Group 1 - The company,豪威集团, announced an adjustment in the conversion price of its "韦尔转债" (Weir Convertible Bonds) from the original 161.84 CNY per share to 159.38 CNY per share [1] - The adjusted conversion price will take effect starting January 14, 2026 [1] - The conversion of "韦尔转债" will be suspended on January 13, 2026, and will resume on January 14, 2026 [1]

Core Viewpoint - OmniVision Integrated Circuits Group (豪威集团) successfully listed on the Hong Kong Stock Exchange, closing at HKD 121.80 with a 16.22% increase on the first day of trading [1]. Group 1: Company Overview - OmniVision is a global fabless semiconductor design company, primarily focused on CMOS image sensors (CIS) [2]. - The company issued a total of 45,800,000 shares, with 4,580,000 shares available for public offering in Hong Kong and 41,220,000 shares for international offering [2][3]. Group 2: Financial Details - The final offering price was HKD 104.8 per share, raising a total of HKD 4,799.8 million, with a net amount of HKD 4,693.2 million after deducting estimated listing expenses of HKD 106.7 million [3][4]. - The funds raised will be used for investment in key technology R&D, enhancing global market penetration, business expansion, strategic investments and/or acquisitions, working capital, and general corporate purposes [4]. Group 3: Key Investors - Major cornerstone investors include Wildlife Willow Limited, UBS Asset Management (Singapore) Ltd., Formosa Opportunity Limited, and others, collectively acquiring 20,740,200 shares, representing 45.28% of the total shares allocated [6][7]. Group 4: Revenue and Profit Projections - Projected revenues for OmniVision for the years ending December 31 for 2022, 2023, and 2024 are RMB 20,040.2 million, RMB 20,984.3 million, and RMB 25,706.8 million, respectively [8]. - The projected net profits for the same periods are RMB 951.0 million, RMB 544.0 million, and RMB 3,278.6 million, respectively [9].

Core Viewpoint - The company,豪威集团, announced an adjustment to the conversion price of its "韦尔转债" due to a new share issuance, changing from 161.84 CNY per share to 159.38 CNY per share, effective from January 14, 2026 [1] Summary by Relevant Sections - **Share Issuance Impact** The adjustment in the conversion price is a direct result of the company's new share issuance [1] - **Conversion Price Details** The new conversion price of "韦尔转债" will be 159.38 CNY per share, down from the previous price of 161.84 CNY per share [1] - **Effective Dates** The adjusted conversion price will take effect on January 14, 2026, with the conversion of "韦尔转债" ceasing on January 13, 2026, and resuming on January 14, 2026 [1]

格隆汇1月12日丨豪威集团(00501.HK)发布公告，经香港联交所批准，公司本次发行的4580万股H股股 票(行使超额配售权之前)于2026年1月12日在香港联交所主板挂牌并上市交易。公司H股股票中文简称 为"豪威集团"，英文简称为"OMNIVISION"，股份代号为"0501"。 ...

| 证券代码：603501 | 证券简称：豪威集团 | 公告编号：2026-004 | | --- | --- | --- | | 转债代码：113616 | 转债简称：韦尔转债 | | 豪威集成电路（集团）股份有限公司 关于H股挂牌并上市交易暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 经香港联交所批准，公司本次发行的45,800,000股H股股票（行使超额配售 权之前）于2026年1月12日在香港联交所主板挂牌并上市交易。公司H股股票中 文简称为"豪威集团"，英文简称为"OMNIVISION"，股份代号为"0501"。 本次发行上市前（截至2026年1月11日），公司的总股本为1,209,915,575股。 本次发行上市完成后，公司的股份变动情况如下： | 股东类别 | 本次发行上市前 | 本次发行上市后 | | | | | | --- | --- | --- | --- | --- | --- | --- | | | | 假设超额配股权未获行使 | | | 假设超额配售权悉数行使 | | | | 持股 ...

格隆汇1月12日丨豪威集团(603501.SH)公布，经香港联交所批准，公司本次发行的45,800,000股H股股票 （行使超额配售权之前）于2026年1月12日在香港联交所主板挂牌并上市交易。公司H股股票中文简称 为"豪威集团"，英文简称为"OMNIVISION"，股份代号为"0501"。 ...

| 证券代码：603501 | 证券简称：豪威集团 | 公告编号：2026-005 | | --- | --- | --- | | 转债代码：113616 | 转债简称：韦尔转债 | | 豪威集成电路（集团）股份有限公司 关于可转换公司债券转股价格调整暨转股停牌的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 因公司已于 2026 年 1 月 12 日在香港联合交易所有限公司（以下简称"香港 联交所"）挂牌并上市交易,本公司的相关证券停复牌情况如下： 公司本次全球发售 H 股总数为 45,800,000 股（行使超额配售权之前），其中， 香港公开发售 4,580,000 股，约占全球发售总数的 10%（行使超额配售权之前）； 国际发售 41,220,000 股，约占全球发售总数的 90%（行使超额配售权之前）。本次 H 股发行的价格为每股 104.80 港元（折合人民币约 94.28 元/股），并已于 2026 年 1 月 12 日在香港联交所挂牌并开始上市交易。 根据公司《公开发行可转换公司债券募集说明 ...

格隆汇1月12日丨豪威集团(603501.SH)公布，经香港联交所批准，公司本次发行的45,800,000股H股股票 （行使超额配售权之前）于2026年1月12日在香港联交所主板挂牌并上市交易。公司H股股票中文简称 为"豪威集团"，英文简称为"OMNIVISION"，股份代号为"0501"。 ...

Group 1 - The company announced a global offering of 45.8 million H-shares, with 4.58 million shares allocated for public offering in Hong Kong, accounting for 10% of the total [1] - The international offering consists of 41.22 million shares, representing 90% of the total [1] - The offering price per share is set at HKD 104.80, with expected net proceeds of approximately HKD 4.742 billion [1] Group 2 - The H-shares are scheduled to be listed on the main board of the Hong Kong Stock Exchange in 2026 [1] - Prior to the offering, the total share capital of the company is 1.21 billion shares, which will increase to 1.256 billion shares if the over-allotment option is not exercised [1] - If the over-allotment option is fully exercised, the total share capital will rise to 1.263 billion shares, with the shareholding ratios for A-shares and H-shares being 95.83% and 4.17% respectively [1]

Core Viewpoint - The company, OmniVision Technologies, officially listed on the Hong Kong Stock Exchange on January 12, 2025, with a closing price of HKD 121.8, marking a 16.22% increase from its offering price, and a market capitalization exceeding HKD 152.9 billion [1] Group 1: Company Performance - In the first three quarters of 2025, the company achieved revenue of CNY 21.783 billion, a year-on-year increase of 15.20%, and a net profit attributable to shareholders of CNY 3.210 billion, up 35.15% year-on-year [3] - The company's image sensor business in emerging markets such as smart glasses, panoramic cameras, and machine vision generated approximately CNY 1.173 billion in revenue in the first half of 2025, reflecting a significant year-on-year growth of 249.42% [5] Group 2: Market Position and Trends - The company holds the largest market share in the global automotive CIS market and ranks third in the global smartphone CIS market, indicating a strong competitive position [1] - The automotive image sensor market is experiencing growth, driven by the demand for advanced driver assistance systems (ADAS) and autonomous driving applications [2] - The company is actively developing high-resolution image sensors, including a 50-megapixel sensor set to be mass-produced in the second half of 2025, catering to the high-end smartphone market [2] Group 3: Industry Dynamics - The CIS market is becoming increasingly competitive, with domestic manufacturers catching up to international leaders due to improved supply chains and technological advancements [4] - The demand for higher pixel image sensors is expected to grow, with the market for 200-megapixel sensors entering a new development phase [2] - The industry faces uncertainties related to storage chip prices and supply capacity, which could impact future growth [5][6]