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半导体板块7月31日跌1.06%,芯源微领跌,主力资金净流出38.65亿元
Zheng Xing Xing Ye Ri Bao· 2025-07-31 08:37
证券之星消息,7月31日半导体板块较上一交易日下跌1.06%,芯源微领跌。当日上证指数报收于 3573.21,下跌1.18%。深证成指报收于11009.77,下跌1.73%。半导体板块个股涨跌见下表: | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 688110 | 东芯股份 | 64.76 | 19.99% | 31.93万 | 20.00亿 | | 688498 | XD源杰科 | 239.79 | 5.90% | 5.02万 | 12.23亿 | | 688409 | 富创精密 | 58.09 | 5.54% | 11.51万 | 6.74亿 | | 688270 | 坛省科技 | 51.86 | 4.14% | 12.29万 | 6.43亿 | | 688256 | 寒武纪 | 709.50 | 3.62% | 11.77万 | 83.34亿 | | 301678 | 新恒汇 | 67.02 | 3.11% | 17.15万 | 11.33亿 | | 688766 | 普典股份 | 69 ...
芯源微(688037)7月30日主力资金净流出4380.48万元
Sou Hu Cai Jing· 2025-07-30 15:18
天眼查商业履历信息显示,沈阳芯源微电子设备股份有限公司,成立于2002年,位于沈阳市,是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本20113.8646万人民币,实缴资本 6299.997万人民币。公司法定代表人为邓晓军。 金融界消息 截至2025年7月30日收盘,芯源微(688037)报收于119.48元,下跌1.04%,换手率2.07%, 成交量4.16万手,成交金额4.95亿元。 资金流向方面,今日主力资金净流出4380.48万元,占比成交额8.85%。其中,超大单净流出1654.61万 元、占成交额3.34%,大单净流出2725.87万元、占成交额5.51%,中单净流出流入1550.71万元、占成交 额3.13%,小单净流入2829.77万元、占成交额5.72%。 芯源微最新一期业绩显示,截至2025一季报,公司营业总收入2.75亿元、同比增长12.74%,归属净利润 466.00万元,同比减少70.89%,扣非净利润4006.80万元,同比减少564.25%,流动比率2.615、速动比率 1.410、资产负债率50.24%。 通过天眼查大数据分析,沈阳芯源微电子设备股份有限公 ...
芯源微法定代表人变更为邓晓军
Sou Hu Cai Jing· 2025-07-30 12:04
资料显示,沈阳芯源微电子设备股份有限公司法定代表人为邓晓军,成立于2002年,位于沈阳市,是一 家以从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本20113.8646万人民币,实缴资 本6299.997万人民币。 近日,天眼查APP显示,沈阳芯源微电子设备股份有限公司(简称"芯源微")法定代表人发生变更,从 宗润福变为邓晓军。 通过天眼查大数据分析,沈阳芯源微电子设备股份有限公司共对外投资了6家企业,参与招投标项目321 次,知识产权方面有商标信息32条,专利信息609条,此外企业还拥有行政许可63个。 来源:金融界 ...
势银研究 | 本土成熟制程庞大体量驱动中国半导体设备快速进步
势银芯链· 2025-07-30 03:32
Core Viewpoint - The semiconductor industry in China is transitioning from a global cooperative model to a regional strategic industry due to geopolitical factors, with significant growth in domestic wafer production capacity expected in the coming years [2][3]. Group 1: Market Trends - By 2024, China's mainland wafer production capacity is projected to account for nearly 25% of the global total, increasing to 31% by 2029, indicating a strong demand signal for local semiconductor equipment manufacturers [2]. - The equipment market size for wafer fabrication in mainland China is expected to reach $41.2 billion in 2024, leading other regions globally. However, a decline of 5% to $39 billion is anticipated in 2025 due to prior expansions and equipment stockpiling [2]. Group 2: Competitive Landscape - The impressive performance of equipment manufacturers in mainland China is attributed to their enhanced technological competitiveness and market development capabilities, supported by strong backing from the government and clients [3]. Group 3: Industry Players - A detailed table lists various companies involved in different process nodes, highlighting key players in the semiconductor equipment sector, such as North Huachuang, SMIC, and others, across various technologies [4].
12股今日获机构买入评级





Zheng Quan Shi Bao Wang· 2025-07-24 11:01
Group 1 - A total of 12 stocks received buy ratings from institutions today, with Baolingbao, Puluo Pharmaceutical, and Xinyuanwei being newly covered by institutions [1] - Among the stocks rated, the average increase was 1.14%, outperforming the Shanghai Composite Index, with notable gainers including Xinyuanwei, Shantui, and Hanyi, which rose by 5.56%, 4.41%, and 4.09% respectively [1] - The stocks with the largest declines included Jinbo Biological, Baofeng Energy, and Miao Exhibition, which fell by 2.14%, 1.70%, and 1.60% respectively [1] Group 2 - The newly rated stocks include Puluo Pharmaceutical with a strong buy rating from Huachuang Securities, and Baolingbao with an increase rating from Guotai Haitong [2] - The target price for Puluo Pharmaceutical is set at 22.00 yuan, while Baolingbao has a target price of 16.30 yuan [2] - Other stocks receiving buy ratings include Miaokelan Duo, Tielong Logistics, and Gole Technology, with target prices of 33.00 yuan, 7.09 yuan, and unspecified respectively [2]
百元股数量达99只 ,较上一日增加4只
Zheng Quan Shi Bao Wang· 2025-07-24 09:21
Group 1 - The average stock price of A-shares is 12.39 yuan, with 99 stocks priced over 100 yuan, an increase of 4 from the previous trading day [1] - The Shanghai Composite Index closed at 3605.73 points, up 0.65%, while stocks priced over 100 yuan had an average increase of 1.24%, outperforming the index by 0.58 percentage points [1] - The highest closing price among stocks over 100 yuan is Kweichow Moutai at 1491.50 yuan, up 1.08%, followed by Cambrian and BYD at 600.23 yuan and 342.72 yuan respectively [1] Group 2 - In the past month, stocks priced over 100 yuan have averaged a 12.79% increase, compared to a 6.63% rise in the Shanghai Composite Index [2] - The top performers in this category include Borui Pharmaceutical, New Yisheng, and Jingpin Special Equipment, with increases of 77.87%, 61.07%, and 59.38% respectively [2] - Year-to-date, the average increase for these stocks is 33.45%, outperforming the Shanghai Composite Index by 25.87% [2] Group 3 - The electronic, pharmaceutical, and computer industries are the most concentrated among stocks priced over 100 yuan, with 30.30% from electronics, 15.15% from pharmaceuticals, and 14.14% from computers [2] - Among the stocks priced over 100 yuan, 25 are from the main board, 27 from the ChiNext board, 3 from the Beijing Stock Exchange, and 44 from the Sci-Tech Innovation Board, making up 44.44% of the total [2] - Two stocks, Chip Source Micro and Jinbo Biological, received buy ratings from institutions today, with Chip Source Micro being newly covered [2]
芯源微(688037):国内领先大湿法设备厂商,北方华创获得控制权再添新动能
Hua Yuan Zheng Quan· 2025-07-24 05:22
Investment Rating - The report assigns a "Buy" rating for the company, marking its first coverage [5]. Core Views - The company, Xinyuan Micro (芯源微), is a leading domestic manufacturer of large wet processing equipment, focusing on providing comprehensive solutions for semiconductor front-end and back-end equipment and processes. The company has optimized its product layout, forming a product matrix that includes front-end coating and developing equipment, front-end cleaning equipment, back-end advanced packaging equipment, and other small-sized devices [5][8]. - The company has successfully developed various models of front-end coating and developing equipment, achieving coverage of wafer processing for technology nodes of 28nm and above by 2024. The company is also actively seeking client validation for its next-generation ultra-high-capacity coating and developing machine architecture [5][6]. - The company has received substantial orders for its physical cleaning machines and has launched a new chemical cleaning machine that meets high-temperature SPM process requirements, which has been validated by clients and is expected to drive future growth [5][6]. - The recovery of the packaging market is driving high growth in demand for the company's back-end equipment, with continuous orders from domestic and international clients [6][8]. Financial Summary - The company’s revenue is projected to grow from 1,754 million RMB in 2024 to 4,029 million RMB in 2027, with a compound annual growth rate (CAGR) of approximately 38.07% [7]. - The net profit attributable to the parent company is expected to recover from a decline in 2024 to 693 million RMB by 2027, reflecting a significant growth rate of 68.71% [7][11]. - The company’s earnings per share (EPS) is forecasted to increase from 1.01 RMB in 2024 to 3.44 RMB in 2027, indicating strong profitability growth [7][10]. Control and Synergy - Northern Huachuang has gained control over the company, which is expected to inject new momentum into its development. This control is anticipated to enhance collaboration in equipment processes and provide a more comprehensive and efficient solution for clients [8].
2025年中国半导体封装设备行业相关政策、产业链、发展现状、竞争格局及未来趋势研判:半导体产业蓬勃发展,一季度半导体封装设备销售额约75亿元[图]
Chan Ye Xin Xi Wang· 2025-07-22 01:21
Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]
芯源微:力争在前道化学清洗赛道实现跨越式发展,打造第二增长极
Zheng Quan Shi Bao Wang· 2025-07-17 12:45
Group 1 - Company conducted investor relations activities from July 10 to July 16, receiving various institutional investors [1] - Company specializes in the R&D, production, and sales of semiconductor equipment, with a product range that includes photoresist coating and developing equipment, single-wafer wet processing equipment, and more [1] - Company has established four main business segments: front-end coating and developing equipment, front-end cleaning equipment, back-end advanced packaging equipment, and small-size compound semiconductor equipment [1] Group 2 - Company focuses on the integrated circuit sector, with three main business pillars: front-end coating and developing, front-end cleaning, and back-end advanced packaging [2] - Company aims to expand its customer base in regions such as Taiwan, South Korea, and Southeast Asia while maintaining existing clients [1][2] - Company’s new generation coating and developing machine features a six-layer symmetrical architecture, enhancing scheduling efficiency to meet future high-end lithography machine capacity needs [2] Group 3 - Company acknowledges the technological gap with foreign competitors but is committed to increasing R&D investment to enhance product competitiveness [2] - Company aims for rapid growth in front-end chemical cleaning products, establishing a second growth driver for long-term development [2] - Northern Huachuang has become the controlling shareholder of the company, holding approximately 17.87% of its total shares and nominating a majority of the board members [2][3] Group 4 - The collaboration between the company and Northern Huachuang is expected to create synergies, allowing for integrated solutions in the integrated circuit equipment sector [3] - Both companies have complementary product offerings, which can enhance their market position and operational efficiency [3] - The partnership may lead to improved collaboration in R&D, supply chain management, and customer resource sharing [3]
中证1000信息技术指数报9130.36点,前十大权重包含欧菲光等
Jin Rong Jie· 2025-07-11 08:37
Group 1 - The core index of the CSI 1000 Information Technology Index is reported at 9130.36 points, with a one-month increase of 6.25%, a three-month increase of 11.71%, and a year-to-date increase of 7.69% [1] - The CSI 1000 Index series selects liquid and representative securities from each industry, forming 10 industry indices to provide diversified investment targets [1] - The top ten holdings of the CSI 1000 Information Technology Index include: O-film (2.69%), Huahong Semiconductor (1.54%), Heertai (1.42%), Siwei Tuxin (1.39%), Sifang Jichuang (1.33%), Jingfang Technology (1.27%), Chipone (1.25%), Weining Health (1.24%), Anji Technology (1.24%), and Tuobang Co. (1.2%) [1] Group 2 - The market share of the CSI 1000 Information Technology Index holdings is 57.12% from the Shenzhen Stock Exchange and 42.88% from the Shanghai Stock Exchange [1] - The industry composition of the index holdings includes: Software Development (24.50%), Integrated Circuits (19.58%), Optical Electronics (14.73%), IT Services (12.38%), Semiconductor Materials and Equipment (9.51%), Electronic Components (7.54%), Electronic Terminals and Components (7.10%), Other Electronics (2.08%), Electronic Chemicals (1.84%), and Discrete Devices (0.73%) [2] - The index sample is adjusted every six months, with adjustments implemented on the next trading day after the second Friday of June and December, and temporary adjustments may occur under special circumstances [2]