Group 1 - A total of 5 listed companies had their restricted shares unlocked on January 9, with a total market value of approximately 93.12 million yuan [1] - The specific details of the unlocked shares include: - Tongfeng Electronics (Stock Code: 600237) with 2.9545 million shares unlocked under equity incentive restrictions [1] - Longi Machinery (Stock Code: 002363) with 918,000 shares unlocked under equity incentive restrictions [1] - Chuan Yi Co., Ltd. (Stock Code: 603100) with 1.287 million shares unlocked under equity incentive restrictions [1] - Xuelong Group (Stock Code: 603949) with 489,500 shares unlocked under equity incentive restrictions [1] - Xinya Electronics (Stock Code: 605277) with 1.4083 million shares unlocked under equity incentive restrictions [1]

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：600237 证券简称： 铜峰电子 公告编号：2025-049 安徽铜峰电子股份有限公司 关于公开挂牌转让全资子公司 一一铜陵市峰华电子有限公司100%股权的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 重要内容提示： ●安徽铜峰电子股份有限公司（以下简称"公司"）以公开挂牌方式转让全资子公司一一铜陵市峰华电子 有限公司（以下简称"峰华电子"）100%股权，本次公开挂牌征集的受让方为安徽晶赛科技股份有限公 司（以下简称"晶赛科技"），双方已于2025年12月26日签署产权交易合同。 公司于2025年10月29日召开第十届董事会第十四次会议，审议通过了《关于公开挂牌转让全资子公司一 一铜陵市峰华电子有限公司100%股权的议案》，同意公司委托产权交易机构公开挂牌转让所持有的峰 华电子100%股权，具体内容详见公司于2025年10月30日在上海证券交易所网站（www.sse.com.cn）披 露的《关于公开挂牌转让全资子公司一一铜陵市峰华电子有限公司100%股权 ...

Core Viewpoint - Jinsai Technology (920981) has signed a contract to acquire 100% equity of Tongling Fenghua Electronics Co., Ltd. for 1 yuan, while also assuming a debt of 41.8717 million yuan [1] Group 1: Acquisition Details - The acquisition is conducted through a public bidding process [1] - The transaction price for the acquisition is set at 1 yuan [1] - Jinsai Technology will take on a debt of 41.8717 million yuan associated with Fenghua Electronics [1] Group 2: Company Profile - Fenghua Electronics primarily engages in the production, research, and sales of quartz crystal oscillator products [1] - The acquisition is part of Jinsai Technology's strategic decision to enhance its business layout and market competitiveness [1]

Core Viewpoint - The company aims to enhance its competitiveness by acquiring 100% equity of Tongling Fenghua Electronics Co., Ltd. through a public bidding process, with the transaction finalized at a total amount of 41.8717 million yuan [1] Group 1 - The acquisition agreement was signed on December 26, 2025, with Anhui Tongfeng Electronics Co., Ltd. [1] - The transfer price for the transaction is set at 1 yuan, while the company will assume a debt of 41.8717 million yuan for Fenghua Electronics [1] - Fenghua Electronics will become a wholly-owned subsidiary of the company following the acquisition [1]

证券代码：600237 证券简称： 铜峰电子 公告编号：2025-049 安徽铜峰电子股份有限公司 关于公开挂牌转让全资子公司——铜陵市峰华电子有 限公司100%股权的进展公告 2、企业类型：股份有限公司(上市、自然人投资或控股) 3、统一社会信用代码：91340700771114890E 4、注册资本：7,646.8 万元 5、法定代表人：侯诗益 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： ●安徽铜峰电子股份有限公司（以下简称"公司"）以公开挂牌方式转让全 资子公司——铜陵市峰华电子有限公司（以下简称"峰华电子"）100%股权，本 次公开挂牌征集的受让方为安徽晶赛科技股份有限公司（以下简称"晶赛科技"）， 双方已于 2025 年 12 月 26 日签署产权交易合同。 公司于 2025 年 10 月 29 日召开第十届董事会第十四次会议，审议通过了《关 于公开挂牌转让全资子公司——铜陵市峰华电子有限公司 100%股权的议案》， 同意公司委托产权交易机构公开挂牌转让所持有的峰华电子 100%股权，具体内 容详 ...

Market Overview - The component sector increased by 0.55% on December 23, with Weirgao leading the gains [1] - The Shanghai Composite Index closed at 3919.98, up 0.07%, while the Shenzhen Component Index closed at 13368.99, up 0.27% [1] Top Gainers in the Component Sector - Weirshan (301251) closed at 55.01, up 6.96%, with a trading volume of 85,500 shares and a transaction value of 466 million [1] - Qiangda Circuit (301628) closed at 96.10, up 5.41%, with a trading volume of 60,500 shares and a transaction value of 575 million [1] - Jianghai Co., Ltd. (002484) closed at 29.25, up 4.73%, with a trading volume of 480,400 shares and a transaction value of 1.397 billion [1] - Huazheng New Materials (603186) closed at 44.69, up 4.46%, with a trading volume of 79,800 shares and a transaction value of 353 million [1] - Shenghong Technology (300476) closed at 308.00, up 3.44%, with a trading volume of 404,700 shares and a transaction value of 12.491 billion [1] Top Losers in the Component Sector - Junya Technology (603386) closed at 14.80, down 6.51%, with a trading volume of 306,400 shares and a transaction value of 470 million [2] - Gaohua Technology (688539) closed at 42.36, down 4.36%, with a trading volume of 80,700 shares [2] - Dali Cap (301566) closed at 19.00, down 3.75%, with a trading volume of 220,000 shares and a transaction value of 422 million [2] Capital Flow Analysis - The component sector experienced a net outflow of 371 million from main funds, while retail investors saw a net inflow of 471 million [2] - The main funds' net inflow and outflow for specific stocks include: - Shenghong Technology (300476) had a net inflow of 533 million [3] - Jianghai Co., Ltd. (002484) had a net inflow of 82 million [3] - Qiangda Circuit (301628) had a net inflow of 49 million [3]

证券代码：600237 证券简称：铜峰电子 公告编号：2025-048 | 剩余被质押股份数量（万股） | 2,293 | | --- | --- | | 剩余被质押股份数量占其所持股份比例(%) | 15.49 | | 剩余被质押股份数量占公司总股本比例(%) | 3.64 | 安徽铜峰电子股份有限公司 关于控股股东部分股份解质及再质押的公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 安徽铜峰电子股份有限公司（以下简称"公司"）控股股东铜陵中旭产 业投资有限公司（以下简称"中旭产投"）目前持有公司148,012,357股,占公司 总股本的23.47%。中旭产投本次解除质押7,070,000股、延期购回22,930,000股， 并再质押20,070,000股后，累计质押股份数为43,000,000 股，占其持有公司股 份总数的29.05%，占公司总股本的6.82%。 公司于近日获悉控股股东中旭产投将所持公司的部分股份办理了解除质押、 质押延期购回及再质押登记手续，具体情况如下： 一、上市公司股份 ...

每经头条（nbdtoutiao）——海南封关首日直击：为中国探路，全球最大自贸港如何重塑开放边界？ （记者 曾健辉） 2025年1至6月份，铜峰电子的营业收入构成为：电子元件制造业占比97.7%，其他业务占比2.3%。 截至发稿，铜峰电子市值为56亿元。 每经AI快讯，铜峰电子（SH 600237，收盘价：8.93元）12月19日晚间发布公告称，截至本公告日，中 旭产投累计质押股数为4300万股，占其所持股份比例为29.05%。 ...

铜峰电子公告，控股股东铜陵中旭产业投资有限公司解除质押707万股、延期购回2293万股，并再质押 2007万股后，累计质押股份数为4300万股，占其持有公司股份总数的29.05%，占公司总股本的6.82%。 ...

Market Performance - The main board saw significant gains with notable stocks such as Copper Peak Electronics (+10.04%), Xilong Science (+10.00%), and Dongfang Communication (+9.98%) leading the charge [1] - The ChiNext board experienced a surge, highlighted by Guoci Materials (+20.02%) and LianTe Technology (+15.87%) [1] - The Sci-Tech Innovation board also performed well, with Jingfeng Mingyuan (+20.00%) and Yandong Micro (+16.84%) among the top gainers [1] - Active sub-industries included SW Electronic Chemicals III (+4.36%) and SW Semiconductor Equipment (+3.55%) [1] Domestic News - Taiwan's Industrial Technology Research Institute announced the development of the region's first full-color high-resolution Micro LED AI smart glasses, featuring a 0.49-inch display with 1920x1080 FULL HD resolution and over 3000 nits brightness [1] - Shanghai Jiao Tong University and Guoxing Aerospace signed an agreement to establish China's first space computing joint laboratory, focusing on autonomous space computing chip development and related technologies [1] - Goer Group and Haier Group signed a strategic cooperation agreement to collaborate on smart home, health, and digital economy sectors, leveraging Goer's expertise in precision components and smart manufacturing [1] - According to BCI's report, Huawei's smartphone market share is projected to reach 27.81% by the 48th week of 2025, significantly ahead of Apple's 17.12% [1] Company Announcements - Electric Science and Technology Network announced a significant decrease in expected daily related transactions for 2026, with actual transactions for 2025 being 283.25 million yuan compared to an expected 1.17385 billion yuan [3] - Chip Origin announced progress in acquiring Zhudian Semiconductor, with a capital increase of 350 million yuan for the acquisition [3] - Yunding Technology projected daily related transactions for 2026 to be approximately 1.355 billion yuan, with actual transactions expected to be around 1.484 billion yuan [3] - Aisino Security reported receiving a government subsidy of 1 million yuan, classified as a revenue-related government grant [3] International News - Dell plans to increase prices for its commercial product line by approximately 10%-30% starting December 17, depending on computer configuration [1] - STMicroelectronics secured a new credit line of 1 billion euros from the European Investment Bank, with 60% allocated for enhancing manufacturing capabilities [1] - SK Hynix ordered seven sets of thermal compression bonding machines from ASMPT for HBM4 production, a critical technology for ensuring product yield and performance [1] - Kioxia plans to start producing next-generation NAND flash memory chips in Iwate Prefecture in 2026, increasing storage capacity by 59% and data transfer speed by 33% [1]