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立昂微:暂无碳化硅衬底材料的研发
Ge Long Hui· 2025-09-08 11:04
Group 1 - The company, Lian Micro (605358.SH), currently does not have research and development activities focused on silicon carbide substrate materials [1] - The company's R&D expenditures are primarily concentrated on three main business areas: semiconductor silicon wafers, semiconductor power device chips, and compound semiconductor RF and optoelectronic chips [1]
立昂微:立昂东芯6英寸碳化硅基氮化镓产品下半年将有望实现出货
Zheng Quan Shi Bao Wang· 2025-09-08 10:27
Core Viewpoint - Lian Micro (605358) has successfully validated its 6-inch silicon carbide gallium nitride products with customers, expecting shipments in the second half of the year, primarily for applications in aerospace, large communication bases, high-speed trains, and defense markets [1] Group 1: Company Advantages - The company possesses competitive advantages over peers due to its automated production lines and compatibility with gallium arsenide, which helps reduce costs and failure rates [1] - Technologically, the company has leveraged its experience in power electronics, particularly in passivation and high-voltage devices, leading to significant improvements [1]
立昂微(605358.SH)生产半导体硅片所需的材料为电子级多晶硅
Ge Long Hui· 2025-09-08 10:25
Group 1 - The core viewpoint of the article is that Lian Microelectronics (605358.SH) has confirmed the stability of the procurement price for electronic-grade polysilicon, which is essential for semiconductor wafer production [1] Group 2 - The company produces semiconductor wafers and relies on electronic-grade polysilicon as a key material [1] - The current procurement price of electronic-grade polysilicon remains stable, indicating a potentially favorable cost environment for the company [1]
立昂微(605358.SH):暂无碳化硅衬底材料的研发
Ge Long Hui· 2025-09-08 10:25
Group 1 - The company, Lian Micro (605358.SH), currently does not have research and development activities for silicon carbide substrate materials [1] - The company's R&D expenditures are primarily focused on three main business areas: semiconductor silicon wafers, semiconductor power device chips, and compound semiconductor RF and optoelectronic chips [1]
立昂微(605358.SH):暂无磷化铟产品出货
Ge Long Hui· 2025-09-08 10:25
Group 1 - The core viewpoint of the article is that Lian Micro (605358.SH) has confirmed its focus on pHEMT chips for low Earth orbit satellite applications, indicating a strategic direction in the semiconductor industry [1] - The company currently does not have any shipments of indium phosphide products, highlighting a specific area of product development that is not yet realized [1]
立昂微(605358.SH):立昂东芯6英寸碳化硅基氮化镓产品通过客户验证
Ge Long Hui· 2025-09-08 10:25
格隆汇9月8日丨立昂微(605358.SH)在投资者互动平台表示,立昂东芯6英寸碳化硅基氮化镓产品通过客 户验证,下半年将有望实现出货,目前多应用在航空航天、大型通讯基站、高铁机车、防卫市场等领 域。公司相比同行的竞争优势是公司的自动化产线与砷化镓兼容,可降低成本和故障率,技术方面柔和 了PED在电力电子方面的积累,在钝化和高压器件方面有较好的改善。 ...
立昂微(605358.SH):低阻重掺硅片产品已广泛应用于AI服务器的不间断电源
Ge Long Hui· 2025-09-05 07:42
Core Viewpoint - The company, Lian Micro (605358.SH), is focusing on its 12-inch silicon wafer products, particularly heavy-doped epitaxial wafers, which are competitive in both domestic and international markets [1] Group 1: Product and Technology - The company's 12-inch silicon wafer products include lightly doped polished wafers and heavily doped epitaxial wafers [1] - The subsidiary, Jinruihong, possesses globally leading production technology for certain heavy-doped epitaxial wafers, which are a key product for the company [1] Group 2: Market Demand and Applications - The heavy-doped silicon wafers, specifically the heavy-doped arsenic and phosphorus epitaxial wafers, have a strong order backlog due to their technological advantages [1] - The products are widely used in uninterruptible power supplies for AI servers, driven by the growing demand from AI and computing power sectors [1] Group 3: Future Outlook - The company aims to leverage its technological advantages to expand its presence in the 12-inch heavy-doped silicon wafer market, addressing the increasing market demand and enhancing economic benefits [1]
立昂微(605358.SH):立昂东芯可为激光雷达厂商客户提供VCSEL芯片代工服务
Ge Long Hui· 2025-09-05 07:42
Core Viewpoint - Lian Microelectronics (605358.SH) focuses on compound semiconductor RF and optoelectronic chip foundry services, specifically providing VCSEL chip foundry services for LiDAR manufacturers, without directly competing in the downstream LiDAR market [1] Group 1 - Lian Dongxin is one of only two global suppliers capable of producing two-dimensional addressable VCSEL chips, indicating a technological leadership in the VCSEL chip foundry market [1] - The company is actively advancing low-cost process research and development, as well as domestic material substitution, to enhance its competitiveness [1]
立昂微:低阻重掺硅片产品已广泛应用于AI服务器的不间断电源
Ge Long Hui· 2025-09-05 07:35
Core Viewpoint - The company, Lian Microelectronics (605358.SH), is focusing on its 12-inch silicon wafer products, particularly heavy-doped epitaxial wafers, which are competitive in both domestic and international markets [1] Group 1: Product Overview - The company's 12-inch silicon wafer products include lightly doped polished wafers and heavily doped epitaxial wafers [1] - The subsidiary, Jinruihong, possesses globally leading production technology for certain heavy-doped epitaxial wafers, which are a key product for the company [1] Group 2: Market Demand and Applications - The heavy-doped silicon wafers, specifically the heavy-doped arsenic and phosphorus epitaxial wafers, are in high demand due to their technological advantages and have a sufficient order backlog [1] - The products are widely used in uninterruptible power supplies for AI servers, driven by the growing demand from AI and computing power sectors [1] Group 3: Future Strategy - The company aims to leverage its technological advantages to expand its presence in the 12-inch heavy-doped silicon wafer market, addressing the increasing market demand and enhancing economic benefits [1]
立昂微(605358.SH):12英寸硅片已覆盖14nm以上技术节点逻辑电路和存储电路
Ge Long Hui· 2025-09-05 07:35
Core Viewpoint - Lian Microelectronics (605358.SH) has announced that its 12-inch silicon wafers now cover technology nodes of 14nm and above, including logic circuits, memory circuits, image sensors, and power devices as required by customers [1] Group 1 - The company has successfully developed 12-inch silicon wafers that meet the demands of advanced technology nodes [1] - The technology nodes covered include both logic and memory circuits, indicating a broad application range [1] - The company is also addressing customer needs for image sensor devices and power devices within these technology nodes [1]