SRAM 在 AI 推理中拓展应用，堆叠方案可 助力容量扩充 核心观点 投资建议与投资标的 ⚫ SRAM 在 AI 推理中拓展应用，堆叠方案助力容量扩充。相关标的：布局定制化存储 方案的国内头部存储芯片设计厂商兆易创新、北京君正等；布局基于 SRAM 的数字 存算一体方案的恒烁股份；布局先进封装的长电科技、通富微电等；布局混合键合 设备的拓荆科技、华海清科、百傲化学、芯源微等；有望受益于英伟达新芯片方案 的头部 PCB 厂商深南电路、沪电股份、胜宏科技等；PCB 上游企业生益科技、南 亚新材、宏和科技、菲利华、中材科技等。 电子行业 行业研究 | 动态跟踪 国家/地区 中国 行业 电子行业 报告发布日期 2026 年 03 月 07 日 看好（维持） | 薛宏伟 | 执业证书编号：S0860524110001 | | --- | --- | | | xuehongwei@orientsec.com.cn | | | 021-63326320 | | 蒯剑 | 执业证书编号：S0860514050005 | | | 香港证监会牌照：BPT856 | | | kuaijian@orientsec.com.cn | ...

PCB增长逻辑持续强化【中信电子】 各位投资人好，我们昨日外发AI PCB报告，针对近期市场关注点做了重点解答。 重申推荐：【生益科技】(26Q2金股)，【沪电股份】，【胜宏科技】（26M3金股）。 关于此前市场担忧： 1）正交背板，取消为不实消息，2月以来新一轮送样仍在进行中，我们仍预期英伟达将在GTC大会展示相关内 容，且后续CPO入柜可与正交背板共存，不存在直接利空影响 PCB增长逻辑持续强化【中信电子】 各位投资人好，我们昨日外发AI PCB报告，针对近期市场关注点做了重点解答。 重申推荐：【生益科技】(26Q2金股)，【沪电股份】，【胜宏科技】（26M3金股）。 关于此前市场担忧： 1）正交背板，取消为不实消息，2月以来新一轮送样仍在进行中，我们仍预期英伟达将在GTC大会展示相关内 容，且后续CPO入柜可与正交背板共存，不存在直接利空影响； 2）材料降规，目前无明确降规信息，客户正推进多个并行方案，最终结合供应能力、量产性价比等确认最终选 择，但行业26年M8全面渗透、M9起量趋势均在持续强化； 3）业绩兑现，PCB具有强重资产属性，产能呈阶梯跃升趋势，25H2-26H1为众多龙头PCB公司新产能释 ...

Summary of Key Points from the Conference Call Industry Focus - The conference call primarily focused on the **artificial intelligence (AI) network sector**, particularly the **co-packaged optics market trends**, and the **global printed circuit board (PCB) / copper clad laminate (CCL) industry** dynamics, including supply-demand patterns and competitive landscape [1][2] Core Insights and Arguments Artificial Intelligence Network Sector - Investors are particularly interested in the **supply-demand dynamics of optical modules** and the trends in **co-packaged optics technology** [1] - The **AI data center market** is viewed positively by most investors, who see it as a long-term growth opportunity for optical communication companies, driven by increased capital expenditures from global cloud service providers and the technological upgrade from **800G to 1.6T** [2] - Some investors express uncertainty about the **development trends of co-packaged optics**, questioning whether this technology will disrupt the business models of optical module companies [2] - Nomura suggests that co-packaged optics may become a competitive solution in horizontal network expansions, while pluggable optical modules will maintain a longer lifecycle due to lower implementation difficulty and a more mature supply chain [2] - Key component companies benefiting from the high entry barriers in the co-packaged optics field include **Corning** and **Lumentum**, particularly in the fiber optics and high-power laser sectors [2] - Japanese companies such as **Fujikura**, **Sumitomo Electric**, and the unlisted **Xuan Guang Advanced Components** are highlighted as having potential opportunities in the global co-packaged optics supply chain [2] Printed Circuit Board / Copper Clad Laminate Industry - Investors are keen to understand the successful development experiences of Chinese AI PCB / CCL companies over the past 2-3 years, while also expressing concerns about the sustainability of current demand growth and potential overcapacity risks [3] - Nomura believes that continuous technological innovation from **graphics processing units (GPUs)** and **application-specific integrated circuits (ASICs)** will support material and product upgrades in 2026 and 2027, potentially accelerating the industry into an upgrade cycle starting in the second half of 2026 [3] - Supply shortages of key raw materials such as **glass fiber**, **copper foil**, and **resins**, as well as equipment like **laser drilling machines**, are expected to persist, allowing leading PCB / CCL companies to maintain their competitive edge through more efficient supply chain management [3] - The competitive landscape in the **high-density interconnect PCB** sector is viewed as more favorable compared to the **high-layer PCB** sector, with the CCL industry exhibiting a higher concentration than the PCB industry [3] - Core recommended stocks include **Shenghong Technology** and **Shengyi Technology**, with Shengyi being a leading CCL supplier in China and Shenghong serving as a high-density interconnect PCB supplier for **NVIDIA** [3] Concerns Regarding Japanese Suppliers - Some investors are worried that Japanese upstream suppliers are adopting a conservative approach to capacity expansion, while their Chinese counterparts are more aggressive, potentially allowing Chinese companies to capture market share and impact the high-profit business of Japanese firms [4] Software Sector Insights - Most investors currently hold a negative view of the software sector, primarily due to concerns that **large language models (LLMs)** and **open AI agents** will disrupt the software industry [5] - Nomura agrees with this sentiment, indicating that valuation pressures in the software sector will persist in the short term due to a weak macro environment and intense competition, with many Chinese software companies facing growth challenges [5] - Despite the negative outlook, Nomura believes that a clear trend of differentiation will emerge within the software industry, where companies that integrate deeply into business processes and leverage LLMs and AI technologies to provide smarter solutions will thrive and not be disrupted [5]

Investment Rating - The report maintains a "Recommended" rating for companies such as 中芯国际 (SMIC) and 通富微电 (Tongfu Microelectronics) [2][3] Core Insights - The electronic industry is experiencing a comprehensive "inflation" phase, with multiple segments seeing price increases due to supply chain constraints and rising raw material costs [7][34] - AI demand is driving price hikes in PCB upstream materials, with significant increases in costs for electronic cloth and copper foil, leading to a new round of price increases in the CCL (Copper Clad Laminate) sector [10][17] - The MLCC (Multi-Layer Ceramic Capacitor) market is entering a price increase cycle, driven by high demand from AI servers and supply constraints from leading manufacturers [31][32] Summary by Sections 1. AI Demand Driving Price Increases in PCB Upstream Materials - The CCL industry has initiated a new round of price increases, with Japanese manufacturers announcing price hikes of over 30% for copper foil substrates and adhesive films [10] - The demand for high-end products is squeezing traditional production capacities, leading to a tighter supply-demand balance in electronic cloth [19] - The HVLP (High Voltage Low Profile) copper foil market is experiencing an expanding supply gap, enhancing the industry's pricing power [24] 2. AI Industry Driving Demand for MLCC - The MLCC sector is seeing a surge in prices, with a nearly 20% increase in spot prices for Korean MLCCs and leading manufacturers considering price hikes due to sustained high demand [31][32] - The supply-demand balance for high-end MLCCs is tight, with production rates at leading companies reaching 90-95%, indicating a potential for continued price increases [32] 3. Upstream Raw Material Price Increases and Semiconductor Price Trends - The semiconductor industry is expected to continue its price increase trend due to rising raw material costs and tight supply conditions [34] - Power semiconductors are also entering a new price increase phase, with companies like 新洁能 (New Clean Energy) announcing price hikes of at least 10% due to increased manufacturing costs [34] 4. Market Review - The electronic sector saw a weekly increase of 4.02%, outperforming the Shanghai and Shenzhen 300 index by 2.94 percentage points [37] - Year-to-date, the electronic sector has risen by 14.94%, again outperforming the broader index [37]

Investment Rating - The report maintains a "Recommended" rating for companies such as 中芯国际 (SMIC) and 通富微电 (Tongfu Microelectronics) [2][3] Core Insights - The electronic industry is experiencing a comprehensive "inflation" phase, with multiple segments seeing price increases due to rising costs and supply chain constraints [7][34] - AI demand is driving price hikes in PCB upstream materials, with significant increases in costs for electronic cloth and copper foil, leading to a new round of price increases in the CCL (Copper Clad Laminate) sector [10][17] - The MLCC (Multi-Layer Ceramic Capacitor) market is entering a price increase cycle, driven by high demand from AI servers and supply constraints from leading manufacturers [31][32] Summary by Sections 1. AI Demand Driving Price Increases in PCB Upstream Materials - The CCL industry has initiated a new round of price increases, with Japanese manufacturers announcing price hikes of over 30% for copper foil substrates and adhesive films [10] - The demand for high-end products is squeezing traditional production capacities, leading to tighter supply in electronic cloth [19] - The HVLP (High Voltage Low Profile) copper foil market is experiencing an expanding supply-demand gap, enhancing the industry's pricing power [24] 2. AI Industry Driving Demand Upward, MLCC Enters Price Increase Cycle - The MLCC sector is seeing a surge in prices, with a nearly 20% increase in spot prices and leading manufacturers considering price hikes due to sustained high demand from AI applications [31][32] - The global high-end MLCC market is currently in a state of supply-demand imbalance, with utilization rates of leading manufacturers reaching 90%-95% [32] 3. Upstream Raw Material Price Increases + AI Demand Driving Semiconductor Price Increases - The semiconductor industry is expected to continue its price increase trend due to rising raw material costs and tight supply of 8-inch wafers [34] 4. Market Review - The electronic sector saw a weekly increase of 4.02%, outperforming the CSI 300 index by 2.94 percentage points, with a year-to-date increase of 14.94% [37]

Flash | 01 Mar 2026 11:17:15 ET │ 12 pages Shengyi Technology (600183.SS) Preliminary Results Mean 4Q25 a Slight Miss, But Still Promising Growth Outlook for 2026E CITI'S TAKE Shengyi announced the 2025 preliminary results with revenue / net profit surging 39% / 92% yoy to Rmb28.431bn / Rmb3.334bn respectively. This implies the 4Q25 net profit of Rmb886m soaring 142% yoy. However, this was still slightly lower than previous midpoint guidance of Rmb902m. See Fig 1 for the quarterly P&L trend. Despite the mil ...

Stock Recommendations - Kingsoft Office (688111.SH) is positioned to benefit from AI developments despite recent stock price adjustments, with an expected EPS growth from 3.56 in 2024 to 4.57 in 2026[5] - Shengyi Technology (600183.SH) anticipates significant growth driven by server PCB upgrades and new AI customer acquisitions, with EPS projected to rise from 0.74 in 2024 to 2.37 in 2026[5] - Tuojing Technology (688072.SH) maintains a leading position in thin film deposition equipment, with EPS expected to increase from 2.48 in 2024 to 5.96 in 2026[5] Automotive Sector Insights - Bertly (603596.SH) is expected to benefit from the focus on autonomous driving, with an EPS forecast of 2.85 in 2026, reflecting a growth trajectory[6] - Yinlun (002126.SZ) is projected to see EPS growth from 0.96 in 2024 to 1.49 in 2026, supported by economic recovery in construction machinery and heavy trucks[6] Market Performance Overview - The weighted return of the gold stock portfolio in February 2026 was 6.47%, outperforming the Shanghai Composite Index, which rose by 1.09%[12] - Silver Wheel (002126.SZ) had the highest monthly increase at 32.15%, while Hongyuan Electronics (603267.SH) rose by 22.52%[12] Risk Factors - Potential risks include overseas policy changes and individual company operational risks, which could affect performance and earnings volatility[8]

Summary of Conference Call on China CCL Sector Industry Overview - The conference call focused on the China CCL (Copper Clad Laminate) sector, particularly in relation to advancements in AI and high-end CCL materials [1][2]. Key Companies Discussed - **Shengyi Technology (600183.SS)** - **Shennan Circuit (002916.SZ)** - **Kingboard Laminates Holdings (1888.HK)** - Other suppliers mentioned include EMC, Doosan, TUC, Panasonic, and ITEQ [1][2][3][4]. Core Insights and Arguments 1. **Growth in AI-CCL Materials**: - NVDA's recent results indicate a strong demand for high-end CCL materials, with a roadmap showing significant upgrades from 2020 to 2026 [1]. - The transition to advanced materials is expected to create opportunities for suppliers within the NVDA ecosystem [1]. 2. **Shengyi's Competitive Edge**: - Shengyi is the only certified supplier of M9 CCL by NVDA, achieving a production yield of over 90% for the Rubin platform [3]. - Projected earnings growth for Shengyi is over 33% to RMB 4.6 billion, with AI-CCL volume expected to double this year [3]. 3. **Market Demand Projections**: - AI-CCL volume is projected to reach 1.5-1.6 million sheets in 2026, accounting for over 15% of total capacity [3]. - The gross margin (GM) for AI-CCL is expected to exceed 40%, compared to an average of 28% for the CCL segment [3]. 4. **Shennan's Growth Potential**: - Shennan is expected to see a 39% CAGR in earnings from 2025 to 2027, driven by AI-PCB and BT substrate segments [10]. - The GM for AI-PCB is projected to be at least 45% in 2H25, supported by major customers like Huawei and increased AI capex among Chinese hyperscalers [10]. 5. **Kingboard Laminates' Strategy**: - KBL plans to enter the NVDA supply chain with its M9 CCL and is gaining momentum in upstream glass fabric production [4][9]. - The ASP of quartz fabric for M9 is significantly higher than E-glass, leading to a suspension of certain E-glass CCL products for a mix upgrade [7]. Additional Important Insights - **Material Shortages**: - There is a noted shortage of AI-fabric materials, particularly low Dk/gen 2 and Q-glass, with projected CAGRs of 387% and 471% respectively from 2025 to 2027 [8][11]. - Supply issues are expected to exacerbate delivery lead times, creating opportunities for price inflation [8]. - **Valuation and Risks**: - Target prices for Shengyi and Shennan reflect high P/E ratios due to expected earnings upgrades and market share gains [25][28]. - Risks include slower-than-expected customer certification, macroeconomic conditions in China, and demand fluctuations in electronic goods [24][26][29]. - **Future Production Plans**: - KBL aims to produce 2,000 tons of low Dk gen 1/gen 2 by 1Q26, with potential net profit contributions exceeding HK$400 million for 2026 [9]. This summary encapsulates the key points discussed during the conference call, highlighting the growth potential and strategic positioning of companies within the China CCL sector amidst the evolving landscape driven by AI advancements.

Group 1: Economic Policies and Market Developments - The Central Political Bureau of the Communist Party of China discussed the draft outline of the 14th Five-Year Plan and the government work report, emphasizing the need for a proactive fiscal policy and moderately loose monetary policy to strengthen domestic market construction and promote high-level technological self-reliance [3] - The People's Bank of China announced a reduction in the foreign exchange risk reserve ratio for forward foreign exchange sales from 20% to 0% starting March 2, 2026, to support enterprises in managing exchange rate risks [3] - The China Securities Regulatory Commission (CSRC) held a meeting to discuss the capital market's 14th Five-Year Plan, focusing on high-quality development and risk prevention [3] Group 2: Company Announcements and Financial Performance - Zhongke Hanwuji Technology Co., Ltd. reported a revenue of 6.497 billion yuan for the fiscal year 2025, a year-on-year increase of 453.21%, and a net profit of 2.059 billion yuan, reversing a loss of 452 million yuan from the previous year [4] - Companies such as Zhongjin Gold and Hekang New Energy announced significant investment plans, including a 4.5 billion yuan project in Inner Mongolia and a fundraising of up to 1.652 billion yuan from Midea Group, respectively [9] - Several companies, including Haitai Development and Shuangliang Energy, are under investigation by the CSRC for suspected violations of information disclosure regulations [9]

2025年度业绩快报公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 本公告所载2025年度主要财务数据为初步核算数据，未经会计师事务所审计，具体数据以广东生益科技 股份有限公司（以下简称"公司"）2025年年度报告中披露的数据为准，提请投资者注意投资风险。 一、2025年度主要财务数据和指标 单位：人民币万元 ■ 股票简称：生益科技 股票代码：600183 公告编号：2026一009 广东生益科技股份有限公司 2、影响经营业绩的主要因素 （1）在报告期内，公司覆铜板销量及售价同比上升，覆铜板产品营业收入增加，同时持续优化产品结 构提升毛利率，推动盈利水平提升。 （2）在报告期内，下属子公司生益电子股份有限公司坚持"市场引领，双轮驱动"的经营理念，聚焦高 端领域市场拓展，加大研发投入，推进提产扩产进程，同时强化质量管理，以质量筑牢根基，报告期内 高附加值产品占比提升，使公司在中高端市场的竞争优势得到进一步巩固，实现营业收入及利润较上年 同期大幅增长。 （二）上表中有关项目增减变动幅度达30%以上的主要原因 报告期内，公司营 ...