Core Viewpoint - OmniVision Group, formerly known as Weir Shares, is a fabless semiconductor design company that has submitted an application for a Hong Kong IPO, joining a list of A-share companies with a market capitalization exceeding 100 billion RMB [1] Company Background - Founded in 2007 by Yu Renrong, Weir Shares primarily engaged in semiconductor distribution and design, and was listed on the Shanghai Stock Exchange in May 2017 [2] - The acquisition of OmniVision Technologies in August 2019 allowed Weir Shares to enter the CMOS image sensor (CIS) market, significantly increasing its design business revenue [3] - Following the acquisition, Weir Shares rebranded as OmniVision Group in June 2025, with revenue reaching 25.707 billion RMB in 2024, of which 19.190 billion RMB (74.65%) came from image sensor solutions [4] Market Opportunities - The global CIS market is highly concentrated, with the top five players holding 84.1% of the market share; OmniVision Group ranks among the top three with a market share of 13.7% in 2024 [6] - The smartphone sector is the largest application area for CIS, accounting for over 65% of the market, while the automotive sector is the fastest-growing application area [6] - OmniVision Group is the largest player in the automotive CIS market, holding a 32.9% market share, benefiting from the rising penetration of smart vehicles in China [7] - The company is also making progress in medical, security, machine vision, and smart glasses sectors, positioning itself to capture growth in these rapidly developing areas [8]

Core Viewpoint - The announcement details the conversion of convertible bonds and the results of the stock option incentive plan for Haowei Integrated Circuit (Group) Co., Ltd, highlighting the low conversion rate of bonds and the significant participation in the stock option plan [1]. Convertible Bond Conversion Situation - As of June 30, 2025, a total of 7,535,000 CNY of "Weier Convertible Bonds" have been converted into company shares, resulting in 34,651 shares, which is 0.004% of the total shares before conversion [1]. - In Q2 2025, the conversion amount was 250,000 CNY, leading to 1,538 shares being formed [1]. - The remaining unconverted "Weier Convertible Bonds" amount to 2,432,461,000 CNY, representing 99.69% of the total issuance [1]. Stock Option Incentive Plan - The stock option incentive plan was approved on September 15, 2023, with 2,126 individuals granted a total of 12,280,000 stock options [3]. - By Q2 2025, 77.80% of the total options were exercised, with 220,823 shares being issued from the plan [5]. - The stock options' exercise price was adjusted to 78.63 CNY per share following the mid-term profit distribution in 2024 [4].

| 证券代码：603501 | 证券简称：豪威集团 | 公告编号：2025-071 | | --- | --- | --- | | 转债代码：113616 | 转债简称：韦尔转债 | | 豪威集成电路（集团）股份有限公司 关于可转债转股及股权激励计划自主行权结果 暨股份变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 可转债转股情况：豪威集成电路（集团）股份有限公司（以下简称"公 司"）截至 2025 年 6 月 30 日，累计共有 7,535,000 元"韦尔转债"转换为公司股 票，累计因转股形成的股份数量为 34,651 股，占"韦尔转债"转股前公司已发 行股份总额的 0.004%。其中，2025 年第二季度，转股金额为 250,000 元，因转 股形成的股份数量为 1,538 股。截至 2025 年 6 月 30 日，尚未转股的"韦尔转债" 金额为 2,432,461,000 元，占可转债发行总额的 99.69%。 期权自主行权情况：2025 年第二季度，公司股票期权激励计划通过自主 行权方式已在 ...

Core Viewpoint - Howie Group has submitted an application for H-share listing on the Hong Kong Stock Exchange, aiming to enhance its market presence and capitalize on growth opportunities in the semiconductor industry [1]. Group 1: Company Overview - Howie Group, formerly known as Shanghai Weir Semiconductor Co., Ltd., was renamed to align with its strategic planning and business operations [2]. - The company is the third-largest digital image sensor supplier globally, with a market share of 10.5% in the smartphone CMOS image sensor (CIS) sector for 2024 [1]. - Howie Group is the largest automotive CIS supplier, holding a significant market share of 32.9% in 2024 [1]. Group 2: Financial Performance - In 2024, Howie Group reported revenue of approximately 25.707 billion RMB, representing a year-on-year growth of 22.51% [1]. - The company's gross profit reached about 7.239 billion RMB, with a substantial increase of 73.04% compared to the previous year [1]. - Net profit for 2024 was approximately 3.279 billion RMB, showing an impressive growth of 502.75% year-on-year [1]. Group 3: Business Segments - Howie Group operates in three main product lines: image sensor solutions, display solutions, and analog solutions [1]. - The company has been increasing its R&D investment and actively expanding its market presence, contributing to its strong financial performance [1].

Core Viewpoint - 豪威集团 has submitted a listing application to the Hong Kong Stock Exchange, with UBS, CICC, PASCHK, and GFSHK as joint sponsors [1] Company Overview - According to Frost & Sullivan, 豪威集团 is one of the top ten fabless semiconductor companies globally by revenue in 2024, focusing on three main product lines: image sensor solutions, display solutions, and analog solutions [4] - The company is recognized as a pioneer in image sensor technology and is the third-largest supplier of digital image sensors globally, with a significant market share in the smartphone CIS sector at 10.5% [4] - In the automotive CIS sector, 豪威集团 is the largest supplier with a market share of 32.9% in 2024 [5] Product Development - The company launched the OV50X image sensor for flagship smartphones in April 2025, featuring LOFIC technology for high dynamic range imaging [4] - In June 2024, 豪威集团 introduced the OCH2B30 camera module for 3D dental scanning, aiming to replace traditional dental impressions [5] - The company established a machine vision department in 2024 and released the OG09A10 global shutter solution for factory automation [5] Financial Performance - For the fiscal years 2022, 2023, and 2024, 豪威集团 reported revenues of approximately 20.04 billion, 20.98 billion, and 25.71 billion RMB, respectively, with gross profits of 4.74 billion, 4.18 billion, and 7.24 billion RMB [6][7] - The gross margin for 2022 was 23.7%, which decreased to 19.9% in 2023, before increasing to 28.1% in 2024 [7]

豪威集成电路（集团）股份有限公司（以下简称"公司"）已于 2025 年 6 月 27 日向香港联合交易所有限公司（以下简称"香港联交所"）递交了发行境外 上市股份（H 股）并在香港联交所主板挂牌上市（以下简称"本次发行上市"） 的申请，并于同日在香港联交所网站刊登了本次发行上市的申请资料。本次发行 上市事项的相关申请资料为公司按照香港证券及期货事务监察委员会（以下简称 "香港证监会"）和香港联交所的要求编制和刊发，为草拟版本，且所载资料可 能会适时作出更新及修订。 鉴于本次发行上市的认购对象仅限于符合相关条件的境外投资者及依据中 国相关法律法规有权进行境外证券投资的境内合格投资者，公司将不会在境内证 券交易所的网站和符合境内监管机构规定条件的媒体上刊登该申请资料，但为使 境内投资者及时了解该等申请资料披露的本次发行上市以及公司的其他相关信 息，现提供该申请资料在香港联交所网站的查询链接供查阅： 中文：https://www1.hkexnews.hk/app/sehk/2025/107490/documents/sehk25062 702010_c.pdf | 证券代码：603501 | 证券简称：豪威集团 公 ...

Group 1 - The core viewpoint of the news highlights the performance of the digital economy theme index and its constituent stocks, indicating a positive trend in the market with specific stocks showing significant gains [1][2] - The digital economy ETF closely tracks the index, focusing on self-controllable technology and financial technology, with the electronic and computer sectors holding a combined weight of 82% [2][3] - The top ten constituent stocks of the index account for 50.98% of the total weight, with notable companies like 东方财富 (Orient Securities) and 中芯国际 (SMIC) leading the list [3][5] Group 2 - The digital economy ETF has seen a significant increase in scale, growing by 11.86 million yuan over the past week, ranking it in the top half among comparable funds [3] - The ETF's share volume increased by 6 million shares in the last month, also placing it in the top half of comparable funds [3] - The anticipated release of the DeepSeek R2 version is expected to enhance the AI industry's capabilities, benefiting the entire AI value chain [1]

Core Viewpoint - The company, OmniVision Integrated Circuits Group, has undergone a name change and is set to issue convertible bonds totaling RMB 2.44 billion, with a structured interest rate over six years, reflecting a strong financial performance and strategic growth in the semiconductor industry [1][8]. Section 1: Bond Issuance Details - The company has been approved to issue convertible bonds with a total face value of RMB 2.44 billion [1]. - The bonds will have a six-year term with an annual interest rate starting at 0.20% and increasing to 2.00% by the sixth year [1][5]. - The initial conversion price is set at RMB 222.83 per share, subject to adjustments based on corporate actions [1][12]. Section 2: Financial Performance - The company reported a significant increase in revenue, achieving RMB 25.73 billion in 2024, a 22.41% increase from the previous year [9][10]. - Net profit surged to RMB 332.32 million, marking a 498.11% increase year-on-year [10]. - The gross profit margin improved due to product optimization and supply chain efficiency [9]. Section 3: Use of Proceeds - The proceeds from the bond issuance will be allocated to various projects, including the expansion of wafer testing and packaging facilities, with a total investment of RMB 354.33 million [11]. - As of the end of 2024, RMB 204.22 million of the raised funds has been utilized for the intended projects [11]. Section 4: Credit Rating - The company and its bonds have received a credit rating of AA+ from Shanghai New Century Credit Rating Co., indicating a stable outlook [8][10]. Section 5: Market Position - The semiconductor industry is experiencing an upward cycle, with the company capitalizing on growth opportunities in high-end smartphone markets and automotive intelligence [9]. - The company’s semiconductor design business generated RMB 21.64 billion, accounting for 15.34% of total revenue, reflecting a 32.62% increase from the previous year [10].

证券代码：603501 证券简称：豪威集团 债券代码：113616 债券简称：韦尔转债 豪威集成电路（集团）股份有限公司 公开发行可转换公司债券 受托管理事务报告 （2024 年度） 债券受托管理人 （住所：深圳市福田区福田街道益田路 5023 号平安金融中心 B 座第 22-25 层） 二〇二五年六月 特别说明 豪威集成电路（集团）股份有限公司于 2025年 5月 19日召开第六届董事会 第四十五次会议，审议通过了《关于变更公司名称及证券简称的议案》，同意 公司名称由上海韦尔半导体股份有限公司变更为豪威集成电路（集团）股份有 限公司，证券简称由"韦尔股份"变更为"豪威集团"，证券代码保持不变。 上述事项已经公司于 2025 年 6 月 10 日召开的 2024 年年度股东大会审议通过。 2025 年 5 月 20 日，发行人发布《关于拟变更公司名称、证券简称的公告》。 2025 年 6 月 17 日，发行人发布《关于完成公司名称变更暨完成工商登记的 公告》和《关于证券简称变更的实施公告》，已完成相关工商变更登记手续， 并取得了上海市市场监督管理局换发的营业执照，证券简称将于 2025 年 6 月 20 日起 ...

| 证券代码：603501 | 证券简称：豪威集团 公告编号：2025-068 | | --- | --- | | 转债代码：113616 | 转债简称：韦尔转债 | 豪威集成电路（集团）股份有限公司 关于不向下修正"韦尔转债"转股价格的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 截至 2025 年 6 月 24 日，豪威集成电路（集团）股份有限公司（以下简 称"公司"）已触发"韦尔转债"转股价格向下修正条款，经公司第七届董事会第二 次会议审议，公司董事会决定本次不行使向下修正"韦尔转债"转股价格的权利， 且在董事会审议通过之日起 6 个月内（即 2025 年 6 月 24 日至 2025 年 12 月 23 日），如再次触发"韦尔转债"转股价格向下修正条款，亦不提出向下修正方案。 自 2025 年 12 月 24 日起首个交易日重新开始计算，若"韦尔转债"再次 触发转股价格向下修正条款，公司董事会将再次召开会议决定是否行使"韦尔转 债"转股价格的向下修正权利。 （一）"韦尔转债"基本情况 经中国证券 ...