points Price Increase Logic - The current CCL cycle is characterized by strong and sustained demand growth from the market [1]. - Leading CCL manufacturers are operating at high capacity utilization rates of over 85% [1]. - For the period from Q1 2023 to Q4 2025, CCL prices are projected to increase by 25-30%, with a corresponding gross margin improvement of approximately 2 percentage points [1]. - It is anticipated that in 2026, CCL prices will continue to rise, with the potential for multiple price increases due to stable raw material prices [1]. - Historical cycles suggest that there is still potential for gross margin improvements of over 10 percentage points [1]. AI Market Potential - The AI CCL market is projected to exceed 50 billion by 2027, with domestic manufacturers positioned in the global top tier for material validation and electrical performance testing for major clients [2]. - Domestic manufacturers benefit from an engineering talent advantage and cost-effectiveness, which may lead to further market share gains [2]. Performance Outlook - This year is noted as a significant year for domestic computing power expansion, which is expected to have a substantial positive impact on the materials segment [3]. - There is a positive outlook on the performance elasticity of leading CCL manufacturers, with specific recommendations for companies such as Shengyi Technology, Kingboard Laminates, and Nanya Technology [3].

Group 1 - The Digital Economy ETF ICBC (561220) opened at a decline of 0.26%, priced at 1.535 yuan [1] - Major holdings in the Digital Economy ETF include companies like SMIC, which fell by 1.89%, and Haiguang Information, which dropped by 1.54% [1] - The fund's performance benchmark is the China Securities Index for State-Owned Enterprises in the Digital Economy, managed by ICBC Credit Suisse Asset Management [1] Group 2 - Since its inception on May 21, 2025, the fund has achieved a return of 54.05%, while its return over the past month has been -0.65% [1] - The fund manager is Shi Baojiao, indicating a specific leadership in managing the ETF [1]

Investment Rating - The report maintains an "Overweight" rating for the PCB industry chain, anticipating high growth in 2025 and sustained prosperity in 2026 [1]. Core Insights - The PCB industry is expected to experience significant growth in 2025, driven by increasing demand for AI computing power and the upgrade of PCBs towards high-performance and high-density products. This includes a rise in demand for high-layer boards and advanced HDI products, which will also boost related sectors such as high-end copper-clad laminates, drilling consumables, and equipment [4][61]. - Despite some disruptions in Q4 2025 performance, the growth logic for 2026 remains intact, with new computing platforms and technologies like orthogonal backplanes and CoWoP expected to enhance product value significantly [4][61]. Summary by Sections PCB - Q4 2025 performance may face disruptions, but the growth logic for 2026 remains unchanged. The demand for high-layer and advanced HDI PCBs is increasing, leading to high growth rates for companies like Shenghong Technology, Huadian Co., and Shennan Circuit, with projected net profits of 43.60 billion, 38.22 billion, and 32.48 billion respectively, reflecting year-on-year growth rates of 277.68%, 47.74%, and 73.00% [13][14]. Copper Clad Laminate (CCL) - The CCL sector is expected to see high growth in 2025, benefiting from increased demand for high-end products driven by AI computing power and price adjustments. Major CCL manufacturers are projected to achieve significant profit increases, with companies like Shengyi Technology expected to report a net profit of 33.50 billion, a year-on-year increase of 92.50% [36][41]. Drilling Tools and Equipment - The drilling tool sector is anticipated to exceed market expectations in 2025, with companies like DingTai High-Tech projected to achieve a net profit of 4.35 billion, reflecting a year-on-year growth of 91.74%. This growth is driven by increased demand for high-end PCBs and the optimization of product structures [48][49]. - Equipment demand is expected to rise due to the expansion of PCB production capacity, with companies like Dazhu CNC and Chip Quik projected to see significant profit increases, driven by the growing market for PCB-specific processing equipment [55][57].

6 February 2026 | 6:39AM HKT Equity Research Shengyi Tech (600183.SS): PCB Factory Tour: AI CCL price increase; Solid demand along with M9 migrations We hosted Shengyi Tech's management and visited its Dongguan factory during our China PCB Tour on Jan 28. Key discussions were on CCL pricing trend, raw material cost increase and demand outlook. Overall, management expect full UT rate for the whole year, with solid orders at hand. With the faster-than-expected raw material price increase, the company raised p ...

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 目录 正文 一、 ABF 胶膜基本概况：芯片封装的关键 " 黏合剂 " 引言 二、市场分析：千亿算力需求催生黄金赛道 近日， 高盛证券 最新解析PCB产业趋势指出，在AI与高阶运算需求的持续推升下， ABF载板供需吃紧 问题将逐月加剧 ， 2026年下半年供需缺口率将达10%，2027年、2028年更是有望进一步扩大至21%与 42%，这一短缺趋势将延续至2028年下半年 ，价格与获利动能持续向好。 八、 ABF 膜投资逻辑分析 值得关注的是， 2025年ABF材料端已率先出现供应吃紧现象，成为载板短缺的重要前兆 ；而技术升级 也带动需求结构发生根本性转变，目前AI伺服器占ABF需求比重已逾两成，随着代理AI（Agentic AI） 2026年起逐步落地，将进一步推升伺服器CPU载板用量，相较上一轮由远距办公驱动的需求，本波增长 更具结构性与长期性。 参考资料 在人工智能、5G 通信、高性能计算和自动驾驶技术飞速发展的今天，芯片已成为推动全球科技进步的 核心引擎，而 ABF载板的供需缺口背后，其核心原材料——ABF ...

证券日报网讯2月6日，生益科技（600183）在互动平台回答投资者提问时表示，公司坚持"全系列产 品、全方位市场"的战略布局，产品广泛应用于5G天线、通讯基站、大型计算机、高端服务器、航空航 天工业、芯片封装、汽车电子、智能家居、工控医疗设备、家电、消费类终端以及各种中高档电子产品 中。 ...

证券日报网讯2月6日，生益科技（600183）在互动平台回答投资者提问时表示，公司会根据市场需求及 原材料价格变化，及时调整经营策略，采取相关措施应对。 ...

证券日报网讯2月6日，生益科技（600183）在互动平台回答投资者提问时表示，公司主营设计、生产和 销售覆铜板和粘结片、印制线路板，2025年上半年实现主营业务收入124亿元，外销收入占比约21%， 产品有出口至欧盟国家。 ...

（文章来源：证券日报） 证券日报网讯 2月6日，生益科技在互动平台回答投资者提问时表示，公司与国内外各大终端就AI的相 关应用开展系列项目合作，具体经营情况请关注公司定期报告。 ...

（文章来源：证券日报） 证券日报网讯 2月6日，生益科技在互动平台回答投资者提问时表示，公司有全系列高速覆铜板，有不 同等级高速覆铜板针对应用在不同传输速率的产品，可以满足服务器、数据中心、交换机、光模块等应 用领域的需求，并与国内外各大终端就AI的相关应用开展系列项目合作，关于经营情况请关注公司定 期报告。 ...